JP2012114400A5 - - Google Patents
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- JP2012114400A5 JP2012114400A5 JP2011117724A JP2011117724A JP2012114400A5 JP 2012114400 A5 JP2012114400 A5 JP 2012114400A5 JP 2011117724 A JP2011117724 A JP 2011117724A JP 2011117724 A JP2011117724 A JP 2011117724A JP 2012114400 A5 JP2012114400 A5 JP 2012114400A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- manufacturing
- wiring board
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011117724A JP5608605B2 (ja) | 2010-11-05 | 2011-05-26 | 配線基板の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010248328 | 2010-11-05 | ||
| JP2010248328 | 2010-11-05 | ||
| JP2011117724A JP5608605B2 (ja) | 2010-11-05 | 2011-05-26 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012114400A JP2012114400A (ja) | 2012-06-14 |
| JP2012114400A5 true JP2012114400A5 (enrdf_load_stackoverflow) | 2014-04-10 |
| JP5608605B2 JP5608605B2 (ja) | 2014-10-15 |
Family
ID=46498251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011117724A Expired - Fee Related JP5608605B2 (ja) | 2010-11-05 | 2011-05-26 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5608605B2 (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014069662A1 (ja) | 2012-11-05 | 2014-05-08 | 大日本印刷株式会社 | 配線構造体 |
| JP2014236102A (ja) * | 2013-05-31 | 2014-12-15 | 凸版印刷株式会社 | 貫通電極付き配線基板、その製造方法及び半導体装置 |
| KR20150049515A (ko) * | 2013-10-30 | 2015-05-08 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| TWI670803B (zh) * | 2014-03-31 | 2019-09-01 | 日商凸版印刷股份有限公司 | 中介層、半導體裝置、中介層的製造方法及半導體裝置的製造方法 |
| JP2015198093A (ja) * | 2014-03-31 | 2015-11-09 | 凸版印刷株式会社 | インターポーザー、半導体装置、インターポーザーの製造方法、半導体装置の製造方法 |
| JP6539992B2 (ja) * | 2014-11-14 | 2019-07-10 | 凸版印刷株式会社 | 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法 |
| CN105657987B (zh) * | 2014-12-03 | 2019-05-21 | 北大方正集团有限公司 | 板材塞孔方法和电路板 |
| JP2017107934A (ja) * | 2015-12-08 | 2017-06-15 | 富士通株式会社 | 回路基板、電子機器、及び回路基板の製造方法 |
| KR102039887B1 (ko) * | 2017-12-13 | 2019-12-05 | 엘비세미콘 주식회사 | 양면 도금 공정을 이용한 반도체 패키지의 제조방법 |
| JP6828733B2 (ja) * | 2018-12-25 | 2021-02-10 | 凸版印刷株式会社 | インターポーザー、半導体装置、インターポーザーの製造方法、半導体装置の製造方法 |
| IT201900006736A1 (it) * | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
| US11862546B2 (en) | 2019-11-27 | 2024-01-02 | Applied Materials, Inc. | Package core assembly and fabrication methods |
| US11257790B2 (en) | 2020-03-10 | 2022-02-22 | Applied Materials, Inc. | High connectivity device stacking |
| KR102442256B1 (ko) * | 2020-11-05 | 2022-09-08 | 성균관대학교산학협력단 | 보이드가 없는 실리콘 관통전극의 제조방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63232487A (ja) * | 1987-03-20 | 1988-09-28 | 日本電気株式会社 | 印刷配線板の製造方法 |
| JPH0423488A (ja) * | 1990-05-18 | 1992-01-27 | Hitachi Ltd | プリント基板の製造方法 |
| JPH06260757A (ja) * | 1993-03-05 | 1994-09-16 | Meikoo:Kk | プリント回路板の製造方法 |
| JP2006237431A (ja) * | 2005-02-28 | 2006-09-07 | New Japan Radio Co Ltd | セラミック基板の製造方法 |
| JP2007095743A (ja) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Works Ltd | 貫通孔配線及びその製造方法 |
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2011
- 2011-05-26 JP JP2011117724A patent/JP5608605B2/ja not_active Expired - Fee Related