JP2011514432A - 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末 - Google Patents

銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末 Download PDF

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Publication number
JP2011514432A
JP2011514432A JP2010524168A JP2010524168A JP2011514432A JP 2011514432 A JP2011514432 A JP 2011514432A JP 2010524168 A JP2010524168 A JP 2010524168A JP 2010524168 A JP2010524168 A JP 2010524168A JP 2011514432 A JP2011514432 A JP 2011514432A
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JP
Japan
Prior art keywords
silver
gas
carrier gas
particles
alloy powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524168A
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English (en)
Japanese (ja)
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JP2011514432A5 (enExample
Inventor
ディヴィッド グリックスマン ハワード
バートラム ディーマー ジュニア ラッセル
コッカー ジョン
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EIDP Inc
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EI Du Pont de Nemours and Co
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011514432A publication Critical patent/JP2011514432A/ja
Publication of JP2011514432A5 publication Critical patent/JP2011514432A5/ja
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/28Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from gaseous metal compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • H01G4/0085Fried electrodes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
JP2010524168A 2007-09-07 2008-09-05 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末 Pending JP2011514432A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US96787307P 2007-09-07 2007-09-07
PCT/US2008/075349 WO2009032984A1 (en) 2007-09-07 2008-09-05 Multi-element alloy powder containing silver and at least two non-silver containing elements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014138667A Division JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末

Publications (2)

Publication Number Publication Date
JP2011514432A true JP2011514432A (ja) 2011-05-06
JP2011514432A5 JP2011514432A5 (enExample) 2011-10-20

Family

ID=39926549

Family Applications (2)

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JP2010524168A Pending JP2011514432A (ja) 2007-09-07 2008-09-05 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末
JP2014138667A Pending JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末

Family Applications After (1)

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JP2014138667A Pending JP2014231642A (ja) 2007-09-07 2014-07-04 銀および少なくとも2種の非銀含有元素を含有する多元素合金粉末

Country Status (7)

Country Link
US (2) US20090066193A1 (enExample)
EP (1) EP2185304B1 (enExample)
JP (2) JP2011514432A (enExample)
KR (1) KR20100066543A (enExample)
CN (1) CN101778684B (enExample)
TW (1) TW200932928A (enExample)
WO (1) WO2009032984A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500332A (ja) * 2008-08-13 2012-01-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー シリコン太陽電池用の多元素金属粉末
WO2014141737A1 (ja) * 2013-03-12 2014-09-18 Jx日鉱日石金属株式会社 スパッタリングターゲット
KR20160003766A (ko) 2013-04-25 2016-01-11 도와 일렉트로닉스 가부시키가이샤 은-비스무트 분말, 도전성 페이스트 및 도전막

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
EP2638990B1 (en) 2010-11-08 2019-05-08 Namics Corporation Manufacturing method for metal particles
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
CN102994797A (zh) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 一种合金粉末
CN103617897A (zh) * 2013-09-29 2014-03-05 魏玲 一种新型三层银/铜双金属复合电触头材料
JP2015109633A (ja) * 2013-10-22 2015-06-11 株式会社大真空 圧電振動素子と当該圧電振動素子を用いた圧電デバイスおよび、前記圧電振動素子の製造方法と当該圧電振動素子を用いた圧電デバイスの製造方法
WO2015109177A2 (en) * 2014-01-17 2015-07-23 E. I. Du Pont De Nemours And Company Improved conductivity thick film pastes containing platinum powder
EP3015567A1 (en) * 2014-10-30 2016-05-04 Heraeus Deutschland GmbH & Co. KG Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds
TWI624969B (zh) * 2015-10-09 2018-05-21 Ngk Spark Plug Co Ltd Piezoelectric element, piezoelectric actuator and piezoelectric transformer
CN108109719A (zh) * 2017-12-21 2018-06-01 惠州市富济电子材料有限公司 一种导电浆料及其制备方法
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06235007A (ja) * 1992-10-05 1994-08-23 E I Du Pont De Nemours & Co エアロゾル分解によるパラジウム及び酸化パラジウム粉末の製造法
JPH07216417A (ja) * 1994-01-05 1995-08-15 E I Du Pont De Nemours & Co エーロゾル分解による銀−パラジウム合金粉末の製造法
WO1998036888A1 (en) * 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP2003328001A (ja) * 2002-05-16 2003-11-19 Noritake Co Ltd 金属粉末およびその製造方法
JP2005146406A (ja) * 2003-10-23 2005-06-09 Zenhachi Okumi 微粒子の製造方法及びそのための装置
JP2006028605A (ja) * 2004-07-20 2006-02-02 Daiken Kagaku Kogyo Kk 非合金金属粉末、合金金属粉末、合金金属粉末の製法及び導電性ペースト
WO2007071597A1 (en) * 2005-12-20 2007-06-28 Thomson Licensing Method for displaying an image on an organic light emitting display and respective apparatus
JP2009541588A (ja) * 2006-06-19 2009-11-26 キャボット コーポレイション 金属含有ナノ粒子、その合成及び使用

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB810750A (en) * 1955-08-29 1959-03-25 Libbey Owens Ford Glass Co Electrically conductive transparent articles
JPS622404A (ja) * 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
TW261554B (enExample) * 1992-10-05 1995-11-01 Du Pont
US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6159267A (en) * 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
EP1386708B1 (en) * 1997-02-24 2014-06-18 Cabot Corporation Particulate products made by an aerosol method
DE19928189A1 (de) 1999-06-19 2001-04-19 Bosch Gmbh Robert Piezoaktor
DE10006352A1 (de) 2000-02-12 2001-08-30 Bosch Gmbh Robert Piezoelektrischer Keramikkörper mit silberhaltigen Innenelektroden
JP4342176B2 (ja) * 2000-10-02 2009-10-14 旭化成イーマテリアルズ株式会社 機能性合金粒子
US6679938B1 (en) * 2001-01-26 2004-01-20 University Of Maryland Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor
US20050019203A1 (en) * 2003-07-23 2005-01-27 Yuhichi Saitoh Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
EP1677369B1 (en) * 2003-09-25 2009-11-11 Kyocera Corporation Multilayer piezoelectric device
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US8339017B2 (en) * 2005-08-29 2012-12-25 Kyocera Corporation Multi-layer piezoelectric element and injection apparatus using the same
US8168889B2 (en) * 2005-12-22 2012-05-01 Namics Corporation Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06235007A (ja) * 1992-10-05 1994-08-23 E I Du Pont De Nemours & Co エアロゾル分解によるパラジウム及び酸化パラジウム粉末の製造法
JPH07216417A (ja) * 1994-01-05 1995-08-15 E I Du Pont De Nemours & Co エーロゾル分解による銀−パラジウム合金粉末の製造法
WO1998036888A1 (en) * 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
JP2001513697A (ja) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP2003328001A (ja) * 2002-05-16 2003-11-19 Noritake Co Ltd 金属粉末およびその製造方法
JP2005146406A (ja) * 2003-10-23 2005-06-09 Zenhachi Okumi 微粒子の製造方法及びそのための装置
JP2006028605A (ja) * 2004-07-20 2006-02-02 Daiken Kagaku Kogyo Kk 非合金金属粉末、合金金属粉末、合金金属粉末の製法及び導電性ペースト
WO2007071597A1 (en) * 2005-12-20 2007-06-28 Thomson Licensing Method for displaying an image on an organic light emitting display and respective apparatus
JP2009541588A (ja) * 2006-06-19 2009-11-26 キャボット コーポレイション 金属含有ナノ粒子、その合成及び使用

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012500332A (ja) * 2008-08-13 2012-01-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー シリコン太陽電池用の多元素金属粉末
WO2014141737A1 (ja) * 2013-03-12 2014-09-18 Jx日鉱日石金属株式会社 スパッタリングターゲット
JP5801496B2 (ja) * 2013-03-12 2015-10-28 Jx日鉱日石金属株式会社 スパッタリングターゲット
KR20160003766A (ko) 2013-04-25 2016-01-11 도와 일렉트로닉스 가부시키가이샤 은-비스무트 분말, 도전성 페이스트 및 도전막
US10458004B2 (en) 2013-04-25 2019-10-29 Dowa Electronics Materials Co., Ltd. Silver-bismuth powder, conductive paste and conductive film

Also Published As

Publication number Publication date
EP2185304A1 (en) 2010-05-19
US20090066193A1 (en) 2009-03-12
CN101778684B (zh) 2015-11-25
KR20100066543A (ko) 2010-06-17
TW200932928A (en) 2009-08-01
EP2185304B1 (en) 2013-07-17
JP2014231642A (ja) 2014-12-11
CN101778684A (zh) 2010-07-14
US20120153238A1 (en) 2012-06-21
WO2009032984A1 (en) 2009-03-12

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