CN102017813A - 等离子体处理腔室的非平面面板 - Google Patents

等离子体处理腔室的非平面面板 Download PDF

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Publication number
CN102017813A
CN102017813A CN200980115050.1A CN200980115050A CN102017813A CN 102017813 A CN102017813 A CN 102017813A CN 200980115050 A CN200980115050 A CN 200980115050A CN 102017813 A CN102017813 A CN 102017813A
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CN
China
Prior art keywords
substrate
conductive panel
electrode
groove
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980115050.1A
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English (en)
Chinese (zh)
Inventor
周建华
迪内士·帕德希
卡希克·贾纳基拉曼
笑·F·郑
航·于
尤加南德·N·萨利帕里
特西姆·萨姆曼
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Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN102017813A publication Critical patent/CN102017813A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Gas-Filled Discharge Tubes (AREA)
CN200980115050.1A 2008-04-28 2009-04-06 等离子体处理腔室的非平面面板 Pending CN102017813A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/110,879 US8097082B2 (en) 2008-04-28 2008-04-28 Nonplanar faceplate for a plasma processing chamber
US12/110,879 2008-04-28
PCT/US2009/039674 WO2009134588A2 (en) 2008-04-28 2009-04-06 Nonplanar faceplate for a plasma processing chamber

Publications (1)

Publication Number Publication Date
CN102017813A true CN102017813A (zh) 2011-04-13

Family

ID=41215290

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980115050.1A Pending CN102017813A (zh) 2008-04-28 2009-04-06 等离子体处理腔室的非平面面板

Country Status (6)

Country Link
US (1) US8097082B2 (enExample)
JP (1) JP5073097B2 (enExample)
KR (1) KR20100135967A (enExample)
CN (1) CN102017813A (enExample)
TW (1) TWI395517B (enExample)
WO (1) WO2009134588A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107937886A (zh) * 2017-11-14 2018-04-20 武汉华星光电半导体显示技术有限公司 化学气相沉积设备及成膜方法
CN110277293A (zh) * 2018-02-05 2019-09-24 朗姆研究公司 用于等离子体处理中均匀性控制的锥形上电极
CN111370287A (zh) * 2020-03-24 2020-07-03 长江存储科技有限责任公司 一种上电极设备以及等离子体处理装置
CN113939893A (zh) * 2019-06-07 2022-01-14 应用材料公司 具有弯曲表面的面板

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WO2016061475A1 (en) * 2014-10-17 2016-04-21 Lam Research Corporation Gas supply delivery arrangement including a gas splitter for tunable gas flow control
CN110071057A (zh) * 2018-01-24 2019-07-30 应用材料公司 加热的陶瓷面板
US11236424B2 (en) * 2019-11-01 2022-02-01 Applied Materials, Inc. Process kit for improving edge film thickness uniformity on a substrate
US20210287881A1 (en) * 2020-03-12 2021-09-16 Applied Materials, Inc. Methods and apparatus for tuning semiconductor processes
US20220049355A1 (en) * 2020-08-14 2022-02-17 Changxin Memory Technologies, Inc. Spray head, chemical vapor deposition device, and working method of chemical vapor deposition device
KR102793905B1 (ko) 2020-08-14 2025-04-08 삼성전자주식회사 상부 전극 및 이를 포함하는 기판 처리 장치
US12338530B2 (en) * 2021-07-09 2025-06-24 Applied Materials, Inc. Shaped showerhead for edge plasma modulation
US20250029849A1 (en) * 2023-07-18 2025-01-23 Applied Materials, Inc. Shaped faceplate for extreme edge film uniformity

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107937886A (zh) * 2017-11-14 2018-04-20 武汉华星光电半导体显示技术有限公司 化学气相沉积设备及成膜方法
CN110277293A (zh) * 2018-02-05 2019-09-24 朗姆研究公司 用于等离子体处理中均匀性控制的锥形上电极
CN113939893A (zh) * 2019-06-07 2022-01-14 应用材料公司 具有弯曲表面的面板
US11851759B2 (en) 2019-06-07 2023-12-26 Applied Materials, Inc. Faceplate having a curved surface
CN113939893B (zh) * 2019-06-07 2024-08-06 应用材料公司 具有弯曲表面的面板
US12110590B2 (en) 2019-06-07 2024-10-08 Applied Materials, Inc. Faceplate having a curved surface
CN111370287A (zh) * 2020-03-24 2020-07-03 长江存储科技有限责任公司 一种上电极设备以及等离子体处理装置

Also Published As

Publication number Publication date
WO2009134588A3 (en) 2010-03-18
JP2011518959A (ja) 2011-06-30
US20090269512A1 (en) 2009-10-29
KR20100135967A (ko) 2010-12-27
TW201008398A (en) 2010-02-16
US8097082B2 (en) 2012-01-17
WO2009134588A2 (en) 2009-11-05
TWI395517B (zh) 2013-05-01
JP5073097B2 (ja) 2012-11-14

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Address after: American California

Applicant after: Applied Materials Inc.

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Application publication date: 20110413