JP2004219406A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004219406A5 JP2004219406A5 JP2003406755A JP2003406755A JP2004219406A5 JP 2004219406 A5 JP2004219406 A5 JP 2004219406A5 JP 2003406755 A JP2003406755 A JP 2003406755A JP 2003406755 A JP2003406755 A JP 2003406755A JP 2004219406 A5 JP2004219406 A5 JP 2004219406A5
- Authority
- JP
- Japan
- Prior art keywords
- signal processing
- processing circuit
- transducers
- transducer
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000004760 aramid Substances 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/313,078 US7564125B2 (en) | 2002-12-06 | 2002-12-06 | Electronic array and methods for fabricating same |
| US10/313,078 | 2002-12-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004219406A JP2004219406A (ja) | 2004-08-05 |
| JP2004219406A5 true JP2004219406A5 (enExample) | 2009-06-25 |
| JP4688413B2 JP4688413B2 (ja) | 2011-05-25 |
Family
ID=32392932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003406755A Expired - Fee Related JP4688413B2 (ja) | 2002-12-06 | 2003-12-05 | 電子装置アレイ及びその製作方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7564125B2 (enExample) |
| JP (1) | JP4688413B2 (enExample) |
| CN (1) | CN100359698C (enExample) |
| DE (1) | DE10356737A1 (enExample) |
| IL (1) | IL159065A0 (enExample) |
| NL (1) | NL1024947C2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7257051B2 (en) | 2003-03-06 | 2007-08-14 | General Electric Company | Integrated interface electronics for reconfigurable sensor array |
| US6990176B2 (en) | 2003-10-30 | 2006-01-24 | General Electric Company | Methods and apparatus for tileable sensor array |
| US7239526B1 (en) * | 2004-03-02 | 2007-07-03 | Xilinx, Inc. | Printed circuit board and method of reducing crosstalk in a printed circuit board |
| JP2009500061A (ja) * | 2005-06-29 | 2009-01-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 超音波振動子における最適化された温度測定 |
| US20070012965A1 (en) * | 2005-07-15 | 2007-01-18 | General Electric Company | Photodetection system and module |
| JP4831300B2 (ja) * | 2005-10-06 | 2011-12-07 | ゼネラル・エレクトリック・カンパニイ | マルチダイ背面照射型ダイオードのモジュール・アセンブリ |
| US7229292B1 (en) * | 2005-12-22 | 2007-06-12 | General Electric Company | Interconnect structure for transducer assembly |
| US8648702B2 (en) * | 2010-08-20 | 2014-02-11 | Denso International America, Inc. | Combined time-of-flight and image sensor systems |
| JP5209689B2 (ja) * | 2010-11-05 | 2013-06-12 | 株式会社東芝 | 超音波プローブ |
| US20120193545A1 (en) * | 2011-01-31 | 2012-08-02 | General Electric Company | Detector systems with anode incidence face and methods of fabricating the same |
| CN109478556B (zh) * | 2016-07-14 | 2023-07-14 | 皇家飞利浦有限公司 | 检测器模块、检测器、成像设备和制造检测器模块的方法 |
| DE102018200845B4 (de) * | 2018-01-19 | 2021-05-06 | Siemens Healthcare Gmbh | Montageverfahren für die Herstellung eines Röntgendetektors, Röntgendetektor und Röntgengerät |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1267468A (en) * | 1983-11-21 | 1990-04-03 | Hideaki Nishizawa | Optical device package |
| US5464984A (en) | 1985-12-11 | 1995-11-07 | General Imaging Corporation | X-ray imaging system and solid state detector therefor |
| US4798541A (en) * | 1987-09-02 | 1989-01-17 | Ncr Corporation | Right angle electrical connector |
| JP2789234B2 (ja) * | 1989-10-02 | 1998-08-20 | 株式会社日立メディコ | 超音波診断装置 |
| EP0473125B1 (en) | 1990-08-30 | 1996-01-31 | Shimadzu Corporation | Radiation detector |
| US5267221A (en) * | 1992-02-13 | 1993-11-30 | Hewlett-Packard Company | Backing for acoustic transducer array |
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| JP3253203B2 (ja) | 1993-01-19 | 2002-02-04 | キヤノン株式会社 | フレキシブル配線基板、及びこれを使用したインクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法 |
| US5545429A (en) | 1994-07-01 | 1996-08-13 | International Business Machines Corporation | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess |
| US5477075A (en) * | 1994-12-16 | 1995-12-19 | Advanced Photonix, Inc. | Solid state photodetector with light-responsive rear face |
| US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
| GB9710843D0 (en) * | 1997-05-28 | 1997-07-23 | Secr Defence | A thermal detector array |
| US6234820B1 (en) | 1997-07-21 | 2001-05-22 | Rambus Inc. | Method and apparatus for joining printed circuit boards |
| US6279399B1 (en) * | 1998-08-03 | 2001-08-28 | Vingmed Sound A/S | Multi-dimensional transducer array apparatus |
| JP4147639B2 (ja) | 1998-09-29 | 2008-09-10 | 宇部興産株式会社 | フレキシブル金属箔積層体 |
| JP2000164422A (ja) * | 1998-11-24 | 2000-06-16 | Fuji Electric Corp Res & Dev Ltd | 薄膜コイルモジュール |
| JP2001203318A (ja) * | 1999-12-17 | 2001-07-27 | Texas Instr Inc <Ti> | 複数のフリップチップを備えた半導体アセンブリ |
| JP4521126B2 (ja) * | 2000-02-02 | 2010-08-11 | 株式会社東芝 | 二次元アレイ型超音波プローブ |
| US6368146B2 (en) * | 2000-08-23 | 2002-04-09 | Russell Abbott | Alignment mechanism for a high density electrical connector |
| US6426991B1 (en) * | 2000-11-16 | 2002-07-30 | Koninklijke Philips Electronics N.V. | Back-illuminated photodiodes for computed tomography detectors |
| JP2003084066A (ja) * | 2001-04-11 | 2003-03-19 | Nippon Kessho Kogaku Kk | 放射線検出器用部品、放射線検出器および放射線検出装置 |
-
2002
- 2002-12-06 US US10/313,078 patent/US7564125B2/en not_active Expired - Fee Related
-
2003
- 2003-11-26 IL IL15906503A patent/IL159065A0/xx not_active IP Right Cessation
- 2003-12-02 CN CNB2003101187125A patent/CN100359698C/zh not_active Expired - Fee Related
- 2003-12-02 DE DE10356737A patent/DE10356737A1/de not_active Withdrawn
- 2003-12-04 NL NL1024947A patent/NL1024947C2/nl not_active IP Right Cessation
- 2003-12-05 JP JP2003406755A patent/JP4688413B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008188423A5 (enExample) | ||
| US7791252B2 (en) | Ultrasound probe assembly and method of fabrication | |
| JP2004219406A5 (enExample) | ||
| JP2008183402A5 (enExample) | ||
| EP2510404B1 (en) | Acoustic transducer assembly | |
| CN103181785B (zh) | 超声波探头及其制造方法 | |
| US9143879B2 (en) | Directional audio array apparatus and system | |
| JP4524719B2 (ja) | アレイ型超音波振動子 | |
| US20060036178A1 (en) | Cableless coupling methods for ultrasound | |
| US8405281B2 (en) | Transducer for ultrasonic diagnosis device and method for manufacturing the same | |
| JP2013175878A5 (enExample) | ||
| WO2009055767A3 (en) | Micromachined piezoelectric ultrasound transducer arrays | |
| US7654961B2 (en) | Ultrasonic probe | |
| CN1890707B (zh) | 实施装有ic并带有高衰减背载的传感器 | |
| JP2006140461A5 (enExample) | ||
| JP4688413B2 (ja) | 電子装置アレイ及びその製作方法 | |
| WO2006131875A3 (en) | Multicomponent backing block for ultrasound sensor assemblies | |
| TWI362924B (en) | Transducer assembly , method for forming a transducer assembly and ultrasound system | |
| CN102238324B (zh) | 电子设备 | |
| WO2014123556A1 (en) | Ultrasound device | |
| CN117598723A (zh) | 超声波探头 | |
| CN117598724A (zh) | 超声波探头 | |
| US20020089834A1 (en) | Reduced crosstalk ultrasonic piezo film array on a printed circuit board | |
| US9061319B2 (en) | Ultrasound probe | |
| CN117598726A (zh) | 超声波探头 |