JP2012046781A - 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 - Google Patents
高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 Download PDFInfo
- Publication number
- JP2012046781A JP2012046781A JP2010188148A JP2010188148A JP2012046781A JP 2012046781 A JP2012046781 A JP 2012046781A JP 2010188148 A JP2010188148 A JP 2010188148A JP 2010188148 A JP2010188148 A JP 2010188148A JP 2012046781 A JP2012046781 A JP 2012046781A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- copper plating
- plating film
- electroless
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 110
- 239000010949 copper Substances 0.000 title claims abstract description 96
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 94
- 238000007747 plating Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 49
- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 44
- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 44
- -1 polytetrafluoroethylene Polymers 0.000 title claims abstract description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 22
- 239000000243 solution Substances 0.000 claims abstract description 22
- 239000001307 helium Substances 0.000 claims abstract description 17
- 229910052734 helium Inorganic materials 0.000 claims abstract description 17
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 12
- 239000007864 aqueous solution Substances 0.000 claims abstract description 11
- 238000007772 electroless plating Methods 0.000 claims abstract description 9
- 239000003054 catalyst Substances 0.000 claims abstract description 4
- 150000002940 palladium Chemical class 0.000 claims abstract description 4
- 230000001603 reducing effect Effects 0.000 claims abstract description 4
- 239000002094 self assembled monolayer Substances 0.000 claims abstract 4
- 239000013545 self-assembled monolayer Substances 0.000 claims abstract 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000007822 coupling agent Substances 0.000 claims description 9
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 9
- 230000001235 sensitizing effect Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical group CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 19
- 238000009832 plasma treatment Methods 0.000 abstract description 11
- 230000004913 activation Effects 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000002209 hydrophobic effect Effects 0.000 abstract description 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 47
- 238000000077 Auger electron appearance potential spectroscopy Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 13
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 11
- 239000012153 distilled water Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000001228 spectrum Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000003277 amino group Chemical group 0.000 description 5
- 239000012159 carrier gas Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 208000028659 discharge Diseases 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002120 nanofilm Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- AHYFYQKMYMKPKD-UHFFFAOYSA-N 3-ethoxysilylpropan-1-amine Chemical compound CCO[SiH2]CCCN AHYFYQKMYMKPKD-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 241001147149 Lucina Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000002453 shampoo Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188148A JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188148A JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012046781A true JP2012046781A (ja) | 2012-03-08 |
| JP2012046781A5 JP2012046781A5 (enrdf_load_stackoverflow) | 2013-08-29 |
Family
ID=45901966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010188148A Pending JP2012046781A (ja) | 2010-08-25 | 2010-08-25 | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012046781A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015122448A (ja) * | 2013-12-24 | 2015-07-02 | 住友電工プリントサーキット株式会社 | フッ素樹脂基材、プリント配線板、生体情報測定デバイス及び人工臓器 |
| CN106567114A (zh) * | 2016-11-02 | 2017-04-19 | 华南理工大学 | 一种abs塑料表面喷涂活化的电镀方法 |
| JP2018123261A (ja) * | 2017-02-02 | 2018-08-09 | 株式会社電子技研 | 樹脂および樹脂の製造方法 |
| JPWO2018147205A1 (ja) * | 2017-02-13 | 2019-02-14 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
| CN113923893A (zh) * | 2021-09-23 | 2022-01-11 | 华中科技大学 | 一种大气压下等离子体容性耦合放电镀铜的装置及方法 |
| US11364714B2 (en) * | 2013-10-11 | 2022-06-21 | Sumitomo Electric Printed Circuits, Inc. | Fluororesin base material, printed wiring board, and circuit module |
| CN115119393A (zh) * | 2022-06-30 | 2022-09-27 | 河北光兴半导体技术有限公司 | 用于化学镀铜的自组装图案化陶瓷基板及其制备方法和应用 |
| KR20230007497A (ko) | 2020-07-27 | 2023-01-12 | 우시오덴키 가부시키가이샤 | 불소 수지의 표면 개질 방법, 표면 개질된 불소 수지의 제조 방법, 접합 방법, 표면 개질된 불소 수지를 갖는 재료, 및 접합체 |
| JP2023145402A (ja) * | 2022-03-28 | 2023-10-11 | 国立大学法人岩手大学 | 積層体の製造方法、積層体、プリント回路、デバイス回路、および電気電子機器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5945486A (en) * | 1994-12-09 | 1999-08-31 | Geo-Centers, Inc. | Fluoropolymeric substrates with metallized surfaces and methods for producing the same |
| JP2007150221A (ja) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | 多層回路基板およびその製造方法 |
-
2010
- 2010-08-25 JP JP2010188148A patent/JP2012046781A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5945486A (en) * | 1994-12-09 | 1999-08-31 | Geo-Centers, Inc. | Fluoropolymeric substrates with metallized surfaces and methods for producing the same |
| JP2007150221A (ja) * | 2005-10-27 | 2007-06-14 | Fujitsu Ltd | 多層回路基板およびその製造方法 |
Non-Patent Citations (5)
| Title |
|---|
| JPN6014029359; 柴原正文 他３名: '大気圧プラズマ処理によるポリテトラフルオロエチレンの表面改質' 表面技術 Ｖｏｌ．５８ Ｎｏ．７, 20070701, Ｐａｇｅ．４２０-４２４ * |
| JPN6014029360; ＰＲＩＳＳＡＮＡＲＯＯＮ Ｗ 他３名: 'Ｅｌｅｃｔｒｏｐｏｌｙｍｅｒｉｚａｔｉｏｎ ｏｆ ＤＢＳＡ-ｄｏｐｅｄ ｐｏｌｙｐｙｒｒｏｌｅ ｆｉｌｍｓ ｏｎ ＰＴＦＥ ｖｉａ ａｎ ｅｌｅｃｔｒｏｌｅｓｓ ｃｏｐｐｅｒ ｉｎｔｅｒｌａｙｅｒ' ＳＵＲＦＡＣＥ ＡＮＤ ＩＮＴＥＲＦＡＣＥ ＡＮＡＬＹＳＩＳ Ｖｏｌ．３５ Ｎｏ．１２, 200312, Ｐａｇｅ．９７４-９８３ * |
| JPN6014029362; ＷＵ Ｓ 他３名: 'Ｅｌｅｃｔｒｏｌｅｓｓ Ｄｅｐｏｓｉｔｉｏｎ ｏｆ Ｃｏｐｐｅｒ ｏｎ Ｓｕｒｆａｃｅ Ｍｏｄｉｆｉｅｄ Ｐｏｌｙ（ｔｅｔｒａｆｌｕｏｒｏｅｔｈｙｌｅｎｅ） Ｆｉｌｍｓ ｆｒｏｍ Ｇｒａｆｔ Ｃｏｐｏ' Ｌａｎｇｍｕｉｒ Ｖｏｌ．１６ Ｎｏ．１１, 20000530, Ｐａｇｅ．５１９２-５１９８ * |
| JPN6014029364; ＣＨＥＮ Ｊ-Ｒ， ＷＡＫＩＤＡ Ｔ: 'Ｓｔｕｄｉｅｓ ｏｎ ｔｈｅ Ｓｕｒｆａｃｅ Ｆｒｅｅ Ｅｎｅｒｇｙ ａｎｄ Ｓｕｒｆａｃｅ Ｓｔｒｕｃｔｕｒｅ ｏｆ ＰＴＦＥ Ｆｉｌｍ Ｔｒｅａｔｅｄ ｗｉｔｈ Ｌｏｗ Ｔｅｍｐｅｒａｔｕｒｅ' Ｊｏｕｒｎａｌ ｏｆ Ａｐｐｌｉｅｄ Ｐｏｌｙｍｅｒ Ｓｃｉｅｎｃｅ Ｖｏｌ．６３ Ｎｏ．１３, 19970328, Ｐａｇｅ．１７３３-１７３９ * |
| JPN6014029365; ＺＨＡＮＧ Ｍ Ｃ 他３名: 'Ｅｌｅｃｔｒｏｌｅｓｓ Ｐｌａｔｉｎｇ ｏｆ Ｃｏｐｐｅｒ ａｎｄ Ｎｉｃｋｅｌ ｏｎ Ｓｕｒｆａｃｅ-Ｍｏｄｉｆｉｅｄ Ｐｏｌｙ（ｔｅｔｒａｆｌｕｏｒｏｅｔｈｙｌｅｎｅ） Ｆｉｌｍｓ．' Ｊｏｕｒｎａｌ ｏｆ Ｔｈｅ Ｅｌｅｃｔｒｏｃｈｅｍｉｃａｌ Ｓｏｃｉｅｔｙ Ｖｏｌ．１４８ Ｎｏ．２, 200102, Ｐａｇｅ．Ｃ７１-Ｃ８０ * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11364714B2 (en) * | 2013-10-11 | 2022-06-21 | Sumitomo Electric Printed Circuits, Inc. | Fluororesin base material, printed wiring board, and circuit module |
| JP2015122448A (ja) * | 2013-12-24 | 2015-07-02 | 住友電工プリントサーキット株式会社 | フッ素樹脂基材、プリント配線板、生体情報測定デバイス及び人工臓器 |
| CN106567114A (zh) * | 2016-11-02 | 2017-04-19 | 华南理工大学 | 一种abs塑料表面喷涂活化的电镀方法 |
| JP2018123261A (ja) * | 2017-02-02 | 2018-08-09 | 株式会社電子技研 | 樹脂および樹脂の製造方法 |
| JPWO2018147205A1 (ja) * | 2017-02-13 | 2019-02-14 | 東洋炭素株式会社 | めっきの前処理方法、めっき方法、めっき前処理物及びめっき物 |
| KR20230007497A (ko) | 2020-07-27 | 2023-01-12 | 우시오덴키 가부시키가이샤 | 불소 수지의 표면 개질 방법, 표면 개질된 불소 수지의 제조 방법, 접합 방법, 표면 개질된 불소 수지를 갖는 재료, 및 접합체 |
| US12215210B2 (en) | 2020-07-27 | 2025-02-04 | Ushio Denki Kabushiki Kaisha | Fluorine resin surface modification method, surface-modified fluorine resin production method, joining method, material having surface-modified fluorine resin, and joined body |
| CN113923893A (zh) * | 2021-09-23 | 2022-01-11 | 华中科技大学 | 一种大气压下等离子体容性耦合放电镀铜的装置及方法 |
| CN113923893B (zh) * | 2021-09-23 | 2023-10-20 | 华中科技大学 | 一种大气压下等离子体容性耦合放电镀铜的装置及方法 |
| JP2023145402A (ja) * | 2022-03-28 | 2023-10-11 | 国立大学法人岩手大学 | 積層体の製造方法、積層体、プリント回路、デバイス回路、および電気電子機器 |
| CN115119393A (zh) * | 2022-06-30 | 2022-09-27 | 河北光兴半导体技术有限公司 | 用于化学镀铜的自组装图案化陶瓷基板及其制备方法和应用 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012046781A (ja) | 高周波回路用ポリテトラフルオロエチレン基板の銅メッキ方法 | |
| JP5360963B2 (ja) | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 | |
| KR100494050B1 (ko) | 고분자 소재 표면의 금속피막 도금방법 및 이를 이용한전자파 차폐방법 | |
| JP4738308B2 (ja) | 金属皮膜付シクロオレフィンポリマー材の製造方法及びその製造方法を用いて得られる金属皮膜付シクロオレフィンポリマー材 | |
| JP4528634B2 (ja) | 金属膜の形成方法 | |
| JP6925814B2 (ja) | 樹脂および樹脂の製造方法 | |
| US7955697B2 (en) | Adhesive bond and method for the production thereof | |
| CN103328686A (zh) | 采用等离子体聚合预处理对物件的金属涂覆 | |
| JPH01259170A (ja) | 絶縁体上に金属構造を製造する方法 | |
| JP4647954B2 (ja) | フレキシブルプリント配線板用積層体の製造方法 | |
| JP2019199641A (ja) | 表面改質成型体の製造方法 | |
| Wang et al. | A laser curable palladium complex ink used for fabrication of copper pattern on polyimide substrate | |
| JP2011063855A (ja) | 無電解めっき素材の製造方法 | |
| JP5721254B2 (ja) | 誘電体基材表面の触媒フリー金属化方法及び金属膜付き誘電体基材 | |
| JP3331153B2 (ja) | ポリイミドフィルム−金属薄膜の複合フィルムの製造方法 | |
| JPH04234437A (ja) | 金属−有機ポリマー結合体の製造方法 | |
| KR20130096613A (ko) | 접착력 향상을 위한 폴리이미드 필름의 표면처리 방법 및 금속층을 갖는 폴리이미드 필름 | |
| JP4795100B2 (ja) | 金属膜形成方法、金属膜形成用基板、金属膜、金属パターン形成方法、金属パターン形成用基板、金属パターン、及びポリマー層形成用組成物 | |
| Charbonnier et al. | New approaches for electroless plating processes by activation of polymer surfaces using low pressure plasma and dielectric-barrier discharge devices | |
| JP2000073170A (ja) | 金属化されたサブストレ―ト材料の製造方法 | |
| JP2008041720A (ja) | 回路基板およびその製造方法 | |
| JPH11314310A (ja) | フッ素樹脂・金属薄膜複合シートの製造方法 | |
| JP2007262542A (ja) | 金属膜形成方法、金属膜形成用基板、金属膜積層体、金属パターン形成方法、金属パターン形成用基板、金属パターン材料、及び、ポリマー前駆体層形成用塗布液組成物 | |
| JP4579048B2 (ja) | 金属膜形成方法、それを用いた金属パターン形成方法及び金属膜 | |
| JP4769934B2 (ja) | プラスチック表面の改質方法、プラスチック表面のメッキ方法およびプラスチック |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130710 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130710 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140521 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140715 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140908 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20140908 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150203 |