SG185031A1 - Polishing pad, production method for same, and production method for glass substrate - Google Patents
Polishing pad, production method for same, and production method for glass substrate Download PDFInfo
- Publication number
- SG185031A1 SG185031A1 SG2012079067A SG2012079067A SG185031A1 SG 185031 A1 SG185031 A1 SG 185031A1 SG 2012079067 A SG2012079067 A SG 2012079067A SG 2012079067 A SG2012079067 A SG 2012079067A SG 185031 A1 SG185031 A1 SG 185031A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- value
- polishing pad
- foam
- polyurethane foam
- Prior art date
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- 238000005498 polishing Methods 0.000 title claims abstract description 165
- 239000000758 substrate Substances 0.000 title claims abstract description 65
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- 229920005830 Polyurethane Foam Polymers 0.000 claims abstract description 62
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- 125000000524 functional group Chemical group 0.000 claims description 21
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/241—Methods
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polyurethanes Or Polyureas (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108506A JP5426469B2 (ja) | 2010-05-10 | 2010-05-10 | 研磨パッドおよびガラス基板の製造方法 |
| PCT/JP2011/056704 WO2011142177A1 (ja) | 2010-05-10 | 2011-03-22 | 研磨パッドおよびその製造方法、ならびにガラス基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG185031A1 true SG185031A1 (en) | 2012-11-29 |
Family
ID=44914234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012079067A SG185031A1 (en) | 2010-05-10 | 2011-03-22 | Polishing pad, production method for same, and production method for glass substrate |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8979611B2 (enExample) |
| JP (1) | JP5426469B2 (enExample) |
| KR (1) | KR101399521B1 (enExample) |
| CN (1) | CN102883857B (enExample) |
| SG (1) | SG185031A1 (enExample) |
| TW (1) | TWI429504B (enExample) |
| WO (1) | WO2011142177A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6338946B2 (ja) * | 2014-06-30 | 2018-06-06 | 東芝メモリ株式会社 | 研磨装置、及び研磨方法 |
| CN104385120B (zh) * | 2014-10-16 | 2017-06-30 | 中国科学院化学研究所 | 聚氨酯抛光垫的制备方法 |
| KR101945878B1 (ko) * | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
| US12252634B2 (en) | 2018-12-03 | 2025-03-18 | Kuraray Co., Ltd. | Polyurethane for polishing layers, polishing layer and polishing pad |
| US11717932B2 (en) * | 2018-12-14 | 2023-08-08 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Polyurethane polishing pad and composition for manufacturing the same |
| KR102298111B1 (ko) * | 2019-11-15 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법 |
| KR102206485B1 (ko) * | 2020-03-17 | 2021-01-22 | 에스케이씨 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
| US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
| US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| US6454634B1 (en) | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
| JP4959901B2 (ja) | 2000-05-27 | 2012-06-27 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械平坦化用溝付き研磨パッド |
| CN1263781C (zh) * | 2000-06-13 | 2006-07-12 | 东洋橡膠工业株式会社 | 生产聚氨酯泡沫塑料的方法,聚氨酯泡沫塑料,和磨光片 |
| KR100867339B1 (ko) * | 2000-12-01 | 2008-11-06 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
| JP2006114885A (ja) | 2004-09-17 | 2006-04-27 | Jsr Corp | 化学機械研磨パッド及び化学機械研磨方法 |
| DE602005007125D1 (de) | 2004-09-17 | 2008-07-10 | Jsr Corp | Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren |
| US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP2006334745A (ja) * | 2005-06-03 | 2006-12-14 | Inoac Corp | 研磨用吸着パッド及びその製造方法 |
| JP4261586B2 (ja) * | 2007-01-15 | 2009-04-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| CN102152232B (zh) | 2007-01-15 | 2013-06-26 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
| KR101146966B1 (ko) * | 2007-02-01 | 2012-05-23 | 가부시키가이샤 구라레 | 연마 패드 및 연마 패드의 제조 방법 |
| TWI411495B (zh) * | 2007-08-16 | 2013-10-11 | Cabot Microelectronics Corp | 拋光墊 |
| JP5248152B2 (ja) * | 2008-03-12 | 2013-07-31 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2009291854A (ja) * | 2008-06-03 | 2009-12-17 | Nitta Haas Inc | 研磨パッド |
-
2010
- 2010-05-10 JP JP2010108506A patent/JP5426469B2/ja active Active
-
2011
- 2011-03-22 KR KR1020127026775A patent/KR101399521B1/ko active Active
- 2011-03-22 WO PCT/JP2011/056704 patent/WO2011142177A1/ja not_active Ceased
- 2011-03-22 US US13/696,759 patent/US8979611B2/en active Active
- 2011-03-22 CN CN201180022832.8A patent/CN102883857B/zh active Active
- 2011-03-22 SG SG2012079067A patent/SG185031A1/en unknown
- 2011-03-25 TW TW100110347A patent/TWI429504B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201139060A (en) | 2011-11-16 |
| JP5426469B2 (ja) | 2014-02-26 |
| TWI429504B (zh) | 2014-03-11 |
| US8979611B2 (en) | 2015-03-17 |
| KR20120139798A (ko) | 2012-12-27 |
| US20130078892A1 (en) | 2013-03-28 |
| WO2011142177A1 (ja) | 2011-11-17 |
| CN102883857B (zh) | 2015-04-01 |
| CN102883857A (zh) | 2013-01-16 |
| KR101399521B1 (ko) | 2014-05-27 |
| JP2011235389A (ja) | 2011-11-24 |
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