JP2011525207A - 強化硬化性組成物 - Google Patents

強化硬化性組成物 Download PDF

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Publication number
JP2011525207A
JP2011525207A JP2011514739A JP2011514739A JP2011525207A JP 2011525207 A JP2011525207 A JP 2011525207A JP 2011514739 A JP2011514739 A JP 2011514739A JP 2011514739 A JP2011514739 A JP 2011514739A JP 2011525207 A JP2011525207 A JP 2011525207A
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Japan
Prior art keywords
curable composition
rubber
grams
composition according
silica
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JP2011514739A
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English (en)
Japanese (ja)
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JP2011525207A5 (enrdf_load_stackoverflow
Inventor
エル． トンプソン，ウェンディ
ジェイ． シュルツ，ウィリアム
エー． クロップ，マイケル
セス，ジェイシュリー
ピー． ゲーツ，ダグラス
エム． ハイン，アンドリュー
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2011525207A publication Critical patent/JP2011525207A/ja
Publication of JP2011525207A5 publication Critical patent/JP2011525207A5/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Wire Bonding (AREA)
  • Reinforced Plastic Materials (AREA)
JP2011514739A 2008-06-16 2009-06-16 強化硬化性組成物 Withdrawn JP2011525207A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6179508P 2008-06-16 2008-06-16
US61/061,795 2008-06-16
PCT/US2009/047465 WO2010005710A1 (en) 2008-06-16 2009-06-16 Toughened curable compositions

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014151818A Division JP2014218675A (ja) 2008-06-16 2014-07-25 強化硬化性組成物

Publications (2)

Publication Number Publication Date
JP2011525207A true JP2011525207A (ja) 2011-09-15
JP2011525207A5 JP2011525207A5 (enrdf_load_stackoverflow) 2012-07-05

Family

ID=41182192

Family Applications (3)

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JP2011514739A Withdrawn JP2011525207A (ja) 2008-06-16 2009-06-16 強化硬化性組成物
JP2014151818A Withdrawn JP2014218675A (ja) 2008-06-16 2014-07-25 強化硬化性組成物
JP2016154703A Expired - Fee Related JP6437966B2 (ja) 2008-06-16 2016-08-05 強化硬化性組成物

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JP2016154703A Expired - Fee Related JP6437966B2 (ja) 2008-06-16 2016-08-05 強化硬化性組成物

Country Status (7)

Country Link
US (1) US20110097212A1 (enrdf_load_stackoverflow)
EP (1) EP2294119B1 (enrdf_load_stackoverflow)
JP (3) JP2011525207A (enrdf_load_stackoverflow)
KR (1) KR20110039257A (enrdf_load_stackoverflow)
CN (1) CN102112536B (enrdf_load_stackoverflow)
ES (1) ES2690653T3 (enrdf_load_stackoverflow)
WO (1) WO2010005710A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013095839A (ja) * 2011-10-31 2013-05-20 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8309633B2 (en) * 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
US8541485B2 (en) 2009-05-26 2013-09-24 3M Innovative Properties Company Process for making filled resins
KR101910202B1 (ko) 2010-02-11 2018-10-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 분산된 다중모드 표면 개질된 나노입자를 포함하는 수지 시스템
CN102947405B (zh) 2010-04-20 2015-07-01 3M创新有限公司 包含聚合表面改性的纳米粒子的压敏粘合剂
WO2015069347A2 (en) * 2013-08-13 2015-05-14 3M Innovative Properties Company Nanocomposites containing nonspherical silica nanoparticles, composites, articles, and methods of making same
WO2015102911A1 (en) * 2013-12-30 2015-07-09 Dow Global Technologies Llc Toughening agents for epoxy systems
CN103899571A (zh) * 2014-03-17 2014-07-02 安徽华瑞塑业有限公司 独立式轴流泵叶片
DE102014213327A1 (de) * 2014-07-09 2016-01-14 MTU Aero Engines AG Anti-fouling-Schicht für Verdichterschaufeln
US10245764B2 (en) * 2014-12-18 2019-04-02 Cytec Industries Inc. Modified resin systems suitable for liquid resin infusion
CA2977647A1 (en) * 2015-02-27 2016-09-01 3M Innovative Properties Company Two-part structural adhesive
US11647583B2 (en) * 2016-04-19 2023-05-09 Panasonic Intellectual Property Management Co., Ltd. Prepreg, metal-clad laminated board, and printed wiring board
JP6969545B2 (ja) * 2016-05-13 2021-11-24 昭和電工マテリアルズ株式会社 樹脂組成物、プリプレグ、樹脂付き金属箔、積層板、プリント配線板及び樹脂組成物の製造方法
US11015040B2 (en) 2016-11-07 2021-05-25 3M Innovative Properties Company Curable resin including nanoparticles including surface-bonded hydrophobically-modifying alkyl groups
WO2019000375A1 (en) * 2017-06-30 2019-01-03 Henkel Ag & Co. Kgaa INORGANIC NANOPARTICLES WITH MODIFIED SURFACE AND USE THEREOF
CN107501867A (zh) * 2017-09-21 2017-12-22 上海稳优实业有限公司 固态颗粒增强环氧树脂及其制备方法
CN109517344B (zh) * 2018-12-29 2021-03-16 江苏恒神股份有限公司 一种高模量高韧性环氧树脂
CN113278395B (zh) * 2021-04-12 2022-03-18 广东博汇新材料科技股份有限公司 一种预定型喷胶组合物及其制备方法
CN115157809B (zh) * 2022-06-09 2023-04-07 科顺防水科技股份有限公司 一种预铺防水卷材及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002015621A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 電気絶縁材料及びその製造方法
JP2007254709A (ja) * 2005-11-29 2007-10-04 Ajinomoto Co Inc 多層プリント配線板の絶縁層用樹脂組成物
JP2008031193A (ja) * 2006-07-26 2008-02-14 Toray Ind Inc エポキシ樹脂組成物、プリプレグ、繊維強化複合材料

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684678A (en) * 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
JP2717229B2 (ja) * 1988-06-21 1998-02-18 旭化成工業株式会社 樹脂補強用ゴム粒子及び補強樹脂組成物
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
JP2652093B2 (ja) * 1991-09-12 1997-09-10 富士写真フイルム株式会社 感光性組成物
JP3655646B2 (ja) * 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
US5648407A (en) * 1995-05-16 1997-07-15 Minnesota Mining And Manufacturing Company Curable resin sols and fiber-reinforced composites derived therefrom
US6800371B2 (en) * 2001-03-07 2004-10-05 3M Innovative Properties Company Adhesives and adhesive compositions containing thioether groups
JP2003012320A (ja) * 2001-06-28 2003-01-15 Catalysts & Chem Ind Co Ltd シリカ系無機化合物オルガノゾル
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US6893736B2 (en) * 2001-11-19 2005-05-17 Henkel Corporation Thermosetting resin compositions useful as underfill sealants
WO2003101164A1 (en) * 2002-05-23 2003-12-04 3M Innovative Properties Company Nanoparticle filled underfill
JP2004083651A (ja) * 2002-08-23 2004-03-18 Toray Ind Inc 吸湿性ポリエステル組成物およびポリエステル繊維
US6811823B2 (en) * 2002-09-13 2004-11-02 Dow Corning Corporation Hydrophobing silica with organosilicon compounds and blends thereof
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
US20050048291A1 (en) * 2003-08-14 2005-03-03 General Electric Company Nano-filled composite materials with exceptionally high glass transition temperature
EP1457509B1 (de) * 2003-03-11 2006-06-28 hanse chemie AG Polymere Epoxidharz-Zusammensetzung
DE50304047D1 (de) * 2003-03-11 2006-08-10 Hanse Chemie Ag Polymere Epoxidharz-Zusammensetzung
JP4066870B2 (ja) * 2003-04-10 2008-03-26 Ｊｓｒ株式会社 液状硬化性組成物、硬化膜及び帯電防止用積層体
US7666938B2 (en) * 2004-12-03 2010-02-23 Henkel Corporation Nanoparticle silica filled benzoxazine compositions
US20060199301A1 (en) * 2005-03-07 2006-09-07 Basheer Rafil A Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from
ES2375498T3 (es) * 2005-08-24 2012-03-01 Henkel Ag & Co. Kgaa Resinas epoxi que tienen una resistencia al impacto mejorada.
TWI410442B (zh) * 2005-11-29 2013-10-01 Ajinomoto Kk A resin composition for an insulating layer of a multilayer printed circuit board
JP4905668B2 (ja) * 2006-09-15 2012-03-28 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002015621A (ja) * 2000-06-29 2002-01-18 Toshiba Corp 電気絶縁材料及びその製造方法
JP2007254709A (ja) * 2005-11-29 2007-10-04 Ajinomoto Co Inc 多層プリント配線板の絶縁層用樹脂組成物
JP2008031193A (ja) * 2006-07-26 2008-02-14 Toray Ind Inc エポキシ樹脂組成物、プリプレグ、繊維強化複合材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013095839A (ja) * 2011-10-31 2013-05-20 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板

Also Published As

Publication number Publication date
ES2690653T3 (es) 2018-11-21
US20110097212A1 (en) 2011-04-28
KR20110039257A (ko) 2011-04-15
JP6437966B2 (ja) 2018-12-12
EP2294119B1 (en) 2018-08-01
CN102112536A (zh) 2011-06-29
JP2016199767A (ja) 2016-12-01
WO2010005710A1 (en) 2010-01-14
CN102112536B (zh) 2015-06-24
JP2014218675A (ja) 2014-11-20
EP2294119A1 (en) 2011-03-16

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