JP2011502817A5 - - Google Patents
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- Publication number
- JP2011502817A5 JP2011502817A5 JP2010532264A JP2010532264A JP2011502817A5 JP 2011502817 A5 JP2011502817 A5 JP 2011502817A5 JP 2010532264 A JP2010532264 A JP 2010532264A JP 2010532264 A JP2010532264 A JP 2010532264A JP 2011502817 A5 JP2011502817 A5 JP 2011502817A5
- Authority
- JP
- Japan
- Prior art keywords
- mold
- daughter
- ductile metal
- silicone
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001296 polysiloxane Polymers 0.000 claims 15
- 239000002184 metal Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 12
- 238000000034 method Methods 0.000 claims 9
- 238000000151 deposition Methods 0.000 claims 5
- 229910052759 nickel Inorganic materials 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US98461607P | 2007-11-01 | 2007-11-01 | |
| US60/984,616 | 2007-11-01 | ||
| PCT/US2008/081928 WO2009059089A1 (en) | 2007-11-01 | 2008-10-31 | Method for replicating master molds |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011502817A JP2011502817A (ja) | 2011-01-27 |
| JP2011502817A5 true JP2011502817A5 (https=) | 2011-10-06 |
| JP5551602B2 JP5551602B2 (ja) | 2014-07-16 |
Family
ID=40239632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010532264A Expired - Fee Related JP5551602B2 (ja) | 2007-11-01 | 2008-10-31 | マスター型複製方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110104321A1 (https=) |
| EP (1) | EP2212745A1 (https=) |
| JP (1) | JP5551602B2 (https=) |
| CN (1) | CN101910942B (https=) |
| WO (1) | WO2009059089A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110055586A (ko) * | 2008-08-05 | 2011-05-25 | 스몰텍 에이비 | 템플레이트 및 리소그래피용 고종횡비 템플레이트의 제조방법과 나노스케일로 기판을 천공하기 위한 템플레이트의 용도 |
| US20110120626A1 (en) * | 2009-11-20 | 2011-05-26 | Chung-Ping Lai | Method of producing ultra fine surfacing bulk substrate |
| EP2565014A4 (en) * | 2010-06-23 | 2015-01-21 | Nippon Soda Co | METHOD FOR PRODUCING A PRINTING FORM FOR MOLDING |
| KR20130091313A (ko) * | 2010-07-12 | 2013-08-16 | 아사히 가라스 가부시키가이샤 | 임프린트 몰드용 TiO₂함유 석영 유리 기재 및 그 제조 방법 |
| US8816211B2 (en) * | 2011-02-14 | 2014-08-26 | Eastman Kodak Company | Articles with photocurable and photocured compositions |
| CN102193126B (zh) * | 2011-05-26 | 2012-08-29 | 中国科学院上海光学精密机械研究所 | 宽带低电场增强反射金属介电光栅 |
| CN105093824B (zh) * | 2015-08-31 | 2019-05-07 | 西安交通大学 | 一种气电协同的大面积纳米压印光刻方法 |
| EP3377290B1 (en) * | 2015-11-22 | 2023-08-02 | Orbotech Ltd. | Control of surface properties of printed three-dimensional structures |
| CN110997266B (zh) * | 2017-06-29 | 2022-04-26 | 埃肯有机硅法国简易股份公司 | 有机硅弹性体制模具的制造方法 |
| KR102620913B1 (ko) | 2017-08-24 | 2024-01-05 | 다우 글로벌 테크놀로지스 엘엘씨 | 광학 도파관 제작 방법 |
| WO2019084770A1 (zh) * | 2017-10-31 | 2019-05-09 | 香港科技大学 | 具有表面微纳结构的金属薄膜模具的制备方法和金属薄膜模具中间体 |
| EP3670440B1 (fr) | 2018-12-21 | 2025-04-09 | Rolex Sa | Procédé de fabrication d'un composant horloger |
| EP3670441B1 (fr) * | 2018-12-21 | 2025-04-09 | Rolex Sa | Procédé de fabrication d'un composant horloger |
| CN112776495B (zh) * | 2020-12-16 | 2022-03-18 | 维达力实业(赤壁)有限公司 | Uv转印模具的修复方法及uv转印模具 |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2843555A (en) * | 1956-10-01 | 1958-07-15 | Gen Electric | Room temperature curing organopolysiloxane |
| GB923710A (en) * | 1960-11-07 | 1963-04-18 | Ici Ltd | Production of organosilicon compounds |
| US3159662A (en) * | 1962-07-02 | 1964-12-01 | Gen Electric | Addition reaction |
| US3220972A (en) * | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
| US3410886A (en) * | 1965-10-23 | 1968-11-12 | Union Carbide Corp | Si-h to c=c or c=c addition in the presence of a nitrile-platinum (ii) halide complex |
| US3313773A (en) * | 1965-12-03 | 1967-04-11 | Gen Electric | Platinum addition catalyst system |
| AT278040B (de) * | 1966-12-16 | 1970-01-26 | Degussa | Verfahren zur Herstellung von Organosiliziumverbindungen |
| DE1259888B (de) * | 1967-05-27 | 1968-02-01 | Bayer Ag | Verfahren zur Herstellung von Organosiliciumverbindungen |
| US3814730A (en) * | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| US3715334A (en) * | 1970-11-27 | 1973-02-06 | Gen Electric | Platinum-vinylsiloxanes |
| US3775452A (en) * | 1971-04-28 | 1973-11-27 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
| NL7207442A (https=) * | 1971-06-25 | 1972-12-28 | ||
| DE2846621A1 (de) * | 1978-10-26 | 1980-05-08 | Wacker Chemie Gmbh | Verfahren zum anlagern von si-gebundenem wasserstoff an aliphatische mehrfachbindung |
| US4288345A (en) * | 1980-02-06 | 1981-09-08 | General Electric Company | Platinum complex |
| US4313988A (en) * | 1980-02-25 | 1982-02-02 | Minnesota Mining And Manufacturing Company | Epoxypolysiloxane release coatings for adhesive materials |
| US5089536A (en) * | 1982-11-22 | 1992-02-18 | Minnesota Mining And Manufacturing Company | Energy polmerizable compositions containing organometallic initiators |
| US4510094A (en) * | 1983-12-06 | 1985-04-09 | Minnesota Mining And Manufacturing Company | Platinum complex |
| US4712092A (en) * | 1983-12-20 | 1987-12-08 | Aaron J. Gellman | Parallel encoded piezoelectric keyboard switch and array |
| US4603215A (en) * | 1984-08-20 | 1986-07-29 | Dow Corning Corporation | Platinum (O) alkyne complexes |
| FR2571732B1 (fr) * | 1984-10-15 | 1987-01-09 | Rhone Poulenc Spec Chim | Composition organopolysiloxanique de revetement utilisable notamment pour le traitement antiadherent et son procede d'application |
| FR2575086B1 (fr) * | 1984-12-20 | 1987-02-20 | Rhone Poulenc Spec Chim | Complexe platine-alcenylcyclohexene comme catalyseur de reaction d'hydrosilylation et son procede de preparation |
| US4705765A (en) * | 1985-12-19 | 1987-11-10 | General Electric Company | Hydrosilylation catalyst, method for making and use |
| US4670531A (en) * | 1986-01-21 | 1987-06-02 | General Electric Company | Inhibited precious metal catalyzed organopolysiloxane compositions |
| JPS62177187A (ja) * | 1986-01-30 | 1987-08-04 | Sumitomo Suriim Kk | 金属画像の形成方法 |
| JP2595654B2 (ja) * | 1988-05-23 | 1997-04-02 | ソニー株式会社 | ディスクカートリッジ用シャッタ及びその製造方法 |
| US4916169A (en) * | 1988-09-09 | 1990-04-10 | Minnesota Mining And Manufacturing Company | Visible radiation activated hydrosilation reaction |
| US5091483A (en) * | 1989-09-22 | 1992-02-25 | Minnesota Mining And Manufacturing Company | Radiation-curable silicone elastomers and pressure sensitive adhesives |
| US6376569B1 (en) * | 1990-12-13 | 2002-04-23 | 3M Innovative Properties Company | Hydrosilation reaction utilizing a (cyclopentadiene)(sigma-aliphatic) platinum complex and a free radical photoinitiator |
| US5286815A (en) * | 1992-02-07 | 1994-02-15 | Minnesota Mining And Manufacturing Company | Moisture curable polysiloxane release coating compositions |
| US5332797A (en) * | 1992-04-01 | 1994-07-26 | Minnesota Mining And Manufacturing Company | Silicone release compositions |
| WO1998040439A1 (en) * | 1997-03-14 | 1998-09-17 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
| US5932150A (en) * | 1997-08-25 | 1999-08-03 | Holo-Source Corporation | Replication of diffraction images in oriented films |
| US6788463B2 (en) * | 1998-01-13 | 2004-09-07 | 3M Innovative Properties Company | Post-formable multilayer optical films and methods of forming |
| JP2004136692A (ja) * | 1998-03-27 | 2004-05-13 | Nikon Corp | 金属製第3成形型を大量に製造する方法、樹脂基板を製造する方法及び樹脂基板 |
| US6814897B2 (en) * | 1998-03-27 | 2004-11-09 | Discovision Associates | Method for manufacturing a molding tool used for substrate molding |
| US6207247B1 (en) * | 1998-03-27 | 2001-03-27 | Nikon Corporation | Method for manufacturing a molding tool used for sustrate molding |
| US6098247A (en) * | 1998-07-22 | 2000-08-08 | Santelli, Jr.; Albert | Plastic extrusion having unitary thermoplastic rubber and thermoplastic sections |
| US20050154567A1 (en) * | 1999-06-18 | 2005-07-14 | President And Fellows Of Harvard College | Three-dimensional microstructures |
| US6663820B2 (en) * | 2001-03-14 | 2003-12-16 | The Procter & Gamble Company | Method of manufacturing microneedle structures using soft lithography and photolithography |
| US6692680B2 (en) * | 2001-10-03 | 2004-02-17 | Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College | Reproduction of micromold inserts |
| TW590999B (en) * | 2002-08-28 | 2004-06-11 | Alliance Fiber Optic Prod Inc | Mold for producing array optical fiber substrate with V-shaped grooves and method for producing the same |
| JP4322096B2 (ja) * | 2003-11-14 | 2009-08-26 | Tdk株式会社 | レジストパターン形成方法並びに磁気記録媒体及び磁気ヘッドの製造方法 |
| JP4628715B2 (ja) * | 2004-07-13 | 2011-02-09 | 信越化学工業株式会社 | 硬化性オルガノポリシロキサン組成物および注型成形用母型 |
| US7891636B2 (en) * | 2007-08-27 | 2011-02-22 | 3M Innovative Properties Company | Silicone mold and use thereof |
| KR20180038574A (ko) * | 2008-07-18 | 2018-04-16 | 바이오모드 컨셉츠 인코포레이티드 | 활성 성분을 방출하는 제품 |
-
2008
- 2008-10-31 CN CN2008801226192A patent/CN101910942B/zh not_active Expired - Fee Related
- 2008-10-31 JP JP2010532264A patent/JP5551602B2/ja not_active Expired - Fee Related
- 2008-10-31 EP EP08843712A patent/EP2212745A1/en not_active Withdrawn
- 2008-10-31 US US12/673,549 patent/US20110104321A1/en not_active Abandoned
- 2008-10-31 WO PCT/US2008/081928 patent/WO2009059089A1/en not_active Ceased
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