JP2011199267A - 電子デバイスおよび電子デバイスの製造方法 - Google Patents
電子デバイスおよび電子デバイスの製造方法 Download PDFInfo
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Abstract
【解決手段】表面がシリコン結晶であるベース基板と、シリコン結晶上の一部の領域に形成された3−5族化合物半導体結晶と、3−5族化合物半導体結晶の一部を活性層として含む電子素子と、ベース基板上に形成され、当該電子素子を覆う絶縁膜と、絶縁膜上に形成された電極と、絶縁膜を貫通し、少なくとも一部が絶縁膜上に形成され、電子素子と電極とを電気的に結合する第1の結合配線と、絶縁膜上に形成された受動素子と、絶縁膜を貫通し、少なくとも一部が絶縁膜上に形成され、電子素子と受動素子とを電気的に結合する第2の結合配線とを備える電子デバイスを提供する。
【選択図】図1
Description
(特許文献1)特開2001−68580号公報
Claims (13)
- 表面がシリコン結晶であるベース基板と、
前記シリコン結晶上の一部の領域に形成された3−5族化合物半導体結晶と、
前記3−5族化合物半導体結晶の一部を活性層として含む電子素子と、
前記ベース基板上に形成され、前記電子素子を覆う絶縁膜と、
前記絶縁膜上に形成された電極と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記電極とを電気的に結合する第1の結合配線と、
前記絶縁膜上に形成された受動素子と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記受動素子とを電気的に結合する第2の結合配線と
を備える電子デバイス。 - 前記絶縁膜上に形成され、前記電極及び前記第1の結合配線を封止する封止材をさらに備え、
前記電極は、前記封止材を貫通して前記封止材の表面に露出している
請求項1に記載の電子デバイス。 - 前記3−5族化合物半導体結晶は、前記シリコン結晶と前記3−5族化合物半導体結晶との間の格子不整合を緩和するシード体を介して形成されている
請求項1または2に記載の電子デバイス。 - 前記シード体は、組成がCxSiyGezSn1−x−y−z(0≦x<1、0≦y≦1、0≦z<1、0<x+y+z≦1)である
請求項3に記載の電子デバイス。 - 前記3−5族化合物半導体結晶は、GaAs結晶、及び前記GaAs結晶に格子整合または擬格子整合するAlaGabIn1−a−bNcPdAs1−c―d(0≦a≦1、0≦b≦1、0≦c≦1、0≦d≦1、0≦a+b≦1、0≦c+d≦1)結晶を含む、
請求項4に記載の電子デバイス。 - 前記ベース基板上に、化合物半導体結晶の成長を阻害する阻害体をさらに備え、
前記シード体は、前記阻害体に形成されかつ前記ベース基板に達する開口内に形成されている
請求項3から5のいずれか一項に記載の電子デバイス。 - 前記電子素子がトランジスタであり、
前記トランジスタと前記受動素子とがマイクロ波回路を形成している
請求項3から6のいずれか一項に記載の電子デバイス。 - 前記トランジスタがFETである
請求項7に記載の電子デバイス。 - 前記トランジスタがヘテロバイポーラトランジスタであり、
前記受動素子が前記ヘテロバイポーラトランジスタの熱暴走を阻止する抵抗体を含む
請求項7に記載の電子デバイス。 - 前記第1の結合配線及び前記第2の結合配線が、前記シード体と前記電子素子とが接する面に垂直な方向に、前記電子素子から延伸している
請求項3から9のいずれか一項に記載の電子デバイス。 - 表面がシリコン結晶であるベース基板と、
前記シリコン結晶上の一部の領域に形成された複数の3−5族化合物半導体結晶と、
前記複数の3−5族化合物半導体結晶のうち一部の複数の3−5族化合物半導体結晶のそれぞれの3−5族化合物半導体結晶の一部を活性層としてそれぞれ1つずつ含む電子素子と、
前記ベース基板上に形成され、前記電子素子を覆う絶縁膜と、
前記絶縁膜上に形成された電極と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記電極とを電気的に結合する第1の結合配線と、
前記絶縁膜上に形成された受動素子と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記受動素子とを電気的に結合する第2の結合配線と
を備え、
前記一部の複数の3−5族化合物半導体結晶は、規則的に配置されている
半導体ウエハー。 - 表面がシリコン結晶であるベース基板と、
前記シリコン結晶上の一部の領域に形成された複数のシード体と、
前記複数のシード体のそれぞれのシード体上に形成された複数の3−5族化合物半導体結晶と、
前記複数の3−5族化合物半導体結晶のうち一部の複数の3−5族化合物半導体結晶のそれぞれの3−5族化合物半導体結晶の一部を活性層としてそれぞれ1つずつ含む電子素子と、
前記ベース基板上に形成され、前記電子素子を覆う絶縁膜と、
前記絶縁膜上に形成された電極と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記電極とを電気的に結合する第1の結合配線と、
前記絶縁膜上に形成された受動素子と、
前記絶縁膜を貫通し、少なくとも一部が前記絶縁膜上に形成され、前記電子素子と前記受動素子とを電気的に結合する第2の結合配線と
を備え、
前記シード体は、前記シリコン結晶と前記3−5族化合物半導体結晶との間の格子不整合を緩和する結晶であり、
前記複数のシード体は、規則的に配置されている
半導体ウエハー。 - 表面がシリコン結晶であるベース基板上の一部の領域に形成されたシード体と、前記シード体上に形成され、活性層として機能する層を含む3−5族化合物半導体結晶を有する電子素子とを備える基体に、
前記電子素子を覆う絶縁膜を形成する段階と、
前記絶縁膜上に、前記電子素子と電気的に結合される電極を形成する段階と、
前記絶縁膜上に、前記電子素子と電気的に結合される受動素子を形成する段階と、
前記電子素子に達する第1のビアホール及び第2のビアホールを前記絶縁膜に形成する段階と、
前記第1のビアホールを介して前記電子素子と前記電極とを電気的に結合する第1の結合配線を形成する段階と、
前記第2のビアホールを介して前記電子素子と前記受動素子とを電気的に結合する第2の結合配線を形成する段階と
を備える電子デバイスの製造方法。
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US10998390B2 (en) | 2018-12-24 | 2021-05-04 | Samsung Display Co., Ltd. | Organic light emitting diode display and a manufacturing method thereof |
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US10593600B2 (en) | 2016-02-24 | 2020-03-17 | International Business Machines Corporation | Distinct gate stacks for III-V-based CMOS circuits comprising a channel cap |
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