JP2011513970A5 - - Google Patents

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Publication number
JP2011513970A5
JP2011513970A5 JP2010548652A JP2010548652A JP2011513970A5 JP 2011513970 A5 JP2011513970 A5 JP 2011513970A5 JP 2010548652 A JP2010548652 A JP 2010548652A JP 2010548652 A JP2010548652 A JP 2010548652A JP 2011513970 A5 JP2011513970 A5 JP 2011513970A5
Authority
JP
Japan
Prior art keywords
ground terminal
substrate
holes
heat spreader
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010548652A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011513970A (ja
JP5226087B2 (ja
Filing date
Publication date
Priority claimed from US12/038,911 external-priority patent/US7968999B2/en
Application filed filed Critical
Publication of JP2011513970A publication Critical patent/JP2011513970A/ja
Publication of JP2011513970A5 publication Critical patent/JP2011513970A5/ja
Application granted granted Critical
Publication of JP5226087B2 publication Critical patent/JP5226087B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010548652A 2008-02-28 2008-11-20 基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ Expired - Fee Related JP5226087B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/038,911 US7968999B2 (en) 2008-02-28 2008-02-28 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
US12/038,911 2008-02-28
PCT/US2008/012957 WO2009108171A1 (en) 2008-02-28 2008-11-20 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

Publications (3)

Publication Number Publication Date
JP2011513970A JP2011513970A (ja) 2011-04-28
JP2011513970A5 true JP2011513970A5 (enExample) 2012-03-08
JP5226087B2 JP5226087B2 (ja) 2013-07-03

Family

ID=41012540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010548652A Expired - Fee Related JP5226087B2 (ja) 2008-02-28 2008-11-20 基板を介してヒートスプレッダ及び補強材を接地する方法、装置及びフリップチップパッケージ

Country Status (7)

Country Link
US (1) US7968999B2 (enExample)
EP (1) EP2248165B1 (enExample)
JP (1) JP5226087B2 (enExample)
KR (1) KR101177039B1 (enExample)
CN (1) CN101960586B (enExample)
TW (1) TWI379364B (enExample)
WO (1) WO2009108171A1 (enExample)

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Publication number Priority date Publication date Assignee Title
US20090321925A1 (en) * 2008-06-30 2009-12-31 Gealer Charles A Injection molded metal ic package stiffener and package-to-package interconnect frame
US8247900B2 (en) * 2009-12-29 2012-08-21 Taiwan Semiconductor Manufacturing Company, Ltd. Flip chip package having enhanced thermal and mechanical performance
US9254532B2 (en) 2009-12-30 2016-02-09 Intel Corporation Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US20110292612A1 (en) * 2010-05-26 2011-12-01 Lsi Corporation Electronic device having electrically grounded heat sink and method of manufacturing the same
US8823407B2 (en) 2012-03-01 2014-09-02 Integrated Device Technology, Inc. Test assembly for verifying heat spreader grounding in a production test
US9041192B2 (en) * 2012-08-29 2015-05-26 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8946871B2 (en) 2012-11-07 2015-02-03 Lsi Corporation Thermal improvement of integrated circuit packages
US9607951B2 (en) 2013-08-05 2017-03-28 Mediatek Singapore Pte. Ltd. Chip package
US9282649B2 (en) * 2013-10-08 2016-03-08 Cisco Technology, Inc. Stand-off block
US9735043B2 (en) 2013-12-20 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packaging structure and process
CN105514080B (zh) * 2014-10-11 2018-12-04 意法半导体有限公司 具有再分布层和加强件的电子器件及相关方法
US9460980B2 (en) * 2015-02-18 2016-10-04 Qualcomm Incorporated Systems, apparatus, and methods for heat dissipation
JP6569375B2 (ja) * 2015-08-11 2019-09-04 株式会社ソシオネクスト 半導体装置、半導体装置の製造方法及び電子装置
US20170053858A1 (en) * 2015-08-20 2017-02-23 Intel Corporation Substrate on substrate package
US20170170087A1 (en) 2015-12-14 2017-06-15 Intel Corporation Electronic package that includes multiple supports
US20170287799A1 (en) * 2016-04-01 2017-10-05 Steven A. Klein Removable ic package stiffener
CN107708328A (zh) * 2017-06-27 2018-02-16 安徽华东光电技术研究所 提高芯片充分接地和散热的焊接方法
JP6579396B2 (ja) * 2017-07-18 2019-09-25 株式会社ダイレクト・アール・エフ 半導体装置、及び基板
US20190206839A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Electronic device package
US11081450B2 (en) * 2019-09-27 2021-08-03 Intel Corporation Radiation shield around a component on a substrate
CN115116860B (zh) * 2022-06-17 2025-10-28 北京比特大陆科技有限公司 芯片封装方法及芯片

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US5736074A (en) * 1995-06-30 1998-04-07 Micro Fab Technologies, Inc. Manufacture of coated spheres
JP3437369B2 (ja) 1996-03-19 2003-08-18 松下電器産業株式会社 チップキャリアおよびこれを用いた半導体装置
JP2770820B2 (ja) * 1996-07-01 1998-07-02 日本電気株式会社 半導体装置の実装構造
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