JP2012119678A5 - - Google Patents

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Publication number
JP2012119678A5
JP2012119678A5 JP2011253263A JP2011253263A JP2012119678A5 JP 2012119678 A5 JP2012119678 A5 JP 2012119678A5 JP 2011253263 A JP2011253263 A JP 2011253263A JP 2011253263 A JP2011253263 A JP 2011253263A JP 2012119678 A5 JP2012119678 A5 JP 2012119678A5
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JP
Japan
Prior art keywords
dielectric material
dielectric
low
poly
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011253263A
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English (en)
Japanese (ja)
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JP2012119678A (ja
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Publication date
Priority claimed from US12/957,461 external-priority patent/US8821962B2/en
Application filed filed Critical
Publication of JP2012119678A publication Critical patent/JP2012119678A/ja
Publication of JP2012119678A5 publication Critical patent/JP2012119678A5/ja
Pending legal-status Critical Current

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JP2011253263A 2010-12-01 2011-11-18 誘電性組成物 Pending JP2012119678A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/957,461 US8821962B2 (en) 2010-12-01 2010-12-01 Method of forming dielectric layer with a dielectric composition
US12/957,461 2010-12-01

Publications (2)

Publication Number Publication Date
JP2012119678A JP2012119678A (ja) 2012-06-21
JP2012119678A5 true JP2012119678A5 (enExample) 2014-12-25

Family

ID=46152595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011253263A Pending JP2012119678A (ja) 2010-12-01 2011-11-18 誘電性組成物

Country Status (3)

Country Link
US (1) US8821962B2 (enExample)
JP (1) JP2012119678A (enExample)
CN (1) CN102487125B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6647780B2 (ja) * 2014-10-27 2020-02-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 有機金属材料および方法
GB2534600A (en) * 2015-01-29 2016-08-03 Cambridge Display Tech Ltd Organic thin film transistors
WO2018060015A1 (en) 2016-09-27 2018-04-05 Basf Se Star-shaped styrene polymers with enhanced glass transition temperature
CN107915910A (zh) * 2017-11-15 2018-04-17 苏州科茂电子材料科技有限公司 添加聚异丁烯的介电材料制备方法
US20200031040A1 (en) * 2018-07-24 2020-01-30 Xerox Corporation Printing process and system
CN113410384B (zh) * 2021-06-28 2023-04-07 西南大学 一种用于柔性场效应晶体管的聚合物介电层的制备方法
CN114806035B (zh) * 2022-05-09 2024-04-19 深圳市嘉凯勒实业有限公司 一种poss-酞菁铜介电单体改性聚苯乙烯材料的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8418591D0 (en) * 1984-07-20 1984-08-22 Bp Chem Int Ltd Polymer composition
JPH0618986B2 (ja) * 1987-10-19 1994-03-16 信越化学工業株式会社 硬化性エポキシ樹脂組成物
CA2049019A1 (en) * 1989-03-01 1990-09-02 Robert S. Dubrow Method of curing organopolysiloxane compositions and compositions and articles therefrom
EP0695116B1 (en) * 1994-07-29 2004-01-28 World Properties, Inc. Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability
DE19535603A1 (de) * 1995-09-25 1997-03-27 Basf Lacke & Farben 3-Komponenten-Beschichtungsmittel mit hoher Lösemittelbeständigkeit und hoher Abklebfestigkeit
US6440642B1 (en) * 1999-09-15 2002-08-27 Shipley Company, L.L.C. Dielectric composition
DE102004005247A1 (de) * 2004-01-28 2005-09-01 Infineon Technologies Ag Imprint-Lithographieverfahren
WO2006009942A1 (en) * 2004-06-21 2006-01-26 Exxonmobil Chemical Patents Inc. Polymerization process
US7754510B2 (en) * 2007-04-02 2010-07-13 Xerox Corporation Phase-separated dielectric structure fabrication process
CN101525511B (zh) * 2008-03-07 2011-06-22 财团法人工业技术研究院 可硬化交联型的墨水组合物及介电薄膜
US8154080B2 (en) * 2008-12-05 2012-04-10 Xerox Corporation Dielectric structure having lower-k and higher-k materials
JP2010245379A (ja) * 2009-04-08 2010-10-28 Hitachi Chem Co Ltd 絶縁体インク、絶縁被覆層の作製方法及び半導体装置

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