CN101778684B - 包含银以及至少两种含非银的单质的多元素合金粉末 - Google Patents

包含银以及至少两种含非银的单质的多元素合金粉末 Download PDF

Info

Publication number
CN101778684B
CN101778684B CN200880103412.0A CN200880103412A CN101778684B CN 101778684 B CN101778684 B CN 101778684B CN 200880103412 A CN200880103412 A CN 200880103412A CN 101778684 B CN101778684 B CN 101778684B
Authority
CN
China
Prior art keywords
silver
palladium
alloy
carrier gas
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880103412.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN101778684A (zh
Inventor
H·D·格利克斯曼
R·B·小迪默
J·考克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101778684A publication Critical patent/CN101778684A/zh
Application granted granted Critical
Publication of CN101778684B publication Critical patent/CN101778684B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/28—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from gaseous metal compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Powder Metallurgy (AREA)
CN200880103412.0A 2007-09-07 2008-09-05 包含银以及至少两种含非银的单质的多元素合金粉末 Expired - Fee Related CN101778684B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96787307P 2007-09-07 2007-09-07
US60/967,873 2007-09-07
PCT/US2008/075349 WO2009032984A1 (en) 2007-09-07 2008-09-05 Multi-element alloy powder containing silver and at least two non-silver containing elements

Publications (2)

Publication Number Publication Date
CN101778684A CN101778684A (zh) 2010-07-14
CN101778684B true CN101778684B (zh) 2015-11-25

Family

ID=39926549

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880103412.0A Expired - Fee Related CN101778684B (zh) 2007-09-07 2008-09-05 包含银以及至少两种含非银的单质的多元素合金粉末

Country Status (7)

Country Link
US (2) US20090066193A1 (enExample)
EP (1) EP2185304B1 (enExample)
JP (2) JP2011514432A (enExample)
KR (1) KR20100066543A (enExample)
CN (1) CN101778684B (enExample)
TW (1) TW200932928A (enExample)
WO (1) WO2009032984A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704416B2 (en) * 2007-06-29 2010-04-27 E.I. Du Pont De Nemours And Company Conductor paste for ceramic substrate and electric circuit
JP2012500332A (ja) * 2008-08-13 2012-01-05 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー シリコン太陽電池用の多元素金属粉末
WO2012063747A1 (ja) * 2010-11-08 2012-05-18 ナミックス株式会社 金属粒子及びその製造方法
DE102013000057B4 (de) * 2012-01-02 2016-11-24 Wire Technology Co., Ltd. Legierungsdraht und verfahren zur herstellung desselben
CN102994797A (zh) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 一种合金粉末
MY170314A (en) * 2013-03-12 2019-07-17 Jx Nippon Mining & Metals Corp Sputtering target
JP6184731B2 (ja) 2013-04-25 2017-08-23 Ｄｏｗａエレクトロニクス株式会社 銀−ビスマス粉末、導電性ペースト及び導電膜
CN103617897A (zh) * 2013-09-29 2014-03-05 魏玲 一种新型三层银/铜双金属复合电触头材料
JP2015109633A (ja) * 2013-10-22 2015-06-11 株式会社大真空 圧電振動素子と当該圧電振動素子を用いた圧電デバイスおよび、前記圧電振動素子の製造方法と当該圧電振動素子を用いた圧電デバイスの製造方法
US20150203694A1 (en) * 2014-01-17 2015-07-23 E I Du Pont De Nemours And Company Conductivity thick film pastes containing platinum powder
EP3015567A1 (en) * 2014-10-30 2016-05-04 Heraeus Deutschland GmbH & Co. KG Suppression of the formation of hillocks or crystals when sintering metal-organic silver compounds
TWI624969B (zh) 2015-10-09 2018-05-21 Ngk Spark Plug Co Ltd Piezoelectric element, piezoelectric actuator and piezoelectric transformer
CN108109719A (zh) * 2017-12-21 2018-06-01 惠州市富济电子材料有限公司 一种导电浆料及其制备方法
CN115216665B (zh) * 2022-06-29 2023-11-17 重庆科技学院 一种晶体振荡器合金电极及工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1112468A (zh) * 1994-01-05 1995-11-29 纳幕尔杜邦公司 由气溶胶分解制造银-钯合金粉末的方法
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
EP1386708A2 (en) * 1997-02-24 2004-02-04 Superior MicroPowders LLC Particulate products made by an aerosol method

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB810750A (en) * 1955-08-29 1959-03-25 Libbey Owens Ford Glass Co Electrically conductive transparent articles
JPS622404A (ja) * 1985-06-26 1987-01-08 昭栄化学工業株式会社 厚膜ペ−スト
JPS621807A (ja) * 1985-06-26 1987-01-07 Shoei Kagaku Kogyo Kk 金属粉末の製造方法
TW261554B (enExample) * 1992-10-05 1995-11-01 Du Pont
TW256798B (enExample) * 1992-10-05 1995-09-11 Du Pont
US5616165A (en) * 1995-08-25 1997-04-01 E. I. Du Pont De Nemours And Company Method for making gold powders by aerosol decomposition
US6159267A (en) * 1997-02-24 2000-12-12 Superior Micropowders Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
WO1998036888A1 (en) * 1997-02-24 1998-08-27 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
DE19928189A1 (de) 1999-06-19 2001-04-19 Bosch Gmbh Robert Piezoaktor
DE10006352A1 (de) 2000-02-12 2001-08-30 Bosch Gmbh Robert Piezoelektrischer Keramikkörper mit silberhaltigen Innenelektroden
CN1273249C (zh) * 2000-10-02 2006-09-06 旭化成电子材料元件株式会社 基本不含铅的金属合金颗粒及其生产方法和用途
US6679938B1 (en) * 2001-01-26 2004-01-20 University Of Maryland Method of producing metal particles by spray pyrolysis using a co-solvent and apparatus therefor
JP2003178622A (ja) * 2001-12-07 2003-06-27 Nec Tokin Corp 電極ペースト組成物
JP3727904B2 (ja) * 2002-05-16 2005-12-21 株式会社ノリタケカンパニーリミテド 金属粉末およびその製造方法
US20050019203A1 (en) * 2003-07-23 2005-01-27 Yuhichi Saitoh Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
US7679272B2 (en) * 2003-09-25 2010-03-16 Kyocera Corporation Multi-layer piezoelectric element
JP2005146406A (ja) * 2003-10-23 2005-06-09 Zenhachi Okumi 微粒子の製造方法及びそのための装置
JP4478526B2 (ja) * 2004-07-20 2010-06-09 大研化学工業株式会社 非合金金属粉末及び合金金属粉末の製造方法
US7494607B2 (en) * 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
EP1930962B1 (en) * 2005-08-29 2013-03-20 Kyocera Corporation Layered piezoelectric element and injection device using the same
EP1801775A1 (en) * 2005-12-20 2007-06-27 Deutsche Thomson-Brandt Gmbh Method for displaying an image on an organic light emitting display and respective apparatus
EP1965397B1 (en) * 2005-12-22 2019-03-20 Namics Corporation Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste
WO2007149885A2 (en) * 2006-06-19 2007-12-27 Cabot Corporation Security features and processes for forming same
US20140018482A1 (en) * 2012-03-26 2014-01-16 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1112468A (zh) * 1994-01-05 1995-11-29 纳幕尔杜邦公司 由气溶胶分解制造银-钯合金粉末的方法
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
EP1386708A2 (en) * 1997-02-24 2004-02-04 Superior MicroPowders LLC Particulate products made by an aerosol method

Also Published As

Publication number Publication date
EP2185304B1 (en) 2013-07-17
KR20100066543A (ko) 2010-06-17
US20120153238A1 (en) 2012-06-21
JP2014231642A (ja) 2014-12-11
WO2009032984A1 (en) 2009-03-12
US20090066193A1 (en) 2009-03-12
TW200932928A (en) 2009-08-01
EP2185304A1 (en) 2010-05-19
CN101778684A (zh) 2010-07-14
JP2011514432A (ja) 2011-05-06

Similar Documents

Publication Publication Date Title
CN101778684B (zh) 包含银以及至少两种含非银的单质的多元素合金粉末
CN1094405C (zh) 由气溶胶分解制造银－钯合金粉末的方法
TWI277469B (en) Silver particle powder and its production method
KR101354873B1 (ko) 금속 나노입자 분산체
US8293144B2 (en) Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
JP5117420B2 (ja) 銅微粒子分散水溶液の製造方法及び銅微粒子分散水溶液の保管方法
JP2010534932A (ja) レーザー照射による電気伝導性銅パターン層の形成方法
CN1494966A (zh) 用于制造金属粉末的方法
KR20140134172A (ko) 팔라듐-그래핀 나노복합체 기반 수소 센서 및 그의 제조방법
EP2311586A1 (en) Metal microparticle containing composition and process for production of the same
JP4747839B2 (ja) 金属水素化物微粒子を含有する分散液及びその製造方法、並びに金属質材料
TW506869B (en) Method for preparing metal powder
JPH10102108A (ja) 金属粉末の製造方法
JP3812359B2 (ja) 金属粉末の製造方法
JP5232016B2 (ja) 配線形成用材料
KR100508693B1 (ko) 니켈 나노분말의 합성 방법
JP4462019B2 (ja) 酸化銀粉末、その製造方法及び導体ペースト
JP5124822B2 (ja) 複合金属粉体およびその分散液の製造法
CN103209759A (zh) 制备非中空、非碎片球形金属或金属合金颗粒的方法
JP7766207B2 (ja) 貴金属合金粉末、貴金属合金ペースト、貴金属合金膜、およびそれらの製造方法
JP2001059107A (ja) 金属若しくは合金粉末の改質方法とこの改質方法により得られた金属若しくは合金粉末およびこの金属若しくは合金粉末を用いた電子材料若しくは部品
JP3461337B2 (ja) ニッケル粉及び導電ペースト

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20170905

CF01 Termination of patent right due to non-payment of annual fee