JP2012009597A - 半導体デバイスの製造方法および半導体デバイスの製造装置 - Google Patents
半導体デバイスの製造方法および半導体デバイスの製造装置 Download PDFInfo
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Abstract
【解決手段】複数のバンプを構成するためのハンダを半導体基板上に形成した後、半導体基板を第1の輻射熱で加熱しながら、ハンダの表面に形成された酸化膜を除去する工程と、半導体基板をヒーターステージの表面から所定の距離を離した位置に保持して、第1の輻射熱よりも大きい第2の輻射熱により半導体基板を加熱することで、酸化膜が除去されたハンダをリフローする工程と、を有するものである。
【選択図】図1
Description
前記複数のバンプを構成するためのハンダを前記半導体基板上に形成した後、前記半導体基板を第1の輻射熱で加熱しながら、前記ハンダの表面に形成された酸化膜を除去する工程と、
前記半導体基板をヒーターステージの表面から所定の距離を離した位置に保持することによって、前記第1の輻射熱よりも大きい第2の輻射熱により前記半導体基板を加熱し、前記酸化膜が除去された前記ハンダをリフローする工程と、
を有するものである。
前記半導体基板を加熱するヒーターステージと、
前記ヒーターステージ上に設けられ、前記半導体基板を点接触で保持する保持台と、
前記半導体基板を前記ヒーターステージ上で支持し、さらに、前記半導体基板を前記保持台に移載可能な支持台と、
前記保持台にて保持された前記半導体基板を前記ヒーターステージからの輻射熱によって加熱する制御を行う制御部と、
を有する構成である。
3 ヒーターステージ
10 保持台
11 支持台
13 温度制御部
14 駆動制御部
17 ガス制御部
18 制御部
20 半導体基板
25 電極
26、26a バンプ
Claims (9)
- 半導体基板上に形成された複数のバンプを備えた半導体デバイスの製造方法であって、
前記複数のバンプを構成するためのハンダを前記半導体基板上に形成した後、前記半導体基板を第1の輻射熱で加熱しながら、前記ハンダの表面に形成された酸化膜を除去する工程と、
前記半導体基板をヒーターステージの表面から所定の距離を離した位置に保持することによって、前記第1の輻射熱よりも大きい第2の輻射熱により前記半導体基板を加熱し、前記酸化膜が除去された前記ハンダをリフローする工程と、
を有する、半導体デバイスの製造方法。 - 請求項1記載の半導体デバイスの製造方法において、
前記第1の輻射熱と前記第2の輻射熱の切換は、前記ヒーターステージと前記半導体基板との距離を変えることによって行うことを特徴とする半導体デバイスの製造方法。 - 請求項2記載の半導体デバイスの製造方法において、
前記所定の距離は、前記第1の輻射熱で前記半導体基板を加熱するときの前記ヒーターステージと該半導体基板との距離よりも小さいことを特徴とする半導体デバイスの製造方法。 - 請求項1から3のいずれか1項記載の半導体デバイスの製造方法において、
前記第1の輻射熱と前記第2の輻射熱の熱源が同一であることを特徴とする半導体デバイスの製造方法。 - 請求項1から4のいずれか1項記載の半導体デバイスの製造方法において、
前記酸化膜を除去する工程は、前記バンプの表面に形成された酸化膜の除去を水素含有プラズマの照射によって行う工程であることを特徴とする半導体デバイスの製造方法。 - 請求項1から5のいずれか1項記載の半導体デバイスの製造方法において、
前記酸化膜を除去する工程および前記リフロー工程は、同一装置の同一チャンバで行われることを特徴とする半導体デバイスの製造方法。 - 半導体基板上に形成された複数のバンプを備えた半導体デバイスの製造装置であって、
前記半導体基板を加熱するヒーターステージと、
前記ヒーターステージ上に設けられ、前記半導体基板を点接触で保持する保持台と、
前記半導体基板を前記ヒーターステージ上で支持し、さらに、前記半導体基板を前記保持台に移載可能な支持台と、
前記保持台にて保持された前記半導体基板を前記ヒーターステージからの輻射熱によって加熱する制御を行う制御部と、
を有する、半導体デバイスの製造装置。 - 請求項7記載の半導体デバイスの製造装置において、
前記制御部は、前記半導体基板を支える支持台の高さを変えることによって、前記ヒーターステージからの輻射熱の量を変更することを特徴とする半導体デバイスの製造装置。 - 請求項7または8記載の半導体デバイスの製造装置において、
前記ヒーターステージは、前記支持台を収納するための溝を備えていることを特徴とする半導体デバイスの製造装置。
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US13/167,448 US8765594B2 (en) | 2010-06-24 | 2011-06-23 | Method of fabricating semiconductor device allowing smooth bump surface |
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US8765594B2 (en) | 2010-06-24 | 2014-07-01 | Yoshihiro Kitamura | Method of fabricating semiconductor device allowing smooth bump surface |
US9974191B2 (en) | 2013-01-24 | 2018-05-15 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, substrate processing apparatus and recording medium |
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US8844793B2 (en) | 2010-11-05 | 2014-09-30 | Raytheon Company | Reducing formation of oxide on solder |
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CN106128998A (zh) * | 2016-07-21 | 2016-11-16 | 上海交通大学 | 半导体垂直铜互连中填充有机聚合物的tsv结构的制备方法 |
US11470727B2 (en) * | 2016-10-24 | 2022-10-11 | Jaguar Land Rover Limited | Apparatus and method relating to electrochemical migration |
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