JP2011239040A - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP2011239040A
JP2011239040A JP2010106713A JP2010106713A JP2011239040A JP 2011239040 A JP2011239040 A JP 2011239040A JP 2010106713 A JP2010106713 A JP 2010106713A JP 2010106713 A JP2010106713 A JP 2010106713A JP 2011239040 A JP2011239040 A JP 2011239040A
Authority
JP
Japan
Prior art keywords
connector
differential signal
board
image processing
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010106713A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011239040A5 (enExample
Inventor
Shigeaki Soto
成明 素都
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010106713A priority Critical patent/JP2011239040A/ja
Priority to KR1020110039521A priority patent/KR101317013B1/ko
Priority to US13/094,986 priority patent/US8638569B2/en
Priority to CN201110117232.1A priority patent/CN102238324B/zh
Publication of JP2011239040A publication Critical patent/JP2011239040A/ja
Publication of JP2011239040A5 publication Critical patent/JP2011239040A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2010106713A 2010-05-06 2010-05-06 撮像装置 Withdrawn JP2011239040A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010106713A JP2011239040A (ja) 2010-05-06 2010-05-06 撮像装置
KR1020110039521A KR101317013B1 (ko) 2010-05-06 2011-04-27 전기 장치
US13/094,986 US8638569B2 (en) 2010-05-06 2011-04-27 Electrical apparatus
CN201110117232.1A CN102238324B (zh) 2010-05-06 2011-05-05 电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010106713A JP2011239040A (ja) 2010-05-06 2010-05-06 撮像装置

Publications (2)

Publication Number Publication Date
JP2011239040A true JP2011239040A (ja) 2011-11-24
JP2011239040A5 JP2011239040A5 (enExample) 2013-06-20

Family

ID=44888489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010106713A Withdrawn JP2011239040A (ja) 2010-05-06 2010-05-06 撮像装置

Country Status (4)

Country Link
US (1) US8638569B2 (enExample)
JP (1) JP2011239040A (enExample)
KR (1) KR101317013B1 (enExample)
CN (1) CN102238324B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017079449A (ja) * 2015-10-22 2017-04-27 京セラ株式会社 実装構造体およびカメラモジュール

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441355B (zh) * 2013-08-14 2016-04-27 今皓光电（昆山）有限公司 Fpc/ffc高频sata传输连接器
KR102551188B1 (ko) * 2018-06-26 2023-07-04 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 기기
US11122190B2 (en) 2018-10-16 2021-09-14 Canon Kabushiki Kaisha Image pickup apparatus with movable unit and control unit connected together by flexible boards
JP2020064281A (ja) * 2018-10-16 2020-04-23 キヤノン株式会社 撮像装置、電子機器
US11696004B2 (en) * 2019-09-13 2023-07-04 Gopro, Inc. Image capture device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141135A (ja) 1981-10-20 1983-08-22 富士写真フイルム株式会社 固体イメ−ジセンサを用いた内視鏡の画像伝送方式
US6384341B1 (en) * 2001-04-30 2002-05-07 Tyco Electronics Corporation Differential connector footprint for a multi-layer circuit board
US6940729B2 (en) * 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
JP4261440B2 (ja) * 2004-08-30 2009-04-30 ヒロセ電機株式会社 伝送回路基板
JP4371065B2 (ja) 2005-03-03 2009-11-25 日本電気株式会社 伝送線路、通信装置及び配線形成方法
KR100780204B1 (ko) * 2006-12-13 2007-11-27 삼성전기주식회사 접지용 더미기판을 갖는 카메라 모듈
JP5173298B2 (ja) 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
JP4957446B2 (ja) * 2007-08-13 2012-06-20 オムロン株式会社 センサシステムのケーブル延長ユニットおよびセンサシステム
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
US20100265349A1 (en) * 2009-04-17 2010-10-21 Electronics And Telecommunications Research Institute Digital camera module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017079449A (ja) * 2015-10-22 2017-04-27 京セラ株式会社 実装構造体およびカメラモジュール

Also Published As

Publication number Publication date
US8638569B2 (en) 2014-01-28
KR101317013B1 (ko) 2013-10-11
US20110273859A1 (en) 2011-11-10
KR20110123209A (ko) 2011-11-14
CN102238324A (zh) 2011-11-09
CN102238324B (zh) 2014-02-26

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