KR101317013B1 - 전기 장치 - Google Patents

전기 장치 Download PDF

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Publication number
KR101317013B1
KR101317013B1 KR1020110039521A KR20110039521A KR101317013B1 KR 101317013 B1 KR101317013 B1 KR 101317013B1 KR 1020110039521 A KR1020110039521 A KR 1020110039521A KR 20110039521 A KR20110039521 A KR 20110039521A KR 101317013 B1 KR101317013 B1 KR 101317013B1
Authority
KR
South Korea
Prior art keywords
connector
board
differential signal
terminals
image processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110039521A
Other languages
English (en)
Korean (ko)
Other versions
KR20110123209A (ko
Inventor
시게아끼 소쯔
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20110123209A publication Critical patent/KR20110123209A/ko
Application granted granted Critical
Publication of KR101317013B1 publication Critical patent/KR101317013B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
KR1020110039521A 2010-05-06 2011-04-27 전기 장치 Expired - Fee Related KR101317013B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-106713 2010-05-06
JP2010106713A JP2011239040A (ja) 2010-05-06 2010-05-06 撮像装置

Publications (2)

Publication Number Publication Date
KR20110123209A KR20110123209A (ko) 2011-11-14
KR101317013B1 true KR101317013B1 (ko) 2013-10-11

Family

ID=44888489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110039521A Expired - Fee Related KR101317013B1 (ko) 2010-05-06 2011-04-27 전기 장치

Country Status (4)

Country Link
US (1) US8638569B2 (enExample)
JP (1) JP2011239040A (enExample)
KR (1) KR101317013B1 (enExample)
CN (1) CN102238324B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103441355B (zh) * 2013-08-14 2016-04-27 今皓光电（昆山）有限公司 Fpc/ffc高频sata传输连接器
JP6560096B2 (ja) * 2015-10-22 2019-08-14 京セラ株式会社 実装構造体およびカメラモジュール
KR102551188B1 (ko) * 2018-06-26 2023-07-04 엘지이노텍 주식회사 카메라 모듈 및 이를 포함하는 광학 기기
US11122190B2 (en) 2018-10-16 2021-09-14 Canon Kabushiki Kaisha Image pickup apparatus with movable unit and control unit connected together by flexible boards
JP2020064281A (ja) * 2018-10-16 2020-04-23 キヤノン株式会社 撮像装置、電子機器
US11696004B2 (en) * 2019-09-13 2023-07-04 Gopro, Inc. Image capture device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009049473A (ja) * 2007-08-13 2009-03-05 Omron Corp センサシステムのケーブル延長ユニットおよびセンサシステム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141135A (ja) 1981-10-20 1983-08-22 富士写真フイルム株式会社 固体イメ−ジセンサを用いた内視鏡の画像伝送方式
US6384341B1 (en) * 2001-04-30 2002-05-07 Tyco Electronics Corporation Differential connector footprint for a multi-layer circuit board
US6940729B2 (en) * 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
JP4261440B2 (ja) * 2004-08-30 2009-04-30 ヒロセ電機株式会社 伝送回路基板
JP4371065B2 (ja) 2005-03-03 2009-11-25 日本電気株式会社 伝送線路、通信装置及び配線形成方法
KR100780204B1 (ko) * 2006-12-13 2007-11-27 삼성전기주식회사 접지용 더미기판을 갖는 카메라 모듈
JP5173298B2 (ja) 2007-07-25 2013-04-03 キヤノン株式会社 プリント配線板およびそれを用いた電子機器
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
US20100265349A1 (en) * 2009-04-17 2010-10-21 Electronics And Telecommunications Research Institute Digital camera module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009049473A (ja) * 2007-08-13 2009-03-05 Omron Corp センサシステムのケーブル延長ユニットおよびセンサシステム

Also Published As

Publication number Publication date
US8638569B2 (en) 2014-01-28
CN102238324B (zh) 2014-02-26
US20110273859A1 (en) 2011-11-10
JP2011239040A (ja) 2011-11-24
KR20110123209A (ko) 2011-11-14
CN102238324A (zh) 2011-11-09

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