JP2011514432A5 - - Google Patents

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Publication number
JP2011514432A5
JP2011514432A5 JP2010524168A JP2010524168A JP2011514432A5 JP 2011514432 A5 JP2011514432 A5 JP 2011514432A5 JP 2010524168 A JP2010524168 A JP 2010524168A JP 2010524168 A JP2010524168 A JP 2010524168A JP 2011514432 A5 JP2011514432 A5 JP 2011514432A5
Authority
JP
Japan
Prior art keywords
silver
alloy powder
elements
particles
powder containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011514432A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/075349 external-priority patent/WO2009032984A1/en
Publication of JP2011514432A publication Critical patent/JP2011514432A/ja
Publication of JP2011514432A5 publication Critical patent/JP2011514432A5/ja
Pending legal-status Critical Current

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JP2010524168A 2007-09-07 2008-09-05 銀および少なくとも２種の非銀含有元素を含有する多元素合金粉末 Pending JP2011514432A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96787307P 2007-09-07 2007-09-07
PCT/US2008/075349 WO2009032984A1 (en) 2007-09-07 2008-09-05 Multi-element alloy powder containing silver and at least two non-silver containing elements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014138667A Division JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも２種の非銀含有元素を含有する多元素合金粉末

Publications (2)

Publication Number Publication Date
JP2011514432A JP2011514432A (ja) 2011-05-06
JP2011514432A5 true JP2011514432A5 (enExample) 2011-10-20

Family

ID=39926549

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010524168A Pending JP2011514432A (ja) 2007-09-07 2008-09-05 銀および少なくとも２種の非銀含有元素を含有する多元素合金粉末
JP2014138667A Pending JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも２種の非銀含有元素を含有する多元素合金粉末

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014138667A Pending JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも２種の非銀含有元素を含有する多元素合金粉末

Country Status (7)

Country Link
US (2) US20090066193A1 (enExample)
EP (1) EP2185304B1 (enExample)
JP (2) JP2011514432A (enExample)
KR (1) KR20100066543A (enExample)
CN (1) CN101778684B (enExample)
TW (1) TW200932928A (enExample)
WO (1) WO2009032984A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
JP2012500332A (ja) * 2008-08-13 2012-01-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー シリコン太陽電池用の多元素金属粉末
EP2638990B1 (en) 2010-11-08 2019-05-08 Namics Corporation Manufacturing method for metal particles
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
CN102994797A (zh) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 一种合金粉末
WO2014141737A1 (ja) * 2013-03-12 2014-09-18 Jx日鉱日石金属株式会社 スパッタリングターゲット
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
CN103617897A (zh) * 2013-09-29 2014-03-05 魏玲 一种新型三层银/铜双金属复合电触头材料
JP2015109633A (ja) * 2013-10-22 2015-06-11 株式会社大真空 圧電振動素子と当該圧電振動素子を用いた圧電デバイスおよび、前記圧電振動素子の製造方法と当該圧電振動素子を用いた圧電デバイスの製造方法
WO2015109177A2 (en) * 2014-01-17 2015-07-23 E. I. Du Pont De Nemours And Company Improved conductivity thick film pastes containing platinum powder
EP3015567A1 (en) * 2014-10-30 2016-05-04 Heraeus Deutschland GmbH & Co. KG Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds
TWI624969B (zh) * 2015-10-09 2018-05-21 Ngk Spark Plug Co Ltd Piezoelectric element, piezoelectric actuator and piezoelectric transformer
CN108109719A (zh) * 2017-12-21 2018-06-01 惠州市富济电子材料有限公司 一种导电浆料及其制备方法
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺

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Publication number Priority date Publication date Assignee Title
GB810750A (en) * 1955-08-29 1959-03-25 Libbey Owens Ford Glass Co Electrically conductive transparent articles
JPS622404A (ja) * 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
TW256798B (enExample) * 1992-10-05 1995-09-11 Du Pont
TW261554B (enExample) * 1992-10-05 1995-11-01 Du Pont
US5429657A (en) * 1994-01-05 1995-07-04 E. I. Du Pont De Nemours And Company Method for making silver-palladium alloy powders by aerosol decomposition
US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US7625420B1 (en) * 1997-02-24 2009-12-01 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
US6159267A (en) * 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
EP1386708B1 (en) * 1997-02-24 2014-06-18 Cabot Corporation Particulate products made by an aerosol method
DE19928189A1 (de) 1999-06-19 2001-04-19 Bosch Gmbh Robert Piezoaktor
DE10006352A1 (de) 2000-02-12 2001-08-30 Bosch Gmbh Robert Piezoelektrischer Keramikkörper mit silberhaltigen Innenelektroden
JP4342176B2 (ja) * 2000-10-02 2009-10-14 旭化成イーマテリアルズ株式会社 機能性合金粒子
US6679938B1 (en) * 2001-01-26 2004-01-20 University Of Maryland Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor
JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP3727904B2 (ja) * 2002-05-16 2005-12-21 株式会社ノリタケカンパニーリミテド 金属粉末およびその製造方法
US20050019203A1 (en) * 2003-07-23 2005-01-27 Yuhichi Saitoh Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
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JP2005146406A (ja) * 2003-10-23 2005-06-09 Zenhachi Okumi 微粒子の製造方法及びそのための装置
JP4478526B2 (ja) * 2004-07-20 2010-06-09 大研化学工業株式会社 非合金金属粉末及び合金金属粉末の製造方法
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US8339017B2 (en) * 2005-08-29 2012-12-25 Kyocera Corporation Multi-layer piezoelectric element and injection apparatus using the same
EP1801775A1 (en) * 2005-12-20 2007-06-27 Deutsche Thomson-Brandt Gmbh Method for displaying an image on an organic light emitting display and respective apparatus
US8168889B2 (en) * 2005-12-22 2012-05-01 Namics Corporation Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
KR20090033227A (ko) * 2006-06-19 2009-04-01 캐보트 코포레이션 광전지 전도성 특징부 및 그의 형성 방법
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions

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