JP2008183402A5 - - Google Patents

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Publication number
JP2008183402A5
JP2008183402A5 JP2008014687A JP2008014687A JP2008183402A5 JP 2008183402 A5 JP2008183402 A5 JP 2008183402A5 JP 2008014687 A JP2008014687 A JP 2008014687A JP 2008014687 A JP2008014687 A JP 2008014687A JP 2008183402 A5 JP2008183402 A5 JP 2008183402A5
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JP
Japan
Prior art keywords
structures
transducer elements
array
circuit
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008014687A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008183402A (ja
Filing date
Publication date
Priority claimed from US11/668,656 external-priority patent/US7791252B2/en
Application filed filed Critical
Publication of JP2008183402A publication Critical patent/JP2008183402A/ja
Publication of JP2008183402A5 publication Critical patent/JP2008183402A5/ja
Pending legal-status Critical Current

Links

JP2008014687A 2007-01-30 2008-01-25 超音波プローブ・アセンブリ及び製造の方法 Pending JP2008183402A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/668,656 US7791252B2 (en) 2007-01-30 2007-01-30 Ultrasound probe assembly and method of fabrication

Publications (2)

Publication Number Publication Date
JP2008183402A JP2008183402A (ja) 2008-08-14
JP2008183402A5 true JP2008183402A5 (enExample) 2010-10-14

Family

ID=39595539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008014687A Pending JP2008183402A (ja) 2007-01-30 2008-01-25 超音波プローブ・アセンブリ及び製造の方法

Country Status (3)

Country Link
US (1) US7791252B2 (enExample)
JP (1) JP2008183402A (enExample)
FR (1) FR2911968B1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4980653B2 (ja) * 2006-06-12 2012-07-18 オリンパスメディカルシステムズ株式会社 超音波探触子および超音波探触子を有する超音波内視鏡
US8058776B1 (en) * 2006-11-27 2011-11-15 William Gordon Gibson Laminar array ultrasound transducer and system
KR101112658B1 (ko) * 2008-11-19 2012-02-15 삼성메디슨 주식회사 초음파 진단장치용 프로브 및 그 제조방법
GB2473265A (en) * 2009-09-07 2011-03-09 Sonovia Ltd Flexible PCB mounting for ultrasonic transducers
JP2011250119A (ja) 2010-05-26 2011-12-08 Toshiba Corp 超音波プローブ
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
CN103876775B (zh) * 2012-12-20 2016-02-03 深圳迈瑞生物医疗电子股份有限公司 超声探头的阵元连接元件及其超声探头及超声成像系统
JP6147532B2 (ja) * 2013-03-21 2017-06-14 東芝メディカルシステムズ株式会社 超音波プローブ
US10265729B2 (en) * 2015-02-06 2019-04-23 Olympus Scientific Solutions Americas Inc. Phased array ultrasonic transducers with solderless stack bonding assembly
US9894756B2 (en) * 2015-12-08 2018-02-13 Kardium Inc. Circuits for flexible structures
US10905398B2 (en) * 2016-01-04 2021-02-02 General Electric Company Ultrasound transducer array with separated acoustic and electric module
WO2017127050A1 (en) * 2016-01-19 2017-07-27 Sound Technology Inc. Ultrasound transducer array interconnect
AU2017299584B2 (en) 2016-07-19 2022-03-31 Shifamed Holdings, Llc Medical devices and methods of use
CA3035915A1 (en) * 2016-09-09 2018-03-15 EchoNous, Inc. Flexible circuit with redundant connection points for ultrasound array
JP7221210B2 (ja) 2017-03-30 2023-02-13 ヌベラ・メディカル・インコーポレイテッド 医療用ツール位置決めデバイス、システム、ならびに使用法および製造法
US10488502B2 (en) * 2017-04-26 2019-11-26 General Electric Company Ultrasound probe with thin film flex circuit and methods of providing same
CN113164017B (zh) 2018-08-23 2024-12-20 纽维拉医疗公司 医疗工具定位装置、系统以及使用和制造方法
WO2020102389A1 (en) 2018-11-13 2020-05-22 Shifamed Holdings, Llc Medical tool positioning devices, systems, and methods of use and manufacture
US10499509B1 (en) * 2018-12-31 2019-12-03 General Electric Company Methods and systems for a flexible circuit
WO2020170210A1 (en) * 2019-02-22 2020-08-27 Vermon S.A. Flexible printed circuit board device for interfacing high density ultrasound matrix array transducer with integrated circuits
KR20220036952A (ko) * 2019-07-12 2022-03-23 뉴럴링크 코포레이션 박막 전극 어레이 및 집적 회로를 위한 샌드위치 어셈블리 방식
CN114284424B (zh) * 2020-09-28 2024-08-06 京东方科技集团股份有限公司 一种压电器件、压电设备及其制作方法
GB2614239A (en) * 2021-12-17 2023-07-05 Darkvision Tech Inc Ultrasound interconnect stack and method of manufacturing same
DE102023213147A1 (de) * 2023-12-21 2025-06-26 Robert Bosch Gesellschaft mit beschränkter Haftung Ultraschallsensor und Verfahren zur Herstellung eines Ultraschallsensors

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292433B1 (en) * 1997-02-03 2001-09-18 Teratech Corporation Multi-dimensional beamforming device
US6541896B1 (en) * 1997-12-29 2003-04-01 General Electric Company Method for manufacturing combined acoustic backing and interconnect module for ultrasonic array
JP2001198126A (ja) * 2000-01-24 2001-07-24 Toshiba Corp 超音波プローブと、その製造方法
WO2002040184A2 (en) * 2000-11-15 2002-05-23 Koninklijke Philips Electronics N.V. Multidimensional ultrasonic transducer arrays
US6759791B2 (en) 2000-12-21 2004-07-06 Ram Hatangadi Multidimensional array and fabrication thereof
US6645162B2 (en) * 2000-12-27 2003-11-11 Insightec - Txsonics Ltd. Systems and methods for ultrasound assisted lipolysis
US6761688B1 (en) * 2001-02-28 2004-07-13 Siemens Medical Solutions Usa, Inc. Multi-layered transducer array and method having identical layers
US6656124B2 (en) * 2001-10-15 2003-12-02 Vermon Stack based multidimensional ultrasonic transducer array
US6822376B2 (en) 2002-11-19 2004-11-23 General Electric Company Method for making electrical connection to ultrasonic transducer
US7053530B2 (en) 2002-11-22 2006-05-30 General Electric Company Method for making electrical connection to ultrasonic transducer through acoustic backing material
US6974333B2 (en) * 2004-03-30 2005-12-13 General Electric Company High-density connection between multiple circuit boards
JP4575108B2 (ja) * 2004-10-15 2010-11-04 株式会社東芝 超音波プローブ
WO2006075283A2 (en) * 2005-01-11 2006-07-20 Koninklijke Philips Electronics, N.V. Redistribution interconnect for microbeamformer(s) and a medical ultrasound system
JP4718889B2 (ja) * 2005-04-28 2011-07-06 日本特殊陶業株式会社 多層配線基板及びその製造方法、多層配線基板構造体及びその製造方法

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