TWI560824B - Embedded die with protective interposer - Google Patents

Embedded die with protective interposer

Info

Publication number
TWI560824B
TWI560824B TW100109299A TW100109299A TWI560824B TW I560824 B TWI560824 B TW I560824B TW 100109299 A TW100109299 A TW 100109299A TW 100109299 A TW100109299 A TW 100109299A TW I560824 B TWI560824 B TW I560824B
Authority
TW
Taiwan
Prior art keywords
interposer
protective
embedded die
die
embedded
Prior art date
Application number
TW100109299A
Other languages
English (en)
Chinese (zh)
Other versions
TW201145478A (en
Inventor
Albert Wu
Scott Wu
Original Assignee
Marvell World Trade Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marvell World Trade Ltd filed Critical Marvell World Trade Ltd
Publication of TW201145478A publication Critical patent/TW201145478A/zh
Application granted granted Critical
Publication of TWI560824B publication Critical patent/TWI560824B/zh

Links

Classifications

    • H10W70/093—
    • H10W70/614—
    • H10W72/20—
    • H10W72/29—
    • H10W72/30—
    • H10W72/874—
    • H10W72/877—
    • H10W72/9413—
    • H10W74/114—
    • H10W90/00—
    • H10W90/22—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
TW100109299A 2010-03-18 2011-03-18 Embedded die with protective interposer TWI560824B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31531910P 2010-03-18 2010-03-18

Publications (2)

Publication Number Publication Date
TW201145478A TW201145478A (en) 2011-12-16
TWI560824B true TWI560824B (en) 2016-12-01

Family

ID=44602547

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100109299A TWI560824B (en) 2010-03-18 2011-03-18 Embedded die with protective interposer

Country Status (4)

Country Link
US (1) US8338934B2 (enExample)
JP (1) JP5327654B2 (enExample)
CN (1) CN102194705B (enExample)
TW (1) TWI560824B (enExample)

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JP5460388B2 (ja) * 2010-03-10 2014-04-02 新光電気工業株式会社 半導体装置及びその製造方法
US9721872B1 (en) * 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9799592B2 (en) 2013-11-19 2017-10-24 Amkor Technology, Inc. Semicondutor device with through-silicon via-less deep wells
KR101366461B1 (ko) 2012-11-20 2014-02-26 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
US8729714B1 (en) * 2012-12-31 2014-05-20 Intel Mobile Communications GmbH Flip-chip wafer level package and methods thereof
US9041207B2 (en) * 2013-06-28 2015-05-26 Intel Corporation Method to increase I/O density and reduce layer counts in BBUL packages
US9543373B2 (en) * 2013-10-23 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor structure and manufacturing method thereof
KR101607981B1 (ko) 2013-11-04 2016-03-31 앰코 테크놀로지 코리아 주식회사 반도체 패키지용 인터포저 및 이의 제조 방법, 제조된 인터포저를 이용한 반도체 패키지
US9852998B2 (en) * 2014-05-30 2017-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Ring structures in device die
US9418965B1 (en) 2014-10-27 2016-08-16 Altera Corporation Embedded interposer with through-hole vias
US9633934B2 (en) 2014-11-26 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semicondutor device and method of manufacture
US9515017B2 (en) * 2014-12-18 2016-12-06 Intel Corporation Ground via clustering for crosstalk mitigation
CN104485320A (zh) * 2014-12-30 2015-04-01 华天科技（西安）有限公司 一种有垂直通孔的埋入式传感芯片封装结构及其制备方法
CN109904127B (zh) * 2015-06-16 2023-09-26 合肥矽迈微电子科技有限公司 封装结构及封装方法
US9984998B2 (en) 2016-01-06 2018-05-29 Taiwan Semiconductor Manufacturing Company, Ltd. Devices employing thermal and mechanical enhanced layers and methods of forming same
US9922895B2 (en) * 2016-05-05 2018-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Package with tilted interface between device die and encapsulating material
CN105934095B (zh) * 2016-06-28 2019-02-05 Oppo广东移动通信有限公司 Pcb板及具有其的移动终端
JP2018018936A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 配線基板
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US20190181093A1 (en) * 2016-09-30 2019-06-13 Intel Corporation Active package substrate having embedded interposer
US10790257B2 (en) 2016-09-30 2020-09-29 Intel Corporation Active package substrate having anisotropic conductive layer
JP6822192B2 (ja) * 2017-02-13 2021-01-27 Tdk株式会社 電子部品内蔵基板
US10687419B2 (en) * 2017-06-13 2020-06-16 Advanced Semiconductor Engineering, Inc. Semiconductor package device and method of manufacturing the same
DE102018108409B4 (de) * 2017-06-30 2023-08-10 Taiwan Semiconductor Manufacturing Co., Ltd. Integrierte schaltkreis-packages und verfahren zu deren herstellung
US10872885B2 (en) * 2017-06-30 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages and methods of forming same
CN109786362B (zh) * 2017-11-14 2021-01-05 旺宏电子股份有限公司 无焊垫外扇晶粒叠层结构及其制作方法
EP3807927A4 (en) * 2018-06-13 2022-02-23 Invensas Bonding Technologies, Inc. TSV AS PAD
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
CN111415908B (zh) * 2019-01-07 2022-02-22 台达电子企业管理（上海）有限公司 电源模块、芯片嵌入式封装模块及制备方法
US11239193B2 (en) * 2020-01-17 2022-02-01 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit package and method
US11450615B2 (en) * 2020-06-12 2022-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of fabricating the same
CN113838829B (zh) * 2020-06-23 2025-01-24 欣兴电子股份有限公司 封装载板及其制作方法

Citations (1)

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US20040219713A1 (en) * 2002-01-09 2004-11-04 Micron Technology, Inc. Elimination of RDL using tape base flip chip on flex for die stacking

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US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
JP2000223645A (ja) * 1999-02-01 2000-08-11 Mitsubishi Electric Corp 半導体装置
US7161239B2 (en) * 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US7202556B2 (en) * 2001-12-20 2007-04-10 Micron Technology, Inc. Semiconductor package having substrate with multi-layer metal bumps
US6506633B1 (en) * 2002-02-15 2003-01-14 Unimicron Technology Corp. Method of fabricating a multi-chip module package
TWI334638B (en) * 2005-12-30 2010-12-11 Ind Tech Res Inst Structure and process of chip package
SG135074A1 (en) * 2006-02-28 2007-09-28 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
US20080142946A1 (en) * 2006-12-13 2008-06-19 Advanced Chip Engineering Technology Inc. Wafer level package with good cte performance
TWI341577B (en) * 2007-03-27 2011-05-01 Unimicron Technology Corp Semiconductor chip embedding structure
US7687899B1 (en) * 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
JP5101240B2 (ja) * 2007-10-25 2012-12-19 日本特殊陶業株式会社 板状部品内蔵配線基板
US8230589B2 (en) * 2008-03-25 2012-07-31 Intel Corporation Method of mounting an optical device
JP2009289802A (ja) * 2008-05-27 2009-12-10 Tdk Corp 電子部品内蔵モジュール及びその製造方法
FR2938976A1 (fr) 2008-11-24 2010-05-28 St Microelectronics Grenoble Dispositif semi-conducteur a composants empiles
US8900921B2 (en) * 2008-12-11 2014-12-02 Stats Chippac, Ltd. Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040219713A1 (en) * 2002-01-09 2004-11-04 Micron Technology, Inc. Elimination of RDL using tape base flip chip on flex for die stacking

Also Published As

Publication number Publication date
US8338934B2 (en) 2012-12-25
TW201145478A (en) 2011-12-16
CN102194705B (zh) 2014-07-23
JP2011199288A (ja) 2011-10-06
US20110227223A1 (en) 2011-09-22
CN102194705A (zh) 2011-09-21
JP5327654B2 (ja) 2013-10-30

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