JP2011205004A - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP2011205004A
JP2011205004A JP2010072721A JP2010072721A JP2011205004A JP 2011205004 A JP2011205004 A JP 2011205004A JP 2010072721 A JP2010072721 A JP 2010072721A JP 2010072721 A JP2010072721 A JP 2010072721A JP 2011205004 A JP2011205004 A JP 2011205004A
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JP
Japan
Prior art keywords
substrate
unit
exposure
holding
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010072721A
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English (en)
Japanese (ja)
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JP2011205004A5 (https=
Inventor
Koji Kanayama
幸司 金山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Semiconductor Solutions Co Ltd
Original Assignee
Screen Semiconductor Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Semiconductor Solutions Co Ltd filed Critical Screen Semiconductor Solutions Co Ltd
Priority to JP2010072721A priority Critical patent/JP2011205004A/ja
Priority to US13/019,711 priority patent/US8635968B2/en
Publication of JP2011205004A publication Critical patent/JP2011205004A/ja
Publication of JP2011205004A5 publication Critical patent/JP2011205004A5/ja
Priority to US14/132,592 priority patent/US8851769B2/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Robotics (AREA)
JP2010072721A 2010-03-26 2010-03-26 基板処理装置および基板処理方法 Pending JP2011205004A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010072721A JP2011205004A (ja) 2010-03-26 2010-03-26 基板処理装置および基板処理方法
US13/019,711 US8635968B2 (en) 2010-03-26 2011-02-02 Substrate processing apparatus and substrate processing method
US14/132,592 US8851769B2 (en) 2010-03-26 2013-12-18 Substrate processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010072721A JP2011205004A (ja) 2010-03-26 2010-03-26 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2011205004A true JP2011205004A (ja) 2011-10-13
JP2011205004A5 JP2011205004A5 (https=) 2012-04-19

Family

ID=44656608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010072721A Pending JP2011205004A (ja) 2010-03-26 2010-03-26 基板処理装置および基板処理方法

Country Status (2)

Country Link
US (2) US8635968B2 (https=)
JP (1) JP2011205004A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015002261A (ja) * 2013-06-14 2015-01-05 東京エレクトロン株式会社 基板洗浄装置、基板洗浄システムおよび基板洗浄方法
JP2020119961A (ja) * 2019-01-22 2020-08-06 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP6307022B2 (ja) 2014-03-05 2018-04-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
US11183401B2 (en) 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
JP7060584B2 (ja) 2016-09-02 2022-04-26 エーエスエムエル ネザーランズ ビー．ブイ． 冷却装置およびリソグラフィ装置
US20250316523A1 (en) * 2024-04-05 2025-10-09 Nanya Technology Corporation Wafer holding tool

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06345262A (ja) * 1993-06-10 1994-12-20 Tokyo Electron Ltd 処理装置
JPH1074818A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 処理装置
JPH11251398A (ja) * 1998-02-26 1999-09-17 Dainippon Screen Mfg Co Ltd 基板搬送装置およびこれを用いた基板洗浄装置ならびに基板搬送方法
JPH11330190A (ja) * 1998-03-13 1999-11-30 Tokyo Electron Ltd 基板の搬送方法及び処理システム
JP2006190921A (ja) * 2004-12-06 2006-07-20 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007214365A (ja) * 2006-02-09 2007-08-23 Sokudo:Kk 基板処理装置
JP2009123800A (ja) * 2007-11-13 2009-06-04 Sokudo:Kk 基板処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19910478C2 (de) * 1998-03-12 2002-02-28 Tokyo Electron Ltd Substrattransportverfahren und Substratbearbeitungssystem
US7262619B2 (en) * 2005-02-28 2007-08-28 Texas Instruments Incorporated Semiconductor device test system
JP4654119B2 (ja) 2005-11-29 2011-03-16 東京エレクトロン株式会社 塗布・現像装置及び塗布・現像方法
JP5039468B2 (ja) * 2007-07-26 2012-10-03 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
JP2009071008A (ja) 2007-09-13 2009-04-02 Sokudo:Kk 基板処理装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06345262A (ja) * 1993-06-10 1994-12-20 Tokyo Electron Ltd 処理装置
JPH1074818A (ja) * 1996-09-02 1998-03-17 Tokyo Electron Ltd 処理装置
JPH11251398A (ja) * 1998-02-26 1999-09-17 Dainippon Screen Mfg Co Ltd 基板搬送装置およびこれを用いた基板洗浄装置ならびに基板搬送方法
JPH11330190A (ja) * 1998-03-13 1999-11-30 Tokyo Electron Ltd 基板の搬送方法及び処理システム
JP2006190921A (ja) * 2004-12-06 2006-07-20 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007214365A (ja) * 2006-02-09 2007-08-23 Sokudo:Kk 基板処理装置
JP2009123800A (ja) * 2007-11-13 2009-06-04 Sokudo:Kk 基板処理装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015002261A (ja) * 2013-06-14 2015-01-05 東京エレクトロン株式会社 基板洗浄装置、基板洗浄システムおよび基板洗浄方法
JP2020119961A (ja) * 2019-01-22 2020-08-06 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体
JP7162541B2 (ja) 2019-01-22 2022-10-28 東京エレクトロン株式会社 基板処理装置、及び基板処理方法、及び記憶媒体
JP2024023751A (ja) * 2019-01-22 2024-02-21 東京エレクトロン株式会社 基板処理装置
JP7622192B2 (ja) 2019-01-22 2025-01-27 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
US8851769B2 (en) 2014-10-07
US20140104586A1 (en) 2014-04-17
US20110236011A1 (en) 2011-09-29
US8635968B2 (en) 2014-01-28

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