JP2011233933A - 一体化溶接板を有する表面実装型pptcデバイス - Google Patents
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- 238000003466 welding Methods 0.000 title claims abstract description 55
- 101000669528 Homo sapiens Tachykinin-4 Proteins 0.000 title description 30
- 102100039365 Tachykinin-4 Human genes 0.000 title description 30
- 239000007769 metal material Substances 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 230000006378 damage Effects 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000004021 metal welding Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- OKUGPJPKMAEJOE-UHFFFAOYSA-N S-propyl dipropylcarbamothioate Chemical compound CCCSC(=O)N(CCC)CCC OKUGPJPKMAEJOE-UHFFFAOYSA-N 0.000 description 29
- 239000000203 mixture Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- -1 nickel metal hydride Chemical class 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
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Abstract
【解決手段】第1および第2主面ならびにそれらの間に厚さを有する層状PTC抵抗要素(12)を含む表面実装回路保護デバイス(10)。第1主面と実質的に同じ広さを有する第1電極層が、プリント回路基板にはんだ付けするのに適したタイプの第1金属材料から形成される。第2主面に形成される第2電極層は溶接板(18)を形成または規定する構造を含む。この金属溶接板は、デバイスに著しい損傷を与えることなくストラップ相互接続(34)の抵抗マイクロスポット溶接に耐え得る熱質量および厚さを有する。デバイスは好ましくはプリント回路基板アセンブリ(20)に表面実装されて、バッテリストラップ相互接続によってバッテリ/セルに接続されるバッテリ保護回路を形成し、このバッテリストラップ相互接続の1つはデバイスの溶接板にマイクロスポット溶接される。
【選択図】図1
Description
本発明は電気回路部品に関する。より詳細には、本発明は導体ストラップ相互接続(例えばバッテリパックに適する相互接続)が例えば抵抗溶接され得る溶接板を含む表面実装型(または表面実装が可能な)ポリマー正温度係数(Polymeric positive temperature coefficient:PPTC)デバイスに関する。
プリント回路基板と、プリント回路基板に表面実装されるPPTCデバイスを含む電気セルまたはバッテリ保護回路を提供することが知られている。PPTCデバイスを含むプリント回路基板に形成される電気回路は、電気セルまたはバッテリからおよび/またはこれへの電流を安全範囲内に調節するように機能する。この従来のアレンジメントにおいて、セルまたはバッテリからの相互接続ストラップは典型的には、はんだ付けによりPPTCデバイスの箔電極に接続される。この従来の手法の1つの例は国際公開第99/60637号(株式会社 レイケム)に開示されている。もう1つの例は同一人に譲渡された米国特許出願第09/923,598号であって、米国出願公開第2003/0026053号として2003年2月6日に公開されたものに示されている。これら刊行物の開示内容は参照することにより本明細書に明示的に組み込まれる。
本発明者らは、関連するPPTCデバイスを保護し、およびその所望の機能をその後にバッテリで使用する間に維持するため、溶接箇所と真反対にあるPPTC材料を損傷することなくスポット溶接に耐えるのに十分な熱質量(thermal mass:または熱容量)を有する溶接板をPPTCデバイスに設けることによって、バッテリ電極ストラップの抵抗スポット溶接を実施し得ることを見出した。
本発明の回路保護デバイスはPTC材料、例えば導電性ポリマー組成物から構成される層状抵抗要素(または素子)を含む。このような導電性ポリマー組成物はポリマー性成分およびその内部で分散した粒状導電性フィラー(例えば金属またはカーボンブラック)を含む。導電性ポリマー組成物は米国特許第4,237,441号(van Konynenburgら)、同第4,304,987号(van Konynenburg)、同第4,514,620号(Chengら)、同第4,534,889号(van Konynenburgら)、同第4,545,926号(Foutsら)、同第4,724,417号(Auら)、同第4,774,024号(Deepら)、同第4,935,156号(van Konynenburgら)、同第5,049,850号(Evansら)、同第5,378,407号(Chandlerら)、同第5,451,919号(Chuら)、同第5,582,770号(Chuら)、同第5,747,147号(Wartenbergら)、同第5,801,612号(Chandlerら)、同第6,130,597号(Tothら)、同第6,358,438号(Isozakiら)および同第6,362,721号(Chenら)に記載されている。これら特許の各開示内容は参照することにより本明細書に組み込まれる。導電性ポリマー組成物は、PTC挙動を示すセラミック組成物よりも低抵抗率であり、また製造が容易であるので好ましい。
Claims (10)
- 表面実装回路保護デバイスであって:
(a)第1および第2主面ならびにそれらの間に厚さを有する層状PTC抵抗要素;
(b)第1主面に形成され、および第1主面と実質的に同じ広さであり、ならびにデバイスの表面実装を行うためにプリント回路基板にはんだ付けするように適用されるタイプの第1金属材料を含む第1電極層;
(c)第2主面に形成され、および第2主面と実質的に同じ広さである第2電極層;および
(d)第2電極層から延び、およびデバイスに著しい損傷を与えることなくストラップ相互接続手段の抵抗マイクロスポット溶接に耐え得る熱質量を有する、金属材料で出来た溶接板手段
を含む、表面実装回路保護デバイス。 - 第2電極層は箔層として形成され、ならびに溶接板手段は第2電極層と別個に形成され、および電気伝導性材料の取付け層により第2電極層に取り付けられ、好ましくは取付け層がはんだを含む、請求項1に記載の表面実装回路保護デバイス。
- 溶接板がニッケルまたはニッケルめっきされたステンレススチールを含む、請求項2に記載の表面実装回路保護デバイス。
- 溶接板手段は盛り上がった中央メサ領域を含み、ならびにデバイスの外縁部を取り囲みおよび中央メサ領域を露出する開口部を規定する絶縁性の囲いを更に含む、請求項1に記載の表面実装回路保護デバイス。
- 溶接板手段が0.100mmの最小厚さを有し、好ましくは溶接板手段が0.100mm〜0.300mmの範囲の厚さを有する、請求項1に記載の表面実装回路保護デバイス。
- デバイスが表面実装されおよび電気的に接続されるプリント回路基板アセンブリを更に含む、請求項1に記載の表面実装回路保護デバイス。
- プリント回路基板アセンブリがバッテリ保護回路モジュールを形成し、およびバッテリストラップ相互接続によりバッテリまたはセルに実装および電気的に接続され、該バッテリストラップ相互接続の1つが溶接板手段にマイクロスポット溶接される、請求項6に記載の表面実装回路保護デバイス。
- 表面実装回路保護デバイスであって:
(a)第1および第2主面ならびにそれらの間に厚さを有する層状PTC抵抗要素;
(b)第1主面に形成され、および第1主面と実質的に同じ広さであり、ならびにデバイスをプリント回路にはんだにより表面実装することが可能な第1金属箔層を含む第1電極層;
(c)第2主面に形成され、および第2主面と実質的に同じ広さであり、ならびに第2金属箔層を含む第2電極層;および
(d)第2金属箔層に固定され、およびデバイスに著しい損傷を与えることなくストラップ相互接続手段のマイクロスポット溶接に耐えるのに十分な体積、厚さおよび熱質量を有する、金属材料で出来た溶接板
を含む、表面実装回路保護デバイス。 - プリント回路基板を含むバッテリ保護回路アセンブリであって:
(a)第1および第2主面ならびにそれらの間に厚さを有する層状PTC抵抗要素;
(b)第1主面に形成され、および第1主面と実質的に同じ広さであり、ならびにデバイスをプリント回路にはんだにより表面実装することが可能な第1金属箔層を含む第1電極層;
(c)第2主面に形成され、および第2主面と実質的に同じ広さであり、ならびに第2金属箔層を含む第2電極層;および
(d)第2金属箔層に固定され、およびデバイスに著しい損傷を与えることなくストラップ相互接続手段のマイクロスポット溶接に耐えるのに十分な体積、厚さおよび熱質量を有する、金属材料で出来た溶接板
を含む表面実装された回路保護デバイスを含む複数の電気部品がプリント回路基板に取り付けられている、バッテリ保護回路アセンブリ。 - 少なくとも1つの電気化学リチウムポリマーセルを含み、該セルは第1および第2ターミナルタブを有し、以下の条件:
(a)第1タブは溶接板にマイクロスポット溶接される前記ストラップ相互接続手段を含むこと、および
(b)第2タブはプリント回路基板の回路に接続されること
の少なくとも1つが適用される、請求項9に記載のバッテリ保護回路アセンブリ。
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Application Number | Priority Date | Filing Date | Title |
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US10/802127 | 2004-03-15 | ||
US10/802,127 US7920045B2 (en) | 2004-03-15 | 2004-03-15 | Surface mountable PPTC device with integral weld plate |
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JP2005071231A Division JP4873875B2 (ja) | 2004-03-15 | 2005-03-14 | 一体化溶接板を有する表面実装型pptcデバイス |
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JP5663433B2 JP5663433B2 (ja) | 2015-02-04 |
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JP2011174596A Expired - Fee Related JP5663433B2 (ja) | 2004-03-15 | 2011-08-10 | 一体化溶接板を有する表面実装型pptcデバイス |
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EP1577905A2 (en) | 2005-09-21 |
TW200603697A (en) | 2006-01-16 |
US7920045B2 (en) | 2011-04-05 |
EP1577905A3 (en) | 2007-05-23 |
CN1697092B (zh) | 2011-04-27 |
JP5663433B2 (ja) | 2015-02-04 |
CN1697092A (zh) | 2005-11-16 |
US20050200447A1 (en) | 2005-09-15 |
US20110183162A1 (en) | 2011-07-28 |
JP4873875B2 (ja) | 2012-02-08 |
EP1577905B1 (en) | 2015-05-06 |
KR101256658B1 (ko) | 2013-04-19 |
JP2005277410A (ja) | 2005-10-06 |
US8686826B2 (en) | 2014-04-01 |
TWI424801B (zh) | 2014-01-21 |
KR20060043601A (ko) | 2006-05-15 |
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