JP2011199288A5 - - Google Patents
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- Publication number
- JP2011199288A5 JP2011199288A5 JP2011058010A JP2011058010A JP2011199288A5 JP 2011199288 A5 JP2011199288 A5 JP 2011199288A5 JP 2011058010 A JP2011058010 A JP 2011058010A JP 2011058010 A JP2011058010 A JP 2011058010A JP 2011199288 A5 JP2011199288 A5 JP 2011199288A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- interposer
- laminate layer
- layer
- electrical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 10
- 239000011162 core material Substances 0.000 claims 8
- 229910052710 silicon Inorganic materials 0.000 claims 6
- 239000010703 silicon Substances 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 239000003989 dielectric material Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31531910P | 2010-03-18 | 2010-03-18 | |
| US61/315,319 | 2010-03-18 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011199288A JP2011199288A (ja) | 2011-10-06 |
| JP2011199288A5 true JP2011199288A5 (enExample) | 2013-01-17 |
| JP5327654B2 JP5327654B2 (ja) | 2013-10-30 |
Family
ID=44602547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011058010A Expired - Fee Related JP5327654B2 (ja) | 2010-03-18 | 2011-03-16 | インタポーザを備える装置および方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8338934B2 (enExample) |
| JP (1) | JP5327654B2 (enExample) |
| CN (1) | CN102194705B (enExample) |
| TW (1) | TWI560824B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5460388B2 (ja) * | 2010-03-10 | 2014-04-02 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| US9721872B1 (en) | 2011-02-18 | 2017-08-01 | Amkor Technology, Inc. | Methods and structures for increasing the allowable die size in TMV packages |
| KR101366461B1 (ko) | 2012-11-20 | 2014-02-26 | 앰코 테크놀로지 코리아 주식회사 | 반도체 디바이스 및 그 제조 방법 |
| US9799592B2 (en) | 2013-11-19 | 2017-10-24 | Amkor Technology, Inc. | Semicondutor device with through-silicon via-less deep wells |
| US8729714B1 (en) * | 2012-12-31 | 2014-05-20 | Intel Mobile Communications GmbH | Flip-chip wafer level package and methods thereof |
| US9041207B2 (en) * | 2013-06-28 | 2015-05-26 | Intel Corporation | Method to increase I/O density and reduce layer counts in BBUL packages |
| US9543373B2 (en) * | 2013-10-23 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and manufacturing method thereof |
| KR101607981B1 (ko) | 2013-11-04 | 2016-03-31 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지 |
| US9852998B2 (en) | 2014-05-30 | 2017-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Ring structures in device die |
| US9418965B1 (en) | 2014-10-27 | 2016-08-16 | Altera Corporation | Embedded interposer with through-hole vias |
| US9633934B2 (en) * | 2014-11-26 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semicondutor device and method of manufacture |
| US9515017B2 (en) * | 2014-12-18 | 2016-12-06 | Intel Corporation | Ground via clustering for crosstalk mitigation |
| CN104485320A (zh) * | 2014-12-30 | 2015-04-01 | 华天科技（西安）有限公司 | 一种有垂直通孔的埋入式传感芯片封装结构及其制备方法 |
| CN105097726B (zh) * | 2015-06-16 | 2019-03-12 | 合肥矽迈微电子科技有限公司 | 封装结构及封装方法 |
| US9984998B2 (en) * | 2016-01-06 | 2018-05-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Devices employing thermal and mechanical enhanced layers and methods of forming same |
| US9922895B2 (en) * | 2016-05-05 | 2018-03-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package with tilted interface between device die and encapsulating material |
| CN105934095B (zh) * | 2016-06-28 | 2019-02-05 | Oppo广东移动通信有限公司 | Pcb板及具有其的移动终端 |
| JP2018018936A (ja) * | 2016-07-27 | 2018-02-01 | イビデン株式会社 | 配線基板 |
| US9960328B2 (en) | 2016-09-06 | 2018-05-01 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| WO2018063383A1 (en) | 2016-09-30 | 2018-04-05 | Intel Corporation | Active package substrate having anisotropic conductive layer |
| WO2018063384A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Active package substrate having embedded interposer |
| JP6822192B2 (ja) * | 2017-02-13 | 2021-01-27 | Tdk株式会社 | 電子部品内蔵基板 |
| US10687419B2 (en) * | 2017-06-13 | 2020-06-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
| US10872885B2 (en) * | 2017-06-30 | 2020-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit packages and methods of forming same |
| DE102018108409B4 (de) | 2017-06-30 | 2023-08-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrierte schaltkreis-packages und verfahren zu deren herstellung |
| CN109786362B (zh) * | 2017-11-14 | 2021-01-05 | 旺宏电子股份有限公司 | 无焊垫外扇晶粒叠层结构及其制作方法 |
| US11393779B2 (en) | 2018-06-13 | 2022-07-19 | Invensas Bonding Technologies, Inc. | Large metal pads over TSV |
| EP3807927A4 (en) * | 2018-06-13 | 2022-02-23 | Invensas Bonding Technologies, Inc. | TSV AS PAD |
| CN111415908B (zh) * | 2019-01-07 | 2022-02-22 | 台达电子企业管理（上海）有限公司 | 电源模块、芯片嵌入式封装模块及制备方法 |
| US11239193B2 (en) * | 2020-01-17 | 2022-02-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
| US11450615B2 (en) * | 2020-06-12 | 2022-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of fabricating the same |
| CN113838829B (zh) * | 2020-06-23 | 2025-01-24 | 欣兴电子股份有限公司 | 封装载板及其制作方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5866952A (en) * | 1995-11-30 | 1999-02-02 | Lockheed Martin Corporation | High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate |
| JP2000223645A (ja) * | 1999-02-01 | 2000-08-11 | Mitsubishi Electric Corp | 半導体装置 |
| US7161239B2 (en) * | 2000-12-22 | 2007-01-09 | Broadcom Corporation | Ball grid array package enhanced with a thermal and electrical connector |
| US7202556B2 (en) * | 2001-12-20 | 2007-04-10 | Micron Technology, Inc. | Semiconductor package having substrate with multi-layer metal bumps |
| SG104293A1 (en) * | 2002-01-09 | 2004-06-21 | Micron Technology Inc | Elimination of rdl using tape base flip chip on flex for die stacking |
| US6506633B1 (en) * | 2002-02-15 | 2003-01-14 | Unimicron Technology Corp. | Method of fabricating a multi-chip module package |
| TWI334638B (en) * | 2005-12-30 | 2010-12-11 | Ind Tech Res Inst | Structure and process of chip package |
| SG135074A1 (en) * | 2006-02-28 | 2007-09-28 | Micron Technology Inc | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices |
| US20080142946A1 (en) * | 2006-12-13 | 2008-06-19 | Advanced Chip Engineering Technology Inc. | Wafer level package with good cte performance |
| TWI341577B (en) * | 2007-03-27 | 2011-05-01 | Unimicron Technology Corp | Semiconductor chip embedding structure |
| US7687899B1 (en) * | 2007-08-07 | 2010-03-30 | Amkor Technology, Inc. | Dual laminate package structure with embedded elements |
| JP5101240B2 (ja) * | 2007-10-25 | 2012-12-19 | 日本特殊陶業株式会社 | 板状部品内蔵配線基板 |
| US8230589B2 (en) * | 2008-03-25 | 2012-07-31 | Intel Corporation | Method of mounting an optical device |
| JP2009289802A (ja) * | 2008-05-27 | 2009-12-10 | Tdk Corp | 電子部品内蔵モジュール及びその製造方法 |
| FR2938976A1 (fr) | 2008-11-24 | 2010-05-28 | St Microelectronics Grenoble | Dispositif semi-conducteur a composants empiles |
| US8900921B2 (en) * | 2008-12-11 | 2014-12-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV |
-
2011
- 2011-03-16 US US13/049,550 patent/US8338934B2/en active Active
- 2011-03-16 JP JP2011058010A patent/JP5327654B2/ja not_active Expired - Fee Related
- 2011-03-18 TW TW100109299A patent/TWI560824B/zh active
- 2011-03-18 CN CN201110068207.9A patent/CN102194705B/zh active Active
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