JP2012102315A - 多層配線基板用難燃性樹脂組成物及びこれを含む多層配線基板 - Google Patents
多層配線基板用難燃性樹脂組成物及びこれを含む多層配線基板 Download PDFInfo
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- JP2012102315A JP2012102315A JP2011138192A JP2011138192A JP2012102315A JP 2012102315 A JP2012102315 A JP 2012102315A JP 2011138192 A JP2011138192 A JP 2011138192A JP 2011138192 A JP2011138192 A JP 2011138192A JP 2012102315 A JP2012102315 A JP 2012102315A
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- epoxy resin
- multilayer wiring
- weight
- wiring board
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 239000003063 flame retardant Substances 0.000 title claims abstract description 69
- 239000011342 resin composition Substances 0.000 title claims abstract description 43
- 239000003822 epoxy resin Substances 0.000 claims abstract description 101
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 101
- 239000004593 Epoxy Substances 0.000 claims abstract description 49
- 239000002131 composite material Substances 0.000 claims abstract description 34
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229930003836 cresol Natural products 0.000 claims abstract description 23
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 18
- 239000011574 phosphorus Substances 0.000 claims abstract description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 14
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 26
- 239000011256 inorganic filler Substances 0.000 claims description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- 229940106691 bisphenol a Drugs 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- XMNDMAQKWSQVOV-UHFFFAOYSA-N (2-methylphenyl) diphenyl phosphate Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 XMNDMAQKWSQVOV-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical group CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- -1 imidazole compound Chemical class 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
12 絶縁層
21 第1回路パターン
22 第2回路パターン
Claims (17)
- 前記ナフタレン変形エポキシ樹脂は平均エポキシ当量が100から600で、前記クレゾールノボラックエポキシ樹脂は平均エポキシ当量が300から600で、前記ゴム変性型エポキシ樹脂は平均エポキシ当量が100から500で、前記リン系エポキシ樹脂は平均エポキシ当量が400から800である、請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 前記ナフタレン変形エポキシ樹脂100重量部に対し、前記クレゾールノボラックエポキシ樹脂の含量は1から100重量部で、前記ゴム変性型エポキシ樹脂の含量は1から100重量部で、前記リン系エポキシ樹脂の含量は1から100重量部である、請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 前記難燃剤は前記複合エポキシ樹脂100重量部に対し、0.1から3重量部である、請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 軟化点が100から140℃で、水酸基当量が100から150のエポキシ硬化用硬化剤をさらに含む請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 前記エポキシ硬化用硬化剤は、前記複合エポキシ樹脂のエポキシ基と前記エポキシ硬化用硬化剤の水酸基の比率が1:0.2から1:1で含まれる、請求項5に記載の多層配線基板用難燃性樹脂組成物。
- 前記複合エポキシ樹脂100重量部に対し、硬化促進剤0.1から1重量部をさらに含む、請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 前記複合エポキシ樹脂100重量部に対し、10から40重量部の無機充填剤をさらに含む、請求項1に記載の多層配線基板用難燃性樹脂組成物。
- 前記ナフタレン変形エポキシ樹脂は平均エポキシ当量が100から600で、前記クレゾールノボラックエポキシ樹脂は平均エポキシ当量が300から600で、前記ゴム変性型エポキシ樹脂は平均エポキシ当量が100から500で、前記リン系エポキシ樹脂は平均エポキシ当量が400から800である、請求項9に記載の多層配線基板。
- 前記ナフタレン変形エポキシ樹脂100重量部に対し、前記クレゾールノボラックエポキシ樹脂の含量は1から100重量部で、前記ゴム変性型エポキシ樹脂の含量は1から100重量部で、前記リン系エポキシ樹脂の含量は1から100重量部である、請求項9に記載の多層配線基板。
- 前記難燃剤は前記複合エポキシ樹脂100重量部に対し、0.1から3重量部である、請求項9に記載の多層配線基板。
- 前記難燃性樹脂組成物は軟化点が100から140℃で、水酸基当量が100から150のエポキシ硬化用硬化剤をさらに含む、請求項9に記載の多層配線基板。
- 前記エポキシ硬化用硬化剤は、前記複合エポキシ樹脂のエポキシ基と前記エポキシ硬化用硬化剤の水酸基の比率が1:0.2から1:1で含まれる、請求項14に記載の多層配線基板。
- 前記複合エポキシ樹脂100重量部に対し、硬化促進剤0.1から1重量部をさらに含む、請求項9に記載の多層配線基板。
- 前記複合エポキシ樹脂100重量部に対し、10から40重量部の無機充填剤をさらに含む、請求項9に記載の多層配線基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2010-0109967 | 2010-11-05 | ||
KR1020100109967A KR101228734B1 (ko) | 2010-11-05 | 2010-11-05 | 다층배선기판용 난연성 수지 조성물 및 이를 포함하는 다층배선기판 |
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JP2012102315A true JP2012102315A (ja) | 2012-05-31 |
JP5345656B2 JP5345656B2 (ja) | 2013-11-20 |
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JP2011138192A Expired - Fee Related JP5345656B2 (ja) | 2010-11-05 | 2011-06-22 | 多層配線基板用難燃性樹脂組成物及びこれを含む多層配線基板 |
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US (1) | US8309636B2 (ja) |
JP (1) | JP5345656B2 (ja) |
KR (1) | KR101228734B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013065817A (ja) * | 2011-09-16 | 2013-04-11 | Samsung Electro-Mechanics Co Ltd | 印刷回路基板の製造方法 |
JP2014009356A (ja) * | 2012-06-29 | 2014-01-20 | Samsung Electro-Mechanics Co Ltd | エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板 |
JP2014051645A (ja) * | 2012-09-04 | 2014-03-20 | Samsung Electro-Mechanics Co Ltd | 多層印刷回路基板の絶縁組成物 |
Families Citing this family (3)
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KR101477353B1 (ko) * | 2012-11-09 | 2014-12-29 | 주식회사 두산 | 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체 |
CN105479880B (zh) * | 2015-12-06 | 2017-09-12 | 安徽国风塑业股份有限公司 | 一种高耐击穿、阻燃双向拉伸聚酯薄膜及其制备方法 |
CN210629966U (zh) * | 2019-09-30 | 2020-05-26 | 惠州市荣光电子科技有限公司 | 一种具有防潮结构的线路板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001254001A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
JP2008095105A (ja) * | 2006-10-11 | 2008-04-24 | Samsung Electro Mech Co Ltd | 印刷回路基板用難燃性樹脂組成物及びそれを用いた印刷回路基板 |
JP2009263550A (ja) * | 2008-04-28 | 2009-11-12 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグおよび積層板 |
JP2010047726A (ja) * | 2008-08-25 | 2010-03-04 | Dic Corp | エポキシ樹脂組成物、その硬化物、プリプレグ、銅張積層板、及びビルドアップ接着フィルム用樹脂組成物 |
JP2010251700A (ja) * | 2009-04-16 | 2010-11-04 | Samsung Electro-Mechanics Co Ltd | 剥離強度が強化された印刷回路基板用難燃性樹脂組成物、これを用いた印刷回路基板およびその製造方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0680598A (ja) | 1992-08-31 | 1994-03-22 | Dai Ichi Kogyo Seiyaku Co Ltd | ポリヒドロキシナフタレン系化合物及びエポキシ樹脂組成物 |
JP3139857B2 (ja) | 1992-11-13 | 2001-03-05 | 三井化学株式会社 | ヒドロキシナフタレン共重合体のエポキシ化物、その製造方法および用途 |
JP2001151995A (ja) | 1999-11-30 | 2001-06-05 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物およびそれを用いた絶縁樹脂シート |
TW587094B (en) * | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
JP4231976B2 (ja) * | 2000-03-30 | 2009-03-04 | 日本ゼオン株式会社 | 硬化性組成物及び多層回路基板 |
JP2002241473A (ja) | 2001-02-16 | 2002-08-28 | Taiyo Ink Mfg Ltd | 熱硬化性エポキシ樹脂組成物とその成形体および多層プリント配線板 |
JP2005244150A (ja) * | 2004-01-28 | 2005-09-08 | Ajinomoto Co Inc | 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板 |
KR100771331B1 (ko) * | 2006-05-16 | 2007-10-29 | 삼성전기주식회사 | 에폭시 수지 조성물 및 이를 이용한 인쇄회로기판 |
JP2009295689A (ja) | 2008-06-03 | 2009-12-17 | Showa Highpolymer Co Ltd | 多層プリント配線板用接着フィルム |
-
2010
- 2010-11-05 KR KR1020100109967A patent/KR101228734B1/ko active IP Right Grant
-
2011
- 2011-06-16 US US13/161,760 patent/US8309636B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001254001A (ja) * | 2000-03-09 | 2001-09-18 | Sumitomo Bakelite Co Ltd | 難燃性樹脂組成物、これを用いたプリプレグ及び積層板 |
JP2008095105A (ja) * | 2006-10-11 | 2008-04-24 | Samsung Electro Mech Co Ltd | 印刷回路基板用難燃性樹脂組成物及びそれを用いた印刷回路基板 |
JP2009263550A (ja) * | 2008-04-28 | 2009-11-12 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグおよび積層板 |
JP2010047726A (ja) * | 2008-08-25 | 2010-03-04 | Dic Corp | エポキシ樹脂組成物、その硬化物、プリプレグ、銅張積層板、及びビルドアップ接着フィルム用樹脂組成物 |
JP2010251700A (ja) * | 2009-04-16 | 2010-11-04 | Samsung Electro-Mechanics Co Ltd | 剥離強度が強化された印刷回路基板用難燃性樹脂組成物、これを用いた印刷回路基板およびその製造方法 |
Non-Patent Citations (1)
Title |
---|
JPN7013000924; 越智光一: 電子部材用途におけるエポキシ樹脂 , 20060131, 14頁, シーエムシー株式会社 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013065817A (ja) * | 2011-09-16 | 2013-04-11 | Samsung Electro-Mechanics Co Ltd | 印刷回路基板の製造方法 |
JP2014009356A (ja) * | 2012-06-29 | 2014-01-20 | Samsung Electro-Mechanics Co Ltd | エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板 |
JP2014051645A (ja) * | 2012-09-04 | 2014-03-20 | Samsung Electro-Mechanics Co Ltd | 多層印刷回路基板の絶縁組成物 |
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KR101228734B1 (ko) | 2013-02-01 |
JP5345656B2 (ja) | 2013-11-20 |
US20120111618A1 (en) | 2012-05-10 |
KR20120048368A (ko) | 2012-05-15 |
US8309636B2 (en) | 2012-11-13 |
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