JP2011187867A5 - - Google Patents
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- JP2011187867A5 JP2011187867A5 JP2010054208A JP2010054208A JP2011187867A5 JP 2011187867 A5 JP2011187867 A5 JP 2011187867A5 JP 2010054208 A JP2010054208 A JP 2010054208A JP 2010054208 A JP2010054208 A JP 2010054208A JP 2011187867 A5 JP2011187867 A5 JP 2011187867A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- material layer
- processing chamber
- less
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000463 material Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010054208A JP2011187867A (ja) | 2010-03-11 | 2010-03-11 | 接合方法および水晶素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010054208A JP2011187867A (ja) | 2010-03-11 | 2010-03-11 | 接合方法および水晶素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011187867A JP2011187867A (ja) | 2011-09-22 |
| JP2011187867A5 true JP2011187867A5 (enExample) | 2013-03-14 |
Family
ID=44793753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010054208A Pending JP2011187867A (ja) | 2010-03-11 | 2010-03-11 | 接合方法および水晶素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011187867A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6258592B2 (ja) * | 2013-03-25 | 2018-01-10 | 京セラ株式会社 | 光学機器用窓部材 |
| JP6395517B2 (ja) * | 2014-09-01 | 2018-09-26 | 京セラ株式会社 | 光学セルの製造方法 |
| JP2020123926A (ja) | 2019-01-31 | 2020-08-13 | セイコーエプソン株式会社 | 振動デバイス、振動モジュール、電子機器、移動体および振動デバイスの製造方法 |
| JP7230541B2 (ja) | 2019-01-31 | 2023-03-01 | セイコーエプソン株式会社 | 振動デバイスおよび振動モジュール |
| CN120178389B (zh) * | 2025-05-21 | 2025-08-19 | 中国科学院高能物理研究所 | 一种超高能量分辨率分析晶体及其制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5070557B2 (ja) * | 2007-02-27 | 2012-11-14 | 武仁 島津 | 常温接合方法 |
| JP2009206759A (ja) * | 2008-02-27 | 2009-09-10 | Seiko Instruments Inc | 圧電振動片、圧電振動子、発振器、電子機器及び電波時計並びに圧電振動片の製造方法 |
| JP5401661B2 (ja) * | 2008-08-22 | 2014-01-29 | 株式会社ムサシノエンジニアリング | 原子拡散接合方法及び前記方法により接合された構造体 |
-
2010
- 2010-03-11 JP JP2010054208A patent/JP2011187867A/ja active Pending
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