JP2011235389A5 - - Google Patents

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Publication number
JP2011235389A5
JP2011235389A5 JP2010108506A JP2010108506A JP2011235389A5 JP 2011235389 A5 JP2011235389 A5 JP 2011235389A5 JP 2010108506 A JP2010108506 A JP 2010108506A JP 2010108506 A JP2010108506 A JP 2010108506A JP 2011235389 A5 JP2011235389 A5 JP 2011235389A5
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JP
Japan
Prior art keywords
polishing pad
value
polyurethane foam
thermosetting polyurethane
pad according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010108506A
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English (en)
Japanese (ja)
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JP5426469B2 (ja
JP2011235389A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010108506A external-priority patent/JP5426469B2/ja
Priority to JP2010108506A priority Critical patent/JP5426469B2/ja
Priority to CN201180022832.8A priority patent/CN102883857B/zh
Priority to SG2012079067A priority patent/SG185031A1/en
Priority to KR1020127026775A priority patent/KR101399521B1/ko
Priority to US13/696,759 priority patent/US8979611B2/en
Priority to PCT/JP2011/056704 priority patent/WO2011142177A1/ja
Priority to TW100110347A priority patent/TWI429504B/zh
Publication of JP2011235389A publication Critical patent/JP2011235389A/ja
Publication of JP2011235389A5 publication Critical patent/JP2011235389A5/ja
Publication of JP5426469B2 publication Critical patent/JP5426469B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010108506A 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法 Active JP5426469B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2010108506A JP5426469B2 (ja) 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法
US13/696,759 US8979611B2 (en) 2010-05-10 2011-03-22 Polishing pad, production method for same, and production method for glass substrate
SG2012079067A SG185031A1 (en) 2010-05-10 2011-03-22 Polishing pad, production method for same, and production method for glass substrate
KR1020127026775A KR101399521B1 (ko) 2010-05-10 2011-03-22 연마 패드 및 그 제조 방법, 및 유리 기판의 제조 방법
CN201180022832.8A CN102883857B (zh) 2010-05-10 2011-03-22 研磨垫以及玻璃基板的制造方法
PCT/JP2011/056704 WO2011142177A1 (ja) 2010-05-10 2011-03-22 研磨パッドおよびその製造方法、ならびにガラス基板の製造方法
TW100110347A TWI429504B (zh) 2010-05-10 2011-03-25 A polishing pad and a method for manufacturing the same, and a method for manufacturing the glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010108506A JP5426469B2 (ja) 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011235389A JP2011235389A (ja) 2011-11-24
JP2011235389A5 true JP2011235389A5 (enExample) 2012-11-22
JP5426469B2 JP5426469B2 (ja) 2014-02-26

Family

ID=44914234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010108506A Active JP5426469B2 (ja) 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法

Country Status (7)

Country Link
US (1) US8979611B2 (enExample)
JP (1) JP5426469B2 (enExample)
KR (1) KR101399521B1 (enExample)
CN (1) CN102883857B (enExample)
SG (1) SG185031A1 (enExample)
TW (1) TWI429504B (enExample)
WO (1) WO2011142177A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338946B2 (ja) * 2014-06-30 2018-06-06 東芝メモリ株式会社 研磨装置、及び研磨方法
CN104385120B (zh) * 2014-10-16 2017-06-30 中国科学院化学研究所 聚氨酯抛光垫的制备方法
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
US12252634B2 (en) 2018-12-03 2025-03-18 Kuraray Co., Ltd. Polyurethane for polishing layers, polishing layer and polishing pad
US11717932B2 (en) * 2018-12-14 2023-08-08 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Polyurethane polishing pad and composition for manufacturing the same
KR102298111B1 (ko) * 2019-11-15 2021-09-03 에스케이씨솔믹스 주식회사 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법
KR102206485B1 (ko) * 2020-03-17 2021-01-22 에스케이씨 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP4959901B2 (ja) 2000-05-27 2012-06-27 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用溝付き研磨パッド
CN1263781C (zh) * 2000-06-13 2006-07-12 东洋橡膠工业株式会社 生产聚氨酯泡沫塑料的方法,聚氨酯泡沫塑料,和磨光片
KR100867339B1 (ko) * 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
JP2006114885A (ja) 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
US7871309B2 (en) * 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP2006334745A (ja) * 2005-06-03 2006-12-14 Inoac Corp 研磨用吸着パッド及びその製造方法
JP4261586B2 (ja) * 2007-01-15 2009-04-30 東洋ゴム工業株式会社 研磨パッドの製造方法
CN102152232B (zh) 2007-01-15 2013-06-26 东洋橡胶工业株式会社 研磨垫及其制造方法
KR101146966B1 (ko) * 2007-02-01 2012-05-23 가부시키가이샤 구라레 연마 패드 및 연마 패드의 제조 방법
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
JP5248152B2 (ja) * 2008-03-12 2013-07-31 東洋ゴム工業株式会社 研磨パッド
JP2009291854A (ja) * 2008-06-03 2009-12-17 Nitta Haas Inc 研磨パッド

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