JP2011503348A5 - - Google Patents

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Publication number
JP2011503348A5
JP2011503348A5 JP2010531216A JP2010531216A JP2011503348A5 JP 2011503348 A5 JP2011503348 A5 JP 2011503348A5 JP 2010531216 A JP2010531216 A JP 2010531216A JP 2010531216 A JP2010531216 A JP 2010531216A JP 2011503348 A5 JP2011503348 A5 JP 2011503348A5
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JP
Japan
Prior art keywords
layer
catalyst
patterned
metal
fraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2010531216A
Other languages
English (en)
Japanese (ja)
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JP2011503348A (ja
Filing date
Publication date
Priority claimed from US11/877,637 external-priority patent/US7666568B2/en
Application filed filed Critical
Publication of JP2011503348A publication Critical patent/JP2011503348A/ja
Publication of JP2011503348A5 publication Critical patent/JP2011503348A5/ja
Abandoned legal-status Critical Current

Links

JP2010531216A 2007-10-23 2008-10-23 組成物および高い伝導性を有するパターニングされた金属層の提供方法 Abandoned JP2011503348A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/877,637 US7666568B2 (en) 2007-10-23 2007-10-23 Composition and method for providing a patterned metal layer having high conductivity
PCT/US2008/080851 WO2009055515A1 (en) 2007-10-23 2008-10-23 Composition and method for providing a patterned metal layer having high conductivity

Publications (2)

Publication Number Publication Date
JP2011503348A JP2011503348A (ja) 2011-01-27
JP2011503348A5 true JP2011503348A5 (enExample) 2011-12-08

Family

ID=40219442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010531216A Abandoned JP2011503348A (ja) 2007-10-23 2008-10-23 組成物および高い伝導性を有するパターニングされた金属層の提供方法

Country Status (7)

Country Link
US (1) US7666568B2 (enExample)
EP (1) EP2200838B1 (enExample)
JP (1) JP2011503348A (enExample)
KR (1) KR20100087018A (enExample)
CN (1) CN101835624B (enExample)
AT (1) ATE529266T1 (enExample)
WO (1) WO2009055515A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2401669B1 (en) * 2009-02-26 2016-04-06 3M Innovative Properties Company Touch screen sensor and patterned substrate having overlaid micropatterns with low visibility
US20110279398A1 (en) * 2010-05-12 2011-11-17 Harald Philipp Touch screen electrode enhancements
GB201009847D0 (en) * 2010-06-11 2010-07-21 Dzp Technologies Ltd Deposition method, apparatus, printed object and uses
CN102465259A (zh) * 2010-11-11 2012-05-23 鸿富锦精密工业（深圳）有限公司 塑料表面电磁屏蔽处理方法及其制品
US10526198B2 (en) * 2011-03-04 2020-01-07 Texas Instruments Incorporated Infrared sensor design using an epoxy film as an infrared absorption layer
CN103534049B (zh) * 2011-05-18 2016-11-02 户田工业株式会社 铜粉末、铜膏、导电性涂膜的制造方法和导电性涂膜
KR20130007042A (ko) * 2011-06-28 2013-01-18 삼성디스플레이 주식회사 열전사용 도너 필름, 이의 제조 방법 및 이를 이용한 유기 발광 소자의 제조 방법
WO2013054475A1 (ja) * 2011-10-14 2013-04-18 キヤノン株式会社 電子写真用部材、プロセスカートリッジおよび電子写真装置
CN103184440B (zh) 2011-12-27 2015-12-02 比亚迪股份有限公司 一种表面选择性金属化的制品及其制备方法
CN104246913B (zh) * 2012-04-18 2016-08-24 Lg化学株式会社 导电结构及其制备方法
KR101983691B1 (ko) * 2012-08-17 2019-05-30 삼성디스플레이 주식회사 차광 부재 및 이를 포함하는 표시 장치
JP5694265B2 (ja) * 2012-10-02 2015-04-01 学校法人関東学院 無電解めっき方法及び無電解めっき膜
KR101468690B1 (ko) * 2012-11-19 2014-12-04 엔젯 주식회사 고점도 전도성 나노 잉크 조성물로 이루어진 전극선을 포함하는 투명전극 및 이를 이용한 터치센서, 투명히터 및 전자파 차폐제
TW201445006A (zh) * 2013-05-23 2014-12-01 Byd Co Ltd 聚合物製品表面選擇性金屬化方法及其製備的聚合物製品
JP6275482B2 (ja) * 2013-06-03 2018-02-07 株式会社レグルス プラスチック製成形品への回路パターンの形成方法及びこれに用いる塗工液
US9448666B2 (en) 2013-06-08 2016-09-20 Microsoft Technology Licensing, Llc Dark film lamination for a touch sensor
WO2014209575A1 (en) * 2013-06-24 2014-12-31 University Of Houston System Metallic nanomesh
RU2554608C2 (ru) * 2013-07-01 2015-06-27 Общество с ограниченной ответственностью "Солар" Способ получения просветляющего покрытия
JP6239647B2 (ja) * 2013-08-01 2017-11-29 エルジー・ケム・リミテッド ３次元構造の金属パターンの製造方法
JP6079505B2 (ja) 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
KR102131484B1 (ko) * 2013-08-26 2020-07-07 미쓰비시 마테리알 가부시키가이샤 접합체 및 파워 모듈용 기판
KR20150057032A (ko) * 2013-11-18 2015-05-28 삼성전기주식회사 터치 패널 및 그의 제조 방법
JP2015164030A (ja) 2014-01-31 2015-09-10 住友金属鉱山株式会社 導電性基板、積層導電性基板、導電性基板の製造方法、及び積層導電性基板の製造方法
JP5829746B1 (ja) * 2014-04-04 2015-12-09 キヤノン・コンポーネンツ株式会社 導電膜及びその製造方法並びにめっき皮膜付樹脂製品及びその製造方法
CN103935078B (zh) * 2014-04-04 2016-08-24 刘从余 一种复合片材及其制备方法和设备
WO2016051971A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 積層体、導電性積層体およびその製造方法、タッチパネルセンサー、タッチパネル、転写フィルム
CN104294244B (zh) * 2014-10-24 2017-05-31 中国科学院上海光学精密机械研究所 激光辅助化学混合镀实现二维表面金属结构的方法
TWI584708B (zh) * 2014-11-28 2017-05-21 財團法人工業技術研究院 導線結構及其製造方法
US20190053381A1 (en) * 2014-11-28 2019-02-14 Industrial Technology Research Institute Structure of conductive lines and method of manufacturing the same
KR102412896B1 (ko) 2014-12-18 2022-06-24 삼성전자 주식회사 단말의 설비 제어를 지원하는 방법 및 장치
CN107210097A (zh) * 2014-12-26 2017-09-26 日本科技先进有限公司 在透明基板上具有图案化的导电性高分子层的层叠基板的制造方法以及金属网基板的制造方法
WO2016127362A1 (zh) * 2015-02-12 2016-08-18 四川大学华西医院 一种磁共振用鼠标及其制作方法和信号传输装置
JP5843992B1 (ja) * 2015-05-01 2016-01-13 株式会社イオックス 無電解めっき用転写フィルム用触媒組成物及び無電解めっき用転写フィルム
KR20170012679A (ko) 2015-07-22 2017-02-03 희성전자 주식회사 터치 센서의 제조 방법 및 이 방법으로 제조되는 터치 센서
US9915002B2 (en) * 2015-09-21 2018-03-13 Ethan Pfeiffer System and method for producing a nano metal mesh using a brittle film template for lithography
US10957615B2 (en) * 2016-03-31 2021-03-23 Electro Scientific Industries, Inc Laser-seeding for electro-conductive plating
CN109492504B (zh) * 2017-09-12 2023-07-04 江西欧迈斯微电子有限公司 超声波生物识别装置及其制备方法和电子设备
TWI646672B (zh) 2017-12-01 2019-01-01 財團法人工業技術研究院 紅外線感測元件及其製造方法
US10519595B2 (en) 2017-12-29 2019-12-31 Industrial Technology Research Institute Composite textile
WO2019234233A2 (de) * 2018-06-07 2019-12-12 Continental Automotive Gmbh Schwarz gefärbter gegenstand mit einer elektromagnetischen- oder elektrischen feld funktion
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
CN117845201B (zh) * 2024-01-03 2025-03-14 江苏未来像素科技有限公司 一种复合铜箔及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743091A (en) * 1986-10-30 1988-05-10 Daniel Gelbart Two dimensional laser diode array
EP0308518B1 (en) 1987-04-06 1995-07-05 Sigmax Ltd. Ink receiving flexible sheet for printing a pattern on an object by firing and label comprising said sheet
US5256506A (en) * 1990-10-04 1993-10-26 Graphics Technology International Inc. Ablation-transfer imaging/recording
SE9200564L (sv) * 1992-02-26 1993-03-15 Perstorp Ab Dendritisk makromolekyl av polyestertyp, foerfarande foer framstaellning daerav samt anvaendning daerav
US5994489A (en) * 1994-10-24 1999-11-30 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
SE503342C2 (sv) * 1994-10-24 1996-05-28 Perstorp Ab Hyperförgrenad makromolekyl av polyestertyp samt förfarande för dess framställning
JP3585598B2 (ja) 1995-08-25 2004-11-04 大日本印刷株式会社 熱転写シート
US6207268B1 (en) * 1996-11-12 2001-03-27 Dai Nippon Printing Co., Ltd. Transfer sheet, and pattern-forming method
US6822068B2 (en) * 1998-12-22 2004-11-23 Bayer Aktiengesellschaft Method for producing highly-branched glycidol-based polyols
SE514207C2 (sv) * 1999-03-23 2001-01-22 Perstorp Ab Hyperförgrenad dendritisk polyeter och förfarande för framställning därav
EP1270200A1 (en) * 1999-12-28 2003-01-02 Nippon Shokubai Co., Ltd. Multilayer material
US6228555B1 (en) * 1999-12-28 2001-05-08 3M Innovative Properties Company Thermal mass transfer donor element
US6645681B2 (en) * 2000-12-15 2003-11-11 E. I. Du Pont De Nemours And Company Color filter
JP2002185184A (ja) 2000-12-18 2002-06-28 Dainippon Printing Co Ltd 電磁波シールド材及びその製造方法
JP4668438B2 (ja) * 2001-03-08 2011-04-13 住友ゴム工業株式会社 電磁波シールド板及びその製造方法
JP2003025510A (ja) * 2001-07-16 2003-01-29 Shin Etsu Chem Co Ltd 反射防止性及び耐擦傷性を有する多層積層体
MXPA04002179A (es) * 2001-09-08 2004-06-29 Astrazeneca Ab Derivados de benzotiazepina y benzotiadiazepina con actividad inhibidora de transporte del acido ileal biliar (ibat) para tratar hiperlipidemia.
US6767980B2 (en) * 2002-04-19 2004-07-27 Nippon Shokubai Co., Ltd. Reactive diluent and curable resin composition
JP2005534046A (ja) 2002-05-17 2005-11-10 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー カラーフィルタのサーマルプリンティングのドナー要素用の低分子量アクリルコポリマーラテックス
CA2485166A1 (en) * 2002-05-21 2003-12-04 Amgen Inc. Substituted pyrimidinone and pyridinone compounds
US7749620B2 (en) * 2002-07-12 2010-07-06 Fujimori Kogyo Co., Ltd. Electromagnetic wave shield material and process for producing the same
KR100667067B1 (ko) * 2004-09-08 2007-01-10 삼성에스디아이 주식회사 레이저 전사용 도너 기판 및 그 기판을 사용하여 제조되는유기 전계 발광 소자
US7270887B2 (en) * 2004-10-13 2007-09-18 Shin-Etsu Chemical Co., Ltd. Antireflective coating, coating composition, and antireflective coated article
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
US7927454B2 (en) * 2007-07-17 2011-04-19 Samsung Mobile Display Co., Ltd. Method of patterning a substrate

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