CN102238324B - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
CN102238324B
CN102238324B CN201110117232.1A CN201110117232A CN102238324B CN 102238324 B CN102238324 B CN 102238324B CN 201110117232 A CN201110117232 A CN 201110117232A CN 102238324 B CN102238324 B CN 102238324B
Authority
CN
China
Prior art keywords
connector
differential signal
terminals
image processing
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110117232.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102238324A (zh
Inventor
素都成明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102238324A publication Critical patent/CN102238324A/zh
Application granted granted Critical
Publication of CN102238324B publication Critical patent/CN102238324B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
CN201110117232.1A 2010-05-06 2011-05-05 电子设备 Expired - Fee Related CN102238324B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-106713 2010-05-06
JP2010106713A JP2011239040A (ja) 2010-05-06 2010-05-06 撮像装置

Publications (2)

Publication Number Publication Date
CN102238324A CN102238324A (zh) 2011-11-09
CN102238324B true CN102238324B (zh) 2014-02-26

Family

ID=44888489

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110117232.1A Expired - Fee Related CN102238324B (zh) 2010-05-06 2011-05-05 电子设备

Country Status (4)

Country Link
US (1) US8638569B2 (enExample)
JP (1) JP2011239040A (enExample)
KR (1) KR101317013B1 (enExample)
CN (1) CN102238324B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441355B (zh) * 2013-08-14 2016-04-27 今皓光电（昆山）有限公司 Fpc/ffc高频sata传输连接器
JP6560096B2 (ja) * 2015-10-22 2019-08-14 京セラ株式会社 実装構造体およびカメラモジュール
KR102551188B1 (ko) * 2018-06-26 2023-07-04 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 기기
US11122190B2 (en) 2018-10-16 2021-09-14 Canon Kabushiki Kaisha Image pickup apparatus with movable unit and control unit connected together by flexible boards
JP2020064281A (ja) * 2018-10-16 2020-04-23 キヤノン株式会社 撮像装置、電子機器
US11696004B2 (en) * 2019-09-13 2023-07-04 Gopro, Inc. Image capture device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1829414A (zh) * 2005-03-03 2006-09-06 日本电气株式会社 传输线及布线形成方法
CN101606444A (zh) * 2007-07-25 2009-12-16 佳能株式会社 印刷电路板及使用该印刷电路板的电子装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141135A (ja) 1981-10-20 1983-08-22 富士写真フイルム株式会社 固体イメ−ジセンサを用いた内視鏡の画像伝送方式
US6384341B1 (en) * 2001-04-30 2002-05-07 Tyco Electronics Corporation Differential connector footprint for a multi-layer circuit board
US6940729B2 (en) * 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
JP4261440B2 (ja) * 2004-08-30 2009-04-30 ヒロセ電機株式会社 伝送回路基板
KR100780204B1 (ko) * 2006-12-13 2007-11-27 삼성전기주식회사 접지용 더미기판을 갖는 카메라 모듈
JP4957446B2 (ja) * 2007-08-13 2012-06-20 オムロン株式会社 センサシステムのケーブル延長ユニットおよびセンサシステム
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
US20100265349A1 (en) * 2009-04-17 2010-10-21 Electronics And Telecommunications Research Institute Digital camera module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1829414A (zh) * 2005-03-03 2006-09-06 日本电气株式会社 传输线及布线形成方法
CN101606444A (zh) * 2007-07-25 2009-12-16 佳能株式会社 印刷电路板及使用该印刷电路板的电子装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP昭58-141135A 1983.08.22

Also Published As

Publication number Publication date
US8638569B2 (en) 2014-01-28
KR101317013B1 (ko) 2013-10-11
US20110273859A1 (en) 2011-11-10
JP2011239040A (ja) 2011-11-24
KR20110123209A (ko) 2011-11-14
CN102238324A (zh) 2011-11-09

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140226

Termination date: 20210505