JP5327654B2 - インタポーザを備える装置および方法 - Google Patents

インタポーザを備える装置および方法 Download PDF

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Publication number
JP5327654B2
JP5327654B2 JP2011058010A JP2011058010A JP5327654B2 JP 5327654 B2 JP5327654 B2 JP 5327654B2 JP 2011058010 A JP2011058010 A JP 2011058010A JP 2011058010 A JP2011058010 A JP 2011058010A JP 5327654 B2 JP5327654 B2 JP 5327654B2
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die
interposer
laminate layer
substrate
layer
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JP2011199288A (ja
JP2011199288A5 (enExample
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ウー アルバート
ウー スコット
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マーベル ワールド トレード リミテッド
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    • H10W70/093—
    • H10W70/614—
    • H10W72/20—
    • H10W72/29—
    • H10W72/30—
    • H10W72/874—
    • H10W72/877—
    • H10W72/9413—
    • H10W74/114—
    • H10W90/00—
    • H10W90/22—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2011058010A 2010-03-18 2011-03-16 インタポーザを備える装置および方法 Expired - Fee Related JP5327654B2 (ja)

Applications Claiming Priority (2)

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US31531910P 2010-03-18 2010-03-18
US61/315,319 2010-03-18

Publications (3)

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JP2011199288A JP2011199288A (ja) 2011-10-06
JP2011199288A5 JP2011199288A5 (enExample) 2013-01-17
JP5327654B2 true JP5327654B2 (ja) 2013-10-30

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US (1) US8338934B2 (enExample)
JP (1) JP5327654B2 (enExample)
CN (1) CN102194705B (enExample)
TW (1) TWI560824B (enExample)

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CN109904127B (zh) * 2015-06-16 2023-09-26 合肥矽迈微电子科技有限公司 封装结构及封装方法
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US9922895B2 (en) * 2016-05-05 2018-03-20 Taiwan Semiconductor Manufacturing Company, Ltd. Package with tilted interface between device die and encapsulating material
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JP2018018936A (ja) * 2016-07-27 2018-02-01 イビデン株式会社 配線基板
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US20190181093A1 (en) * 2016-09-30 2019-06-13 Intel Corporation Active package substrate having embedded interposer
US10790257B2 (en) 2016-09-30 2020-09-29 Intel Corporation Active package substrate having anisotropic conductive layer
JP6822192B2 (ja) * 2017-02-13 2021-01-27 Tdk株式会社 電子部品内蔵基板
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US10872885B2 (en) * 2017-06-30 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages and methods of forming same
CN109786362B (zh) * 2017-11-14 2021-01-05 旺宏电子股份有限公司 无焊垫外扇晶粒叠层结构及其制作方法
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Also Published As

Publication number Publication date
US8338934B2 (en) 2012-12-25
TW201145478A (en) 2011-12-16
CN102194705B (zh) 2014-07-23
JP2011199288A (ja) 2011-10-06
TWI560824B (en) 2016-12-01
US20110227223A1 (en) 2011-09-22
CN102194705A (zh) 2011-09-21

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