JP2011187867A - 接合方法および水晶素子 - Google Patents

接合方法および水晶素子 Download PDF

Info

Publication number
JP2011187867A
JP2011187867A JP2010054208A JP2010054208A JP2011187867A JP 2011187867 A JP2011187867 A JP 2011187867A JP 2010054208 A JP2010054208 A JP 2010054208A JP 2010054208 A JP2010054208 A JP 2010054208A JP 2011187867 A JP2011187867 A JP 2011187867A
Authority
JP
Japan
Prior art keywords
substrate
bonding
material layer
quartz
bonding surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010054208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011187867A5 (enExample
Inventor
Takehito Shimazu
武仁 島津
Sachi Uomoto
幸 魚本
Hirokazu Kobayashi
宏和 小林
Kenji Oba
健司 大場
Yukiko Furukata
由紀子 古堅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku University NUC
Kyocera Crystal Device Corp
Original Assignee
Tohoku University NUC
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University NUC, Kyocera Crystal Device Corp filed Critical Tohoku University NUC
Priority to JP2010054208A priority Critical patent/JP2011187867A/ja
Publication of JP2011187867A publication Critical patent/JP2011187867A/ja
Publication of JP2011187867A5 publication Critical patent/JP2011187867A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Physical Vapour Deposition (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010054208A 2010-03-11 2010-03-11 接合方法および水晶素子 Pending JP2011187867A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010054208A JP2011187867A (ja) 2010-03-11 2010-03-11 接合方法および水晶素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010054208A JP2011187867A (ja) 2010-03-11 2010-03-11 接合方法および水晶素子

Publications (2)

Publication Number Publication Date
JP2011187867A true JP2011187867A (ja) 2011-09-22
JP2011187867A5 JP2011187867A5 (enExample) 2013-03-14

Family

ID=44793753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010054208A Pending JP2011187867A (ja) 2010-03-11 2010-03-11 接合方法および水晶素子

Country Status (1)

Country Link
JP (1) JP2011187867A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014186887A (ja) * 2013-03-25 2014-10-02 Kyocera Crystal Device Corp 光学機器用窓部材
JP2016050863A (ja) * 2014-09-01 2016-04-11 京セラクリスタルデバイス株式会社 光学セル及びその製造方法
US11539346B2 (en) 2019-01-31 2022-12-27 Seiko Epson Corporation Resonator device, resonator module, electronic apparatus, and vehicle
US11575361B2 (en) 2019-01-31 2023-02-07 Seiko Epson Corporation Resonator device, resonator module, electronic apparatus, and vehicle
CN120178389A (zh) * 2025-05-21 2025-06-20 中国科学院高能物理研究所 一种超高能量分辨率分析晶体及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008207221A (ja) * 2007-02-27 2008-09-11 Takehito Shimazu 常温接合方法
JP2009206759A (ja) * 2008-02-27 2009-09-10 Seiko Instruments Inc 圧電振動片、圧電振動子、発振器、電子機器及び電波時計並びに圧電振動片の製造方法
JP2010046696A (ja) * 2008-08-22 2010-03-04 Musashino Eng:Kk 原子拡散接合方法及び前記方法により接合された構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008207221A (ja) * 2007-02-27 2008-09-11 Takehito Shimazu 常温接合方法
JP2009206759A (ja) * 2008-02-27 2009-09-10 Seiko Instruments Inc 圧電振動片、圧電振動子、発振器、電子機器及び電波時計並びに圧電振動片の製造方法
JP2010046696A (ja) * 2008-08-22 2010-03-04 Musashino Eng:Kk 原子拡散接合方法及び前記方法により接合された構造体

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014186887A (ja) * 2013-03-25 2014-10-02 Kyocera Crystal Device Corp 光学機器用窓部材
JP2016050863A (ja) * 2014-09-01 2016-04-11 京セラクリスタルデバイス株式会社 光学セル及びその製造方法
US11539346B2 (en) 2019-01-31 2022-12-27 Seiko Epson Corporation Resonator device, resonator module, electronic apparatus, and vehicle
US11575361B2 (en) 2019-01-31 2023-02-07 Seiko Epson Corporation Resonator device, resonator module, electronic apparatus, and vehicle
CN120178389A (zh) * 2025-05-21 2025-06-20 中国科学院高能物理研究所 一种超高能量分辨率分析晶体及其制备方法

Similar Documents

Publication Publication Date Title
TWI664754B (zh) 接合體以及彈性波元件
US10964882B2 (en) Bonding method
JP4993204B2 (ja) 圧電振動子及びその製造方法
US4247034A (en) Method of indirectly connecting two parts
CN101849276B (zh) 一种利用光的设备及其制造方法
JP2011187867A (ja) 接合方法および水晶素子
US11139427B2 (en) Bonded body and elastic wave element
US20210111698A1 (en) Bonded body and elastic wave element
EP3722268B1 (en) Functional element, method for manufacturing functional element, and electronic device
US11456720B2 (en) Bonded body with piezoelectric monocrystalline substrate and supporting substrate
CN102037386B (zh) 光学元件及其制造方法
CN115744813A (zh) 一种mems级晶圆的低温熔融键合方法
WO2022172902A1 (ja) 化学結合法及びパッケージ型電子部品,並びに電子デバイスのハイブリッド接合法
US11070189B2 (en) Joint and elastic wave element
WO2020148911A1 (ja) 形状可変ミラー及びその製造方法
US20130327093A1 (en) Method of producing lightweight structural elements
JP5543525B2 (ja) 光学デバイスおよびその製造方法
JPWO2015111753A1 (ja) パッケージ形成方法及びmems用パッケージ
EP0153232A2 (fr) Procédé de scellement étanche et étuvable d'objets métalliques sur un corps en matériau vitrocéramique
Cheung Die-level glass frit vacuum packaging for a micro-fuel processor system
TWI791590B (zh) 接合石英件之方法及接合之石英的石英電極及其他裝置
WO2021225101A1 (ja) 圧電体複合基板およびその製造方法
TW202236427A (zh) 氧化矽熱反射板
JP5950962B2 (ja) 光学素子の製造方法
EP4131777A1 (en) Bonded body and method for producing same

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130130

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140212

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140624