JP2010021534A5 - - Google Patents

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Publication number
JP2010021534A5
JP2010021534A5 JP2009134374A JP2009134374A JP2010021534A5 JP 2010021534 A5 JP2010021534 A5 JP 2010021534A5 JP 2009134374 A JP2009134374 A JP 2009134374A JP 2009134374 A JP2009134374 A JP 2009134374A JP 2010021534 A5 JP2010021534 A5 JP 2010021534A5
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JP
Japan
Prior art keywords
wiring
sheet
region
conductive material
impregnated
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JP2009134374A
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Japanese (ja)
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JP2010021534A (ja
JP5639749B2 (ja
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Priority claimed from JP2009134374A external-priority patent/JP5639749B2/ja
Publication of JP2010021534A publication Critical patent/JP2010021534A/ja
Publication of JP2010021534A5 publication Critical patent/JP2010021534A5/ja
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Publication of JP5639749B2 publication Critical patent/JP5639749B2/ja
Expired - Fee Related legal-status Critical Current
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JP2009134374A 2008-06-10 2009-06-03 半導体装置の作製方法 Expired - Fee Related JP5639749B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009134374A JP5639749B2 (ja) 2008-06-10 2009-06-03 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008151227 2008-06-10
JP2008151227 2008-06-10
JP2009134374A JP5639749B2 (ja) 2008-06-10 2009-06-03 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2010021534A JP2010021534A (ja) 2010-01-28
JP2010021534A5 true JP2010021534A5 (enExample) 2012-07-12
JP5639749B2 JP5639749B2 (ja) 2014-12-10

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Family Applications (1)

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JP2009134374A Expired - Fee Related JP5639749B2 (ja) 2008-06-10 2009-06-03 半導体装置の作製方法

Country Status (3)

Country Link
US (1) US8044499B2 (enExample)
JP (1) JP5639749B2 (enExample)
KR (1) KR101594316B1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057488B (zh) * 2008-06-06 2013-09-18 株式会社半导体能源研究所 半导体装置的制造方法
US8563397B2 (en) 2008-07-09 2013-10-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN102160179B (zh) 2008-09-19 2014-05-14 株式会社半导体能源研究所 半导体装置及其制造方法
JP5583951B2 (ja) * 2008-11-11 2014-09-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8345435B2 (en) * 2009-08-07 2013-01-01 Semiconductor Energy Laboratory Co., Ltd. Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof
TWI517268B (zh) * 2009-08-07 2016-01-11 半導體能源研究所股份有限公司 端子構造的製造方法和電子裝置的製造方法
JP5719560B2 (ja) * 2009-10-21 2015-05-20 株式会社半導体エネルギー研究所 端子構造の作製方法
TWI473551B (zh) * 2011-07-08 2015-02-11 欣興電子股份有限公司 封裝基板及其製法
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
HUE029702T2 (en) * 2013-10-17 2017-03-28 Das Energy Gmbh Photovoltaic panel and process for its production
US20150122532A1 (en) * 2013-11-04 2015-05-07 Teledyne Technologies Incorporated High temperature multilayer flexible printed wiring board
JP5898391B1 (ja) * 2014-07-28 2016-04-06 東邦テナックス株式会社 プリプレグおよび繊維強化複合材料
CN108235600B (zh) * 2017-12-28 2019-07-12 广州兴森快捷电路科技有限公司 印刷线路板的制备方法

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Publication number Priority date Publication date Assignee Title
JPS60200590A (ja) * 1984-03-24 1985-10-11 ダイソー株式会社 印刷回路基板及びその製法
JPH06200590A (ja) * 1992-12-29 1994-07-19 Sekisui House Ltd 間仕切パネル
JP3402400B2 (ja) * 1994-04-22 2003-05-06 株式会社半導体エネルギー研究所 半導体集積回路の作製方法
JPH1092980A (ja) 1996-09-13 1998-04-10 Toshiba Corp 無線カードおよびその製造方法
JPH10256687A (ja) * 1997-03-14 1998-09-25 Matsushita Electric Ind Co Ltd ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板
US6224965B1 (en) 1999-06-25 2001-05-01 Honeywell International Inc. Microfiber dielectrics which facilitate laser via drilling
JP2001024081A (ja) * 1999-07-08 2001-01-26 Toshiba Corp 導電基体及びその製造方法
JP4423779B2 (ja) 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
US8415208B2 (en) 2001-07-16 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
CN100380673C (zh) 2001-11-09 2008-04-09 株式会社半导体能源研究所 发光设备及其制造方法
KR100430001B1 (ko) 2001-12-18 2004-05-03 엘지전자 주식회사 다층기판의 제조방법, 그 다층기판의 패드 형성방법 및 그다층기판을 이용한 반도체 패키지의 제조방법
US7485489B2 (en) * 2002-06-19 2009-02-03 Bjoersell Sten Electronics circuit manufacture
WO2004001848A1 (en) 2002-06-19 2003-12-31 Sten Bjorsell Electronics circuit manufacture
CN100477891C (zh) * 2003-01-16 2009-04-08 富士通株式会社 多层布线基板及其制造方法、纤维强化树脂基板制造方法
JP4540359B2 (ja) 2004-02-10 2010-09-08 シャープ株式会社 半導体装置およびその製造方法
US20050233122A1 (en) 2004-04-19 2005-10-20 Mikio Nishimura Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
WO2005119781A1 (en) 2004-06-02 2005-12-15 Semiconductor Energy Laboratory Co., Ltd. Laminating system
JP4693619B2 (ja) * 2004-12-17 2011-06-01 株式会社半導体エネルギー研究所 導電層を有する基板の作製方法及び半導体装置の作製方法
JP2007091822A (ja) 2005-09-27 2007-04-12 Shin Kobe Electric Mach Co Ltd プリプレグ
US8212953B2 (en) 2005-12-26 2012-07-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5296360B2 (ja) 2006-10-04 2013-09-25 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
WO2008041716A1 (en) 2006-10-04 2008-04-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1970951A3 (en) 2007-03-13 2009-05-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
EP1976001A3 (en) 2007-03-26 2012-08-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
WO2009139282A1 (en) 2008-05-12 2009-11-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP5473413B2 (ja) 2008-06-20 2014-04-16 株式会社半導体エネルギー研究所 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法

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