JP2011521461A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011521461A5 JP2011521461A5 JP2011509848A JP2011509848A JP2011521461A5 JP 2011521461 A5 JP2011521461 A5 JP 2011521461A5 JP 2011509848 A JP2011509848 A JP 2011509848A JP 2011509848 A JP2011509848 A JP 2011509848A JP 2011521461 A5 JP2011521461 A5 JP 2011521461A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- contact region
- optoelectronic semiconductor
- chip according
- reflective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 25
- 230000005693 optoelectronics Effects 0.000 claims 12
- 239000004020 conductor Substances 0.000 claims 6
- 239000012777 electrically insulating material Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000013508 migration Methods 0.000 claims 2
- 230000005012 migration Effects 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008024327.2 | 2008-05-20 | ||
| DE102008024327A DE102008024327A1 (de) | 2008-05-20 | 2008-05-20 | Optoelektronischer Halbleiterchip mit einer reflektierenden Schicht |
| PCT/DE2009/000576 WO2009140939A2 (de) | 2008-05-20 | 2009-04-24 | Optoelektronischer halbleiterchip mit einer reflektierenden schicht |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011521461A JP2011521461A (ja) | 2011-07-21 |
| JP2011521461A5 true JP2011521461A5 (enExample) | 2012-06-14 |
| JP5358680B2 JP5358680B2 (ja) | 2013-12-04 |
Family
ID=40957779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011509848A Expired - Fee Related JP5358680B2 (ja) | 2008-05-20 | 2009-04-24 | 反射層を備えているオプトエレクトロニクス半導体チップ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8710512B2 (enExample) |
| EP (1) | EP2281314B1 (enExample) |
| JP (1) | JP5358680B2 (enExample) |
| KR (1) | KR101552368B1 (enExample) |
| CN (1) | CN101965649B (enExample) |
| DE (1) | DE102008024327A1 (enExample) |
| WO (1) | WO2009140939A2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5541260B2 (ja) * | 2011-03-21 | 2014-07-09 | 豊田合成株式会社 | Iii族窒化物半導体発光素子 |
| DE102011111919B4 (de) | 2011-08-30 | 2023-03-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| DE102011112000B4 (de) * | 2011-08-31 | 2023-11-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
| JP2013093412A (ja) * | 2011-10-25 | 2013-05-16 | Showa Denko Kk | 発光ダイオード、発光ダイオードの製造方法、発光ダイオードランプ及び照明装置 |
| DE102012101889A1 (de) | 2012-03-06 | 2013-09-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| DE102013103216A1 (de) | 2013-03-28 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Halbleiterchip |
| KR102299738B1 (ko) * | 2014-12-23 | 2021-09-09 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 조명시스템 |
| KR102353570B1 (ko) * | 2015-08-24 | 2022-01-20 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 및 이를 구비한 발광 소자 패키지 |
| JP6332301B2 (ja) * | 2016-02-25 | 2018-05-30 | 日亜化学工業株式会社 | 発光素子 |
| DE102016106831A1 (de) | 2016-04-13 | 2017-10-19 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102017108199A1 (de) * | 2017-04-18 | 2018-10-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Betriebsverfahren für ein optoelektronisches Halbleiterbauteil |
| US20240379579A1 (en) * | 2020-12-31 | 2024-11-14 | Dynax Semiconductor, Inc. | Semiconductor device and manufacturing method thereof |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5406095A (en) * | 1992-08-27 | 1995-04-11 | Victor Company Of Japan, Ltd. | Light emitting diode array and production method of the light emitting diode |
| TWI289944B (en) | 2000-05-26 | 2007-11-11 | Osram Opto Semiconductors Gmbh | Light-emitting-diode-element with a light-emitting-diode-chip |
| TW544953B (en) * | 2002-06-03 | 2003-08-01 | Opto Tech Corp | Light emitting diode capable of increasing the light emitting efficiency |
| JP2004047504A (ja) * | 2002-07-08 | 2004-02-12 | Korai Kagi Kofun Yugenkoshi | 発光効率を高めた発光ダイオード |
| KR100523484B1 (ko) * | 2002-11-11 | 2005-10-24 | 한국전자통신연구원 | 전류 제한 구조를 갖는 반도체 광소자의 제조방법 |
| JP2005101212A (ja) | 2003-09-24 | 2005-04-14 | Toyoda Gosei Co Ltd | 半導体発光素子 |
| US20050205883A1 (en) * | 2004-03-19 | 2005-09-22 | Wierer Jonathan J Jr | Photonic crystal light emitting device |
| JP4330476B2 (ja) | 2004-03-29 | 2009-09-16 | スタンレー電気株式会社 | 半導体発光素子 |
| DE102004040277B4 (de) | 2004-06-30 | 2015-07-30 | Osram Opto Semiconductors Gmbh | Reflektierendes Schichtsystem mit einer Mehrzahl von Schichten zur Aufbringung auf ein III/V-Verbindungshalbleitermaterial |
| US7964884B2 (en) | 2004-10-22 | 2011-06-21 | Seoul Opto Device Co., Ltd. | GaN compound semiconductor light emitting element and method of manufacturing the same |
| US7815901B2 (en) * | 2005-01-28 | 2010-10-19 | L'ORéAL S.A. | Hair treatment method |
| JP4951865B2 (ja) * | 2005-03-02 | 2012-06-13 | 日亜化学工業株式会社 | 半導体発光素子 |
| JP2007214302A (ja) * | 2006-02-09 | 2007-08-23 | Nanoteco Corp | 発光素子、及びその製造方法 |
| US7781791B2 (en) * | 2006-02-28 | 2010-08-24 | Rohm Co., Ltd. | Semiconductor light emitting element |
| JP2007300017A (ja) * | 2006-05-02 | 2007-11-15 | Sanken Electric Co Ltd | 半導体発光素子 |
| JP4946195B2 (ja) * | 2006-06-19 | 2012-06-06 | サンケン電気株式会社 | 半導体発光素子及びその製造方法 |
| US8716728B2 (en) * | 2006-10-20 | 2014-05-06 | Mitsubishi Chemical Corporation | Nitride semiconductor light-emitting diode device |
| TWI344709B (en) * | 2007-06-14 | 2011-07-01 | Epistar Corp | Light emitting device |
-
2008
- 2008-05-20 DE DE102008024327A patent/DE102008024327A1/de not_active Withdrawn
-
2009
- 2009-04-24 KR KR1020107019178A patent/KR101552368B1/ko not_active Expired - Fee Related
- 2009-04-24 CN CN200980108273.5A patent/CN101965649B/zh not_active Expired - Fee Related
- 2009-04-24 WO PCT/DE2009/000576 patent/WO2009140939A2/de not_active Ceased
- 2009-04-24 US US12/922,577 patent/US8710512B2/en active Active
- 2009-04-24 EP EP09749481.9A patent/EP2281314B1/de not_active Not-in-force
- 2009-04-24 JP JP2011509848A patent/JP5358680B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011521461A5 (enExample) | ||
| JP2011520270A5 (enExample) | ||
| JP2011049600A5 (enExample) | ||
| JP2011129920A5 (enExample) | ||
| JP2013102162A5 (enExample) | ||
| JP2009105376A5 (enExample) | ||
| JP2013514642A5 (enExample) | ||
| JP2005235859A5 (enExample) | ||
| EP2107653A3 (en) | Surface Emitting Laser Element Array | |
| JP3175334U7 (enExample) | ||
| JP2012129234A5 (enExample) | ||
| JP3175270U7 (enExample) | ||
| EP4636962A3 (en) | Light emitting device | |
| JP2012028779A5 (enExample) | ||
| JP2011513957A5 (enExample) | ||
| JP2015228497A5 (enExample) | ||
| JP2013125968A5 (enExample) | ||
| JP2013046049A5 (enExample) | ||
| TW200505043A (en) | LED device, flip-chip led package and light reflecting structure | |
| JP2012009522A5 (enExample) | ||
| ATE497223T1 (de) | Einlagen mit doppelschnittstelle | |
| JP2007088418A5 (enExample) | ||
| JP2007529112A5 (enExample) | ||
| EP2362455A3 (en) | Light emitting device, method of manufacturing the same, light emitting device package, and illumination system | |
| JP2013516751A5 (enExample) |