JP2011503348A - 組成物および高い伝導性を有するパターニングされた金属層の提供方法 - Google Patents

組成物および高い伝導性を有するパターニングされた金属層の提供方法 Download PDF

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Publication number
JP2011503348A
JP2011503348A JP2010531216A JP2010531216A JP2011503348A JP 2011503348 A JP2011503348 A JP 2011503348A JP 2010531216 A JP2010531216 A JP 2010531216A JP 2010531216 A JP2010531216 A JP 2010531216A JP 2011503348 A JP2011503348 A JP 2011503348A
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JP
Japan
Prior art keywords
layer
catalyst
patterned
metal
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2010531216A
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English (en)
Japanese (ja)
Other versions
JP2011503348A5 (enExample
Inventor
フェン・ガオ
リンダ・ケイ・ジョンソン
ルーパン・レオン・クゥセイヤン
ダレン・イー・キーズ
アイリーナ・マラジョヴィック
リナルド・ソリア・シフィーノ
フレドリック・クラウス・ズムステッグジュニア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011503348A publication Critical patent/JP2011503348A/ja
Publication of JP2011503348A5 publication Critical patent/JP2011503348A5/ja
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B41M5/38214—Structural details, e.g. multilayer systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/392—Additives, other than colour forming substances, dyes or pigments, e.g. sensitisers, transfer promoting agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Insulated Conductors (AREA)
JP2010531216A 2007-10-23 2008-10-23 組成物および高い伝導性を有するパターニングされた金属層の提供方法 Abandoned JP2011503348A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/877,637 US7666568B2 (en) 2007-10-23 2007-10-23 Composition and method for providing a patterned metal layer having high conductivity
PCT/US2008/080851 WO2009055515A1 (en) 2007-10-23 2008-10-23 Composition and method for providing a patterned metal layer having high conductivity

Publications (2)

Publication Number Publication Date
JP2011503348A true JP2011503348A (ja) 2011-01-27
JP2011503348A5 JP2011503348A5 (enExample) 2011-12-08

Family

ID=40219442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010531216A Abandoned JP2011503348A (ja) 2007-10-23 2008-10-23 組成物および高い伝導性を有するパターニングされた金属層の提供方法

Country Status (7)

Country Link
US (1) US7666568B2 (enExample)
EP (1) EP2200838B1 (enExample)
JP (1) JP2011503348A (enExample)
KR (1) KR20100087018A (enExample)
CN (1) CN101835624B (enExample)
AT (1) ATE529266T1 (enExample)
WO (1) WO2009055515A1 (enExample)

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KR20140023779A (ko) * 2012-08-17 2014-02-27 삼성디스플레이 주식회사 차광 부재 및 이를 포함하는 표시 장치
JP2014074191A (ja) * 2012-10-02 2014-04-24 Kanto Gakuin 無電解めっき方法及び無電解めっき膜
JP2015014044A (ja) * 2013-06-03 2015-01-22 株式会社レグルス プラスチック製成形品への回路パターンの形成方法、これに用いる塗工液及び該方法で形成された回路パターン
JP2015507698A (ja) * 2011-12-27 2015-03-12 シェンゼェン ビーワイディー オート アールアンドディー カンパニーリミテッド 表面にメッキする方法及び得ることが可能な物品
WO2016051971A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム
WO2016103510A1 (ja) * 2014-12-26 2016-06-30 日本テクノリード株式会社 透明基板上にパターニングされた導電性高分子層を有する積層基板の製造方法及びメタルメッシュ基板の製造方法
JP2016211028A (ja) * 2015-05-01 2016-12-15 株式会社イオックス 無電解めっき用転写フィルム用触媒組成物及び無電解めっき用転写フィルム
JP2016216832A (ja) * 2011-05-18 2016-12-22 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
JP2019514207A (ja) * 2016-03-31 2019-05-30 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 導電めっきのためのレーザシーディング

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TW201445006A (zh) * 2013-05-23 2014-12-01 Byd Co Ltd 聚合物製品表面選擇性金屬化方法及其製備的聚合物製品
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JP6239647B2 (ja) * 2013-08-01 2017-11-29 エルジー・ケム・リミテッド ３次元構造の金属パターンの製造方法
JP6079505B2 (ja) 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
US9648737B2 (en) * 2013-08-26 2017-05-09 Mitsubishi Materials Corporation Bonded body and power module substrate
KR20150057032A (ko) * 2013-11-18 2015-05-28 삼성전기주식회사 터치 패널 및 그의 제조 방법
JP2015164030A (ja) 2014-01-31 2015-09-10 住友金属鉱山株式会社 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法
CN103935078B (zh) * 2014-04-04 2016-08-24 刘从余 一种复合片材及其制备方法和设备
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TWI584708B (zh) * 2014-11-28 2017-05-21 財團法人工業技術研究院 導線結構及其製造方法
KR102412896B1 (ko) 2014-12-18 2022-06-24 삼성전자 주식회사 단말의 설비 제어를 지원하는 방법 및 장치
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KR20170012679A (ko) 2015-07-22 2017-02-03 희성전자 주식회사 터치 센서의 제조 방법 및 이 방법으로 제조되는 터치 센서
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JP2016216832A (ja) * 2011-05-18 2016-12-22 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
JP2015507698A (ja) * 2011-12-27 2015-03-12 シェンゼェン ビーワイディー オート アールアンドディー カンパニーリミテッド 表面にメッキする方法及び得ることが可能な物品
US9512522B2 (en) 2011-12-27 2016-12-06 Shenzhen Byd Auto R&D Company Limited Method of metalizing surface and article obtainable
KR20140023779A (ko) * 2012-08-17 2014-02-27 삼성디스플레이 주식회사 차광 부재 및 이를 포함하는 표시 장치
KR101983691B1 (ko) 2012-08-17 2019-05-30 삼성디스플레이 주식회사 차광 부재 및 이를 포함하는 표시 장치
JP2014074191A (ja) * 2012-10-02 2014-04-24 Kanto Gakuin 無電解めっき方法及び無電解めっき膜
JP2015014044A (ja) * 2013-06-03 2015-01-22 株式会社レグルス プラスチック製成形品への回路パターンの形成方法、これに用いる塗工液及び該方法で形成された回路パターン
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JPWO2016051971A1 (ja) * 2014-09-29 2017-06-29 富士フイルム株式会社 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム
WO2016103510A1 (ja) * 2014-12-26 2016-06-30 日本テクノリード株式会社 透明基板上にパターニングされた導電性高分子層を有する積層基板の製造方法及びメタルメッシュ基板の製造方法
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EP2200838B1 (en) 2011-10-19
ATE529266T1 (de) 2011-11-15
US20090104572A1 (en) 2009-04-23
CN101835624A (zh) 2010-09-15
EP2200838A1 (en) 2010-06-30
WO2009055515A1 (en) 2009-04-30
KR20100087018A (ko) 2010-08-02
US7666568B2 (en) 2010-02-23

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