JP2011518959A5 - - Google Patents

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Publication number
JP2011518959A5
JP2011518959A5 JP2011507519A JP2011507519A JP2011518959A5 JP 2011518959 A5 JP2011518959 A5 JP 2011518959A5 JP 2011507519 A JP2011507519 A JP 2011507519A JP 2011507519 A JP2011507519 A JP 2011507519A JP 2011518959 A5 JP2011518959 A5 JP 2011518959A5
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JP
Japan
Prior art keywords
substrate
recess
conductive faceplate
slope
radius
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Application number
JP2011507519A
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English (en)
Japanese (ja)
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JP2011518959A (ja
JP5073097B2 (ja
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Priority claimed from US12/110,879 external-priority patent/US8097082B2/en
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Publication of JP2011518959A publication Critical patent/JP2011518959A/ja
Publication of JP2011518959A5 publication Critical patent/JP2011518959A5/ja
Application granted granted Critical
Publication of JP5073097B2 publication Critical patent/JP5073097B2/ja
Expired - Fee Related legal-status Critical Current
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JP2011507519A 2008-04-28 2009-04-06 電極アセンブリ、基板を処理するための装置および基板を処理するための方法 Expired - Fee Related JP5073097B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/110,879 2008-04-28
US12/110,879 US8097082B2 (en) 2008-04-28 2008-04-28 Nonplanar faceplate for a plasma processing chamber
PCT/US2009/039674 WO2009134588A2 (en) 2008-04-28 2009-04-06 Nonplanar faceplate for a plasma processing chamber

Publications (3)

Publication Number Publication Date
JP2011518959A JP2011518959A (ja) 2011-06-30
JP2011518959A5 true JP2011518959A5 (enExample) 2012-07-19
JP5073097B2 JP5073097B2 (ja) 2012-11-14

Family

ID=41215290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507519A Expired - Fee Related JP5073097B2 (ja) 2008-04-28 2009-04-06 電極アセンブリ、基板を処理するための装置および基板を処理するための方法

Country Status (6)

Country Link
US (1) US8097082B2 (enExample)
JP (1) JP5073097B2 (enExample)
KR (1) KR20100135967A (enExample)
CN (1) CN102017813A (enExample)
TW (1) TWI395517B (enExample)
WO (1) WO2009134588A2 (enExample)

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