JP2011511443A - 放射受光器およびその製造方法 - Google Patents
放射受光器およびその製造方法 Download PDFInfo
- Publication number
- JP2011511443A JP2011511443A JP2010544569A JP2010544569A JP2011511443A JP 2011511443 A JP2011511443 A JP 2011511443A JP 2010544569 A JP2010544569 A JP 2010544569A JP 2010544569 A JP2010544569 A JP 2010544569A JP 2011511443 A JP2011511443 A JP 2011511443A
- Authority
- JP
- Japan
- Prior art keywords
- active region
- region
- radiation
- active
- radiation receiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 152
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 96
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 230000003595 spectral effect Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 32
- 238000011144 upstream manufacturing Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 72
- 230000004888 barrier function Effects 0.000 description 27
- 230000035945 sensitivity Effects 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000002800 charge carrier Substances 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000003631 wet chemical etching Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/148—Shapes of potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/223—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008006987A DE102008006987A1 (de) | 2008-01-31 | 2008-01-31 | Strahlungsempfänger und Verfahren zur Herstellung eines Strahlungsempfängers |
| PCT/DE2008/002126 WO2009094966A2 (de) | 2008-01-31 | 2008-12-17 | Strahlungsempfänger und verfahren zur herstellung eines strahlungsempfängers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011511443A true JP2011511443A (ja) | 2011-04-07 |
| JP2011511443A5 JP2011511443A5 (enExample) | 2012-02-09 |
Family
ID=40719994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010544569A Pending JP2011511443A (ja) | 2008-01-31 | 2008-12-17 | 放射受光器およびその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8659107B2 (enExample) |
| EP (1) | EP2238624B1 (enExample) |
| JP (1) | JP2011511443A (enExample) |
| KR (1) | KR20100109563A (enExample) |
| CN (1) | CN101933142B (enExample) |
| DE (1) | DE102008006987A1 (enExample) |
| TW (1) | TWI396293B (enExample) |
| WO (1) | WO2009094966A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062504A (ja) * | 2011-09-13 | 2013-04-04 | Boeing Co:The | 二色性フォトダイオード |
| JP2013120880A (ja) * | 2011-12-08 | 2013-06-17 | Technical Research & Development Institute Ministry Of Defence | 光検知素子及び光検知素子の製造方法 |
| US11070748B2 (en) | 2018-08-01 | 2021-07-20 | Fujitsu Limited | Infrared detector, infrared imaging apparatus using the same, and controlling method of infrared detector |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008006987A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsempfänger und Verfahren zur Herstellung eines Strahlungsempfängers |
| KR101456376B1 (ko) | 2013-04-24 | 2014-10-31 | 한국과학기술원 | 조립식 왕복 지지체를 가지는 진공 단열체의 구조 |
| CN103247638B (zh) * | 2013-04-27 | 2015-08-05 | 中国科学院苏州纳米技术与纳米仿生研究所 | 红外探测器及其制作方法 |
| US11158754B1 (en) * | 2013-08-09 | 2021-10-26 | Hrl Laboratories, Llc | Back-to-back dual band p-CB-n |
| WO2016069960A1 (en) * | 2014-10-29 | 2016-05-06 | Digital Direct Ir Inc. | Spherical detector arrays implemented using passive detector structures for thermal imaging applications |
| DE102015013514B4 (de) * | 2015-10-20 | 2024-04-18 | Azur Space Solar Power Gmbh | Optischer Empfängerbaustein |
| US10964862B2 (en) * | 2016-09-30 | 2021-03-30 | Sensor Electronic Technology, Inc. | Semiconductor heterostructure with multiple active regions |
| DE102018111319A1 (de) | 2018-05-11 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105569A (ja) * | 1981-12-16 | 1983-06-23 | Matsushita Electric Ind Co Ltd | 半導体受光装置 |
| JP2006013531A (ja) * | 1998-05-28 | 2006-01-12 | Emcore Corp | バイパスダイオードを有する太陽電池 |
| JP2006510200A (ja) * | 2002-12-11 | 2006-03-23 | フィニサー コーポレイション | 光トランシーバ |
| JP2006108675A (ja) * | 2004-09-30 | 2006-04-20 | Osram Opto Semiconductors Gmbh | ビーム検出器 |
| JP2007520071A (ja) * | 2004-01-29 | 2007-07-19 | エルヴェーエー・スペース・ソーラー・パワー・ゲーエムベーハー | 活性領域を有する半導体構造 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4496788A (en) * | 1982-12-29 | 1985-01-29 | Osaka Transformer Co., Ltd. | Photovoltaic device |
| US4677289A (en) | 1984-11-12 | 1987-06-30 | Kabushiki Kaisha Toshiba | Color sensor |
| DE3533146A1 (de) | 1985-09-17 | 1987-03-26 | Siemens Ag | Farbsensorelement, farbempfindliche sensoranordnung mit derartigen farbsensorelementen, eine anwendung des elements oder der anordnung und ein verfahren zur herstellung eines halbleitermaterials fuer das farbsensorelement |
| JPS6394125A (ja) * | 1986-10-08 | 1988-04-25 | Yamatake Honeywell Co Ltd | カラ−センサ |
| US4894526A (en) * | 1987-01-15 | 1990-01-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Infrared-radiation detector device |
| GB2228824A (en) | 1989-03-01 | 1990-09-05 | Gen Electric Co Plc | Radiation detectors |
| EP0400399A3 (de) * | 1989-05-31 | 1991-05-29 | Siemens Aktiengesellschaft | Monolithisch integrierte Photodiode-FET-Kombination |
| US5518934A (en) | 1994-07-21 | 1996-05-21 | Trustees Of Princeton University | Method of fabricating multiwavelength infrared focal plane array detector |
| US5552603A (en) * | 1994-09-15 | 1996-09-03 | Martin Marietta Corporation | Bias and readout for multicolor quantum well detectors |
| FR2756666B1 (fr) | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques |
| JP3542965B2 (ja) * | 1997-10-16 | 2004-07-14 | カリフォルニア インスティチュート オブ テクノロジー | デュアルバンド量子井戸赤外線センシングアレイ |
| US7291858B2 (en) * | 1999-12-24 | 2007-11-06 | Bae Systems Information And Electronic Systems Integration Inc. | QWIP with tunable spectral response |
| WO2003073517A1 (en) * | 2002-02-27 | 2003-09-04 | Midwest Research Institute | Monolithic photovoltaic energy conversion device |
| US20060162768A1 (en) | 2002-05-21 | 2006-07-27 | Wanlass Mark W | Low bandgap, monolithic, multi-bandgap, optoelectronic devices |
| US6822991B2 (en) | 2002-09-30 | 2004-11-23 | Lumileds Lighting U.S., Llc | Light emitting devices including tunnel junctions |
| KR100542720B1 (ko) | 2003-06-03 | 2006-01-11 | 삼성전기주식회사 | GaN계 접합 구조 |
| CN1275337C (zh) | 2003-09-17 | 2006-09-13 | 北京工大智源科技发展有限公司 | 高效高亮度多有源区隧道再生白光发光二极管 |
| DE102004037020B4 (de) | 2003-09-30 | 2021-10-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsdetektor zur Detektion von Strahlung gemäß einer vorgegebenen spektralen Empfindlichkeitsverteilung |
| US7271405B2 (en) * | 2003-10-14 | 2007-09-18 | Stc.Unm | Intersubband detector with avalanche multiplier region |
| US8212285B2 (en) | 2004-03-31 | 2012-07-03 | Osram Opto Semiconductors Gmbh | Radiation detector |
| JP2006066456A (ja) | 2004-08-24 | 2006-03-09 | Fuji Photo Film Co Ltd | 固体撮像素子 |
| DE102005001280B4 (de) | 2004-09-30 | 2022-03-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsdetektor |
| DE102005013668B3 (de) | 2005-03-14 | 2006-11-16 | Universität Stuttgart | Solarzelle |
| DE102005043918B4 (de) * | 2005-05-30 | 2014-12-04 | Osram Opto Semiconductors Gmbh | Detektoranordnung und Verfahren zur Bestimmung spektraler Anteile in einer auf eine Detektoranordnung einfallenden Strahlung |
| DE102006015788A1 (de) | 2006-01-27 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102008006987A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsempfänger und Verfahren zur Herstellung eines Strahlungsempfängers |
| DE102008016100A1 (de) | 2008-03-28 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelektronischer Strahlungsdetektor und Verfahren zur Herstellung einer Mehrzahl von Detektorelementen |
| US7821807B2 (en) * | 2008-04-17 | 2010-10-26 | Epir Technologies, Inc. | Nonequilibrium photodetectors with single carrier species barriers |
-
2008
- 2008-01-31 DE DE102008006987A patent/DE102008006987A1/de not_active Withdrawn
- 2008-12-17 US US12/746,121 patent/US8659107B2/en not_active Expired - Fee Related
- 2008-12-17 JP JP2010544569A patent/JP2011511443A/ja active Pending
- 2008-12-17 WO PCT/DE2008/002126 patent/WO2009094966A2/de not_active Ceased
- 2008-12-17 KR KR1020107019154A patent/KR20100109563A/ko not_active Ceased
- 2008-12-17 CN CN2008801259321A patent/CN101933142B/zh not_active Expired - Fee Related
- 2008-12-17 EP EP08871711.1A patent/EP2238624B1/de not_active Not-in-force
-
2009
- 2009-01-16 TW TW098101515A patent/TWI396293B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58105569A (ja) * | 1981-12-16 | 1983-06-23 | Matsushita Electric Ind Co Ltd | 半導体受光装置 |
| JP2006013531A (ja) * | 1998-05-28 | 2006-01-12 | Emcore Corp | バイパスダイオードを有する太陽電池 |
| JP2006510200A (ja) * | 2002-12-11 | 2006-03-23 | フィニサー コーポレイション | 光トランシーバ |
| JP2007520071A (ja) * | 2004-01-29 | 2007-07-19 | エルヴェーエー・スペース・ソーラー・パワー・ゲーエムベーハー | 活性領域を有する半導体構造 |
| JP2006108675A (ja) * | 2004-09-30 | 2006-04-20 | Osram Opto Semiconductors Gmbh | ビーム検出器 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013062504A (ja) * | 2011-09-13 | 2013-04-04 | Boeing Co:The | 二色性フォトダイオード |
| JP2013120880A (ja) * | 2011-12-08 | 2013-06-17 | Technical Research & Development Institute Ministry Of Defence | 光検知素子及び光検知素子の製造方法 |
| US11070748B2 (en) | 2018-08-01 | 2021-07-20 | Fujitsu Limited | Infrared detector, infrared imaging apparatus using the same, and controlling method of infrared detector |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI396293B (zh) | 2013-05-11 |
| EP2238624A2 (de) | 2010-10-13 |
| CN101933142B (zh) | 2012-08-29 |
| TW200941751A (en) | 2009-10-01 |
| KR20100109563A (ko) | 2010-10-08 |
| WO2009094966A3 (de) | 2009-10-08 |
| EP2238624B1 (de) | 2013-06-05 |
| DE102008006987A1 (de) | 2009-08-06 |
| US8659107B2 (en) | 2014-02-25 |
| US20100258892A1 (en) | 2010-10-14 |
| WO2009094966A2 (de) | 2009-08-06 |
| CN101933142A (zh) | 2010-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011511443A (ja) | 放射受光器およびその製造方法 | |
| JP5166687B2 (ja) | ビーム検出器 | |
| CN207250518U (zh) | 盖革模式雪崩光电二极管阵列、光电子器件和检测系统 | |
| US7932496B2 (en) | Infrared detector, infrared detecting apparatus, and method of manufacturing infrared detector | |
| US8405065B2 (en) | LED semiconductor body | |
| US11133427B2 (en) | Light receiving device | |
| CN104285135B (zh) | 光检测器 | |
| US9685584B2 (en) | Light emitting semiconductor component including an absorptive layer | |
| JP2011077165A (ja) | 光検出素子、光検出装置及び赤外線検出素子、赤外線検出装置 | |
| KR102108718B1 (ko) | 광전자 반도체 칩 및 광전자 반도체 칩들의 제조 방법 | |
| US8212285B2 (en) | Radiation detector | |
| KR101395266B1 (ko) | 방사선 검출기 | |
| CN101981696A (zh) | 光电射线检测器和用于制造多个检测器元件的方法 | |
| US10510916B2 (en) | Component for detecting UV radiation and method for producing a component | |
| KR100887458B1 (ko) | 광소자의 제조 방법 및 광소자 웨이퍼 | |
| US8558339B1 (en) | Photo diode array | |
| JP2014029940A (ja) | 光検出器、これを用いた撮像装置、及び光検出器の製造方法 | |
| TWI567893B (zh) | 半導體元件之電性接觸結構及半導體元件 | |
| CN115799360A (zh) | 光电元件 | |
| JP4269180B2 (ja) | 光素子の製造方法 | |
| RU2647979C1 (ru) | Способ изготовления диодов средневолнового ик диапазона спектра | |
| CN113903826B (zh) | 双色宽谱段探测器、双色宽谱段探测器阵列及制作方法 | |
| JP2004095692A (ja) | 量子井戸型光検知装置 | |
| CN120958983A (zh) | 传感器、用于制造传感器的方法、电子设备以及用于运行传感器的方法 | |
| JPH11195806A (ja) | 半導体受光素子 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111213 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111213 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130628 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130702 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130926 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131003 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131226 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140603 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140826 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140902 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150401 |