JP2012033664A5 - - Google Patents
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- Publication number
- JP2012033664A5 JP2012033664A5 JP2010171312A JP2010171312A JP2012033664A5 JP 2012033664 A5 JP2012033664 A5 JP 2012033664A5 JP 2010171312 A JP2010171312 A JP 2010171312A JP 2010171312 A JP2010171312 A JP 2010171312A JP 2012033664 A5 JP2012033664 A5 JP 2012033664A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- circuit
- wiring pattern
- green sheet
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims 33
- 239000000758 substrate Substances 0.000 claims 33
- 239000010410 layer Substances 0.000 claims 7
- 239000000843 powder Substances 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 4
- 239000011521 glass Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- 239000002344 surface layer Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 229910044991 metal oxide Inorganic materials 0.000 claims 3
- 150000004706 metal oxides Chemical class 0.000 claims 3
- 239000002904 solvent Substances 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 238000004898 kneading Methods 0.000 claims 2
- 230000001681 protective effect Effects 0.000 claims 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 claims 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 1
- 239000005751 Copper oxide Substances 0.000 claims 1
- 229910000416 bismuth oxide Inorganic materials 0.000 claims 1
- 229910052810 boron oxide Inorganic materials 0.000 claims 1
- 238000013329 compounding Methods 0.000 claims 1
- 229910000431 copper oxide Inorganic materials 0.000 claims 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims 1
- 229940112669 cuprous oxide Drugs 0.000 claims 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000480 nickel oxide Inorganic materials 0.000 claims 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims 1
- 229910001923 silver oxide Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010171312A JP5463235B2 (ja) | 2010-07-30 | 2010-07-30 | 車載用電子機器に用いる基板構造 |
| PCT/JP2011/066432 WO2012014743A1 (ja) | 2010-07-30 | 2011-07-20 | 車載用電子機器に用いる基板構造 |
| US13/812,141 US20130182397A1 (en) | 2010-07-30 | 2011-07-20 | Circuit Board Structure Used for Vehicle-Mounted Electronic Device |
| EP11812334.8A EP2600703A1 (en) | 2010-07-30 | 2011-07-20 | Substrate structure for vehicle-mounting electronic device |
| CN2011800361540A CN103026806A (zh) | 2010-07-30 | 2011-07-20 | 用于车载用电子设备的基板构造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010171312A JP5463235B2 (ja) | 2010-07-30 | 2010-07-30 | 車載用電子機器に用いる基板構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012033664A JP2012033664A (ja) | 2012-02-16 |
| JP2012033664A5 true JP2012033664A5 (enExample) | 2012-10-25 |
| JP5463235B2 JP5463235B2 (ja) | 2014-04-09 |
Family
ID=45529958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010171312A Active JP5463235B2 (ja) | 2010-07-30 | 2010-07-30 | 車載用電子機器に用いる基板構造 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20130182397A1 (enExample) |
| EP (1) | EP2600703A1 (enExample) |
| JP (1) | JP5463235B2 (enExample) |
| CN (1) | CN103026806A (enExample) |
| WO (1) | WO2012014743A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5737388B2 (ja) * | 2011-03-28 | 2015-06-17 | 株式会社村田製作所 | ガラスセラミック基板およびその製造方法 |
| US9161444B2 (en) * | 2011-10-28 | 2015-10-13 | Kyocera Corporation | Circuit board and electronic apparatus provided with the same |
| DE102012213916A1 (de) * | 2011-11-08 | 2013-05-08 | Robert Bosch Gmbh | Elektronikmodul für ein Steuergerät |
| US10392959B2 (en) * | 2012-06-05 | 2019-08-27 | General Electric Company | High temperature flame sensor |
| JP6195453B2 (ja) * | 2013-02-20 | 2017-09-13 | 三菱重工オートモーティブサーマルシステムズ株式会社 | インバータ一体型電動圧縮機 |
| JPWO2017056727A1 (ja) * | 2015-09-29 | 2018-02-22 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
| EP3406113B1 (en) * | 2016-01-20 | 2020-09-09 | Jaquet Technology Group AG | Manufacturing method for a sensing element and sensor device |
| JP6724481B2 (ja) | 2016-03-30 | 2020-07-15 | 日立金属株式会社 | セラミック基板及びその製造方法 |
| US10559509B2 (en) | 2016-09-01 | 2020-02-11 | Hitachi Metals, Ltd. | Insulating substrate and semiconductor device using same |
| CN106782763A (zh) * | 2016-12-19 | 2017-05-31 | 东莞珂洛赫慕电子材料科技有限公司 | 一种含片状氧化铝的铝基介质浆料及其制备方法 |
| CN106847375A (zh) * | 2016-12-19 | 2017-06-13 | 东莞珂洛赫慕电子材料科技有限公司 | 一种含片状二氧化硅的铝基介质浆料及其制备方法 |
| CN106937478B (zh) * | 2017-04-13 | 2023-10-13 | 戴永岗 | 在陶瓷基板上制作多层精密线路的产品结构及其制作工艺 |
| EP3690938B1 (en) | 2017-09-29 | 2022-09-07 | Hitachi Metals, Ltd. | Semiconductor device and production method therefor |
| US11638353B2 (en) * | 2018-09-17 | 2023-04-25 | Hutchinson Technology Incorporated | Apparatus and method for forming sensors with integrated electrical circuits on a substrate |
| CN114554733B (zh) * | 2022-04-25 | 2022-06-28 | 绵阳新能智造科技有限公司 | 一种层叠pcb板的粘贴装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5080958A (en) * | 1989-08-01 | 1992-01-14 | E. I. Du Pont De Nemours And Company | Multilayer interconnects |
| JPH05226840A (ja) * | 1991-04-05 | 1993-09-03 | Du Pont Japan Ltd | セラミック多層配線基板の製造方法 |
| JP2783751B2 (ja) * | 1993-12-21 | 1998-08-06 | 富士通株式会社 | 多層セラミック基板の製造方法 |
| JP4127440B2 (ja) * | 1999-01-05 | 2008-07-30 | イビデン株式会社 | 多層ビルドアップ配線板 |
| JP4127433B2 (ja) * | 1998-09-17 | 2008-07-30 | イビデン株式会社 | 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法 |
| DE69942279D1 (de) * | 1998-09-17 | 2010-06-02 | Ibiden Co Ltd | Vielschichtig aufgebaute leiterplatte |
| JP2000101237A (ja) * | 1998-09-18 | 2000-04-07 | Fujitsu Ltd | ビルドアップ基板 |
| JP2001267743A (ja) * | 2000-03-16 | 2001-09-28 | Matsushita Electric Ind Co Ltd | セラミック積層基板の製造方法 |
| JP2002076609A (ja) * | 2000-08-25 | 2002-03-15 | Kyocera Corp | 回路基板 |
| EP1394857A3 (en) * | 2002-08-28 | 2004-04-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device |
| JP4432517B2 (ja) | 2004-02-06 | 2010-03-17 | 株式会社村田製作所 | 複合多層基板 |
| JP4706228B2 (ja) | 2004-10-27 | 2011-06-22 | 旭硝子株式会社 | 無鉛ガラス、ガラスセラミックス組成物および誘電体 |
| KR100744930B1 (ko) | 2006-02-01 | 2007-08-01 | 삼성전기주식회사 | Ｌｔｃｃ 모듈의 제조 방법 |
| JP2008034828A (ja) * | 2006-06-30 | 2008-02-14 | Ngk Spark Plug Co Ltd | Ｉｃ検査用治具に用いる多層セラミック基板及び多層セラミック基板の製造方法 |
| JP2008182126A (ja) * | 2007-01-25 | 2008-08-07 | Hitachi Ltd | エンジンルーム内に設置される電子機器 |
| JP2009238976A (ja) * | 2008-03-27 | 2009-10-15 | Kyocera Corp | セラミック積層基板およびセラミック積層体の製造方法 |
-
2010
- 2010-07-30 JP JP2010171312A patent/JP5463235B2/ja active Active
-
2011
- 2011-07-20 US US13/812,141 patent/US20130182397A1/en not_active Abandoned
- 2011-07-20 CN CN2011800361540A patent/CN103026806A/zh active Pending
- 2011-07-20 EP EP11812334.8A patent/EP2600703A1/en not_active Withdrawn
- 2011-07-20 WO PCT/JP2011/066432 patent/WO2012014743A1/ja not_active Ceased
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