JP2012119679A5 - - Google Patents
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- Publication number
- JP2012119679A5 JP2012119679A5 JP2011253306A JP2011253306A JP2012119679A5 JP 2012119679 A5 JP2012119679 A5 JP 2012119679A5 JP 2011253306 A JP2011253306 A JP 2011253306A JP 2011253306 A JP2011253306 A JP 2011253306A JP 2012119679 A5 JP2012119679 A5 JP 2012119679A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- silane group
- silsesquioxane
- silicon
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/957,445 | 2010-12-01 | ||
| US12/957,445 US8623447B2 (en) | 2010-12-01 | 2010-12-01 | Method for coating dielectric composition for fabricating thin-film transistors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012119679A JP2012119679A (ja) | 2012-06-21 |
| JP2012119679A5 true JP2012119679A5 (enExample) | 2015-01-08 |
| JP5775426B2 JP5775426B2 (ja) | 2015-09-09 |
Family
ID=46083117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011253306A Expired - Fee Related JP5775426B2 (ja) | 2010-12-01 | 2011-11-18 | 電子機器を製造するプロセス |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8623447B2 (enExample) |
| JP (1) | JP5775426B2 (enExample) |
| DE (1) | DE102011087561B4 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325943A (zh) * | 2013-05-16 | 2013-09-25 | 京东方科技集团股份有限公司 | 一种有机薄膜晶体管及其制备方法 |
| WO2015076358A1 (ja) * | 2013-11-21 | 2015-05-28 | 株式会社ニコン | 配線パターンの製造方法およびトランジスタの製造方法 |
| KR101680433B1 (ko) * | 2014-11-25 | 2016-11-29 | 순천대학교 산학협력단 | 롤대롤 그라비아 인쇄기반 박막트랜지스터 제조방법, 박막트랜지스터 백플랜 제조방법, 백플랜 압력센서 및 스마트 장판의 제조방법 |
| US10115785B1 (en) | 2017-06-01 | 2018-10-30 | Xerox Corporation | Memory cells and devices |
| JP6926939B2 (ja) * | 2017-10-23 | 2021-08-25 | 東京エレクトロン株式会社 | 半導体装置の製造方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0695116B1 (en) * | 1994-07-29 | 2004-01-28 | World Properties, Inc. | Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability |
| US6107117A (en) | 1996-12-20 | 2000-08-22 | Lucent Technologies Inc. | Method of making an organic thin film transistor |
| US5883219A (en) | 1997-05-29 | 1999-03-16 | International Business Machines Corporation | Integrated circuit device and process for its manufacture |
| US6528218B1 (en) | 1998-12-15 | 2003-03-04 | International Business Machines Corporation | Method of fabricating circuitized structures |
| US6890448B2 (en) * | 1999-06-11 | 2005-05-10 | Shipley Company, L.L.C. | Antireflective hard mask compositions |
| US6440642B1 (en) | 1999-09-15 | 2002-08-27 | Shipley Company, L.L.C. | Dielectric composition |
| US6621099B2 (en) | 2002-01-11 | 2003-09-16 | Xerox Corporation | Polythiophenes and devices thereof |
| US6949762B2 (en) | 2002-01-11 | 2005-09-27 | Xerox Corporation | Polythiophenes and devices thereof |
| US6770904B2 (en) | 2002-01-11 | 2004-08-03 | Xerox Corporation | Polythiophenes and electronic devices generated therefrom |
| KR100913879B1 (ko) | 2002-01-28 | 2009-08-26 | 제이에스알 가부시끼가이샤 | 감광성 유전체 형성용 조성물, 및 그것을 이용한 전사필름, 유전체 및 전자 부품 |
| US6528409B1 (en) | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| US20030227014A1 (en) | 2002-06-11 | 2003-12-11 | Xerox Corporation. | Process for forming semiconductor layer of micro-and nano-electronic devices |
| US7041748B2 (en) * | 2003-01-08 | 2006-05-09 | International Business Machines Corporation | Patternable low dielectric constant materials and their use in ULSI interconnection |
| JP4272441B2 (ja) * | 2003-02-05 | 2009-06-03 | 株式会社リコー | 有機能動素子及びそれを有する表示素子 |
| DE10329262B3 (de) | 2003-06-23 | 2004-12-16 | Infineon Technologies Ag | Verfahren zur Behandlung eines Substrates und ein Halbleiterbauelement |
| DE10330022A1 (de) * | 2003-07-03 | 2005-01-20 | Degussa Ag | Verfahren zur Herstellung von Iow-k dielektrischen Filmen |
| US7223517B2 (en) * | 2003-08-05 | 2007-05-29 | International Business Machines Corporation | Lithographic antireflective hardmask compositions and uses thereof |
| DE10340609A1 (de) | 2003-08-29 | 2005-04-07 | Infineon Technologies Ag | Polymerformulierung und Verfahren zur Herstellung einer Dielektrikumsschicht |
| DE102004005247A1 (de) * | 2004-01-28 | 2005-09-01 | Infineon Technologies Ag | Imprint-Lithographieverfahren |
| US20050215713A1 (en) | 2004-03-26 | 2005-09-29 | Hessell Edward T | Method of producing a crosslinked coating in the manufacture of integrated circuits |
| US7282735B2 (en) | 2005-03-31 | 2007-10-16 | Xerox Corporation | TFT having a fluorocarbon-containing layer |
| JP5087807B2 (ja) * | 2006-02-22 | 2012-12-05 | 東京応化工業株式会社 | 有機半導体素子の製造方法及びそれに用いる絶縁膜形成用組成物 |
| JPWO2008047654A1 (ja) * | 2006-10-12 | 2010-02-25 | 積水化学工業株式会社 | 膜形成用組成物、これを用いたパターン膜の製造方法及び電子機器用絶縁膜 |
| US7754510B2 (en) * | 2007-04-02 | 2010-07-13 | Xerox Corporation | Phase-separated dielectric structure fabrication process |
| US7795614B2 (en) * | 2007-04-02 | 2010-09-14 | Xerox Corporation | Device with phase-separated dielectric structure |
| US20090093114A1 (en) | 2007-10-09 | 2009-04-09 | Sean David Burns | Method of forming a dual-damascene structure using an underlayer |
| US8859673B2 (en) * | 2008-02-25 | 2014-10-14 | Honeywell International, Inc. | Processable inorganic and organic polymer formulations, methods of production and uses thereof |
| US8154080B2 (en) * | 2008-12-05 | 2012-04-10 | Xerox Corporation | Dielectric structure having lower-k and higher-k materials |
| JP5533232B2 (ja) * | 2009-06-29 | 2014-06-25 | Jsr株式会社 | ポジ型感放射線性組成物、硬化膜、層間絶縁膜、層間絶縁膜の形成方法、表示素子、及び層間絶縁膜形成用のシロキサンポリマー |
| US8163658B2 (en) * | 2009-08-24 | 2012-04-24 | International Business Machines Corporation | Multiple patterning using improved patternable low-k dielectric materials |
| KR20120057467A (ko) * | 2010-11-26 | 2012-06-05 | 삼성전자주식회사 | 실리콘 변성 그룹을 갖는 감광성 폴리이미드, 이를 포함하는 접착 조성물 및 반도체 패키지 |
-
2010
- 2010-12-01 US US12/957,445 patent/US8623447B2/en active Active
-
2011
- 2011-11-18 JP JP2011253306A patent/JP5775426B2/ja not_active Expired - Fee Related
- 2011-12-01 DE DE102011087561.1A patent/DE102011087561B4/de not_active Expired - Fee Related
-
2013
- 2013-12-27 US US14/142,035 patent/US9058981B2/en active Active
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