JP2011171053A - 表示装置 - Google Patents
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- JP2011171053A JP2011171053A JP2010032439A JP2010032439A JP2011171053A JP 2011171053 A JP2011171053 A JP 2011171053A JP 2010032439 A JP2010032439 A JP 2010032439A JP 2010032439 A JP2010032439 A JP 2010032439A JP 2011171053 A JP2011171053 A JP 2011171053A
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- 239000002184 metal Substances 0.000 claims abstract description 132
- 229910052751 metal Inorganic materials 0.000 claims abstract description 132
- 230000004888 barrier function Effects 0.000 claims abstract description 102
- 238000004544 sputter deposition Methods 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 30
- 239000004973 liquid crystal related substance Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 6
- 239000003870 refractory metal Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 40
- 239000004065 semiconductor Substances 0.000 abstract description 35
- 238000010438 heat treatment Methods 0.000 abstract description 11
- 238000009751 slip forming Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 118
- 239000010408 film Substances 0.000 description 56
- 239000011229 interlayer Substances 0.000 description 17
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000002161 passivation Methods 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78663—Amorphous silicon transistors
- H01L29/78666—Amorphous silicon transistors with normal-type structure, e.g. with top gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Abstract
【解決手段】スルーホールにおいて、TFTのソース部とソース電極8が接続している。ソース電極8は、バリヤメタル、Al合金82、キャップメタル83の3層から形成されている。バリヤメタルは半導体層と接触する下層81aとAl合金と接触する上層81bとに分かれている。バリヤメタルの下層81aをスパッタリングして形成した後、熱処理し、その後、ベースメタルの上層81b、Al合金82、キャップメタル83を連続してスパッタリングによって形成する。Al合金82と接触するバリヤメタルの上層81bは酸化されていないので、スルーホールにおけるコンタクト抵抗の上昇を防止することが出来る。
【選択図】図6
Description
Claims (6)
- 走査線が第1の方向に延在して第2の方向に配列し、映像信号線が第2の方向に延在して第2の方向に配列し、前記走査線と前記映像信号線とで囲まれた領域に画素が形成され、前記画素は、TFTと、下部電極と上部電極で挟持された有機EL層を有する有機EL表示装置であって、
前記TFTと前記下部電極を接続するソース電極は、バリヤメタル、Alを含む金属、キャップメタルの3層によって形成され、
前記バリヤメタルは前記TFTと接触する第1の層と、前記Alを含む金属と接触する第2の層によって形成されていることを特徴とする有機EL表示装置。 - 前記バリヤメタルおよび前記キャップメタルは高融点金属を含む金属によって形成されていることを特徴とする請求項1に記載の有機EL表示装置。
- 走査線が第1の方向に延在して第2の方向に配列し、映像信号線が第2の方向に延在して第2の方向に配列し、前記走査線と前記映像信号線とで囲まれた領域に画素が形成され、前記画素は、スイッチングTFTと、画素電極を有する表示領域と、前記表示領域の周辺に駆動回路が駆動TFTによって形成された液晶表示装置であって、
前記駆動TFTと接続するソース電極は、バリヤメタル、Alを含む金属、キャップメタルの3層によって形成され、
前記バリヤメタルは前記駆動TFTと接触する第1の層と、前記Alを含む金属と接触する第2の層によって形成されていることを特徴とする液晶表示装置。 - 前記バリヤメタルおよび前記キャップメタルは高融点金属を含む金属によって形成されていることを特徴とする請求項3に記載の有機EL表示装置。
- 走査線が第1の方向に延在して第2の方向に配列し、映像信号線が第2の方向に延在して第2の方向に配列し、前記走査線と前記映像信号線とで囲まれた領域に画素が形成され、前記画素には、TFTと、下部電極と上部電極で挟持された有機EL層が形成された基板を有する有機EL表示装置の製造方法であって、
前記TFTと前記下部電極を接続するソース電極は、バリヤメタル、Alを含む金属、キャップメタルの3層によって形成し、
前記バリヤメタルは前記TFTと接触する第1の層と、前記Alを含む金属と接触する第2の層によって形成し、
前記バリヤメタルの前記第1の層をスパッタリングによって形成した後、前記基板を熱処理し、
その後、前記第1の層の上に前記バリヤメタルの第2の層、前記Alを含む金属、キャップメタルを連続してスパッタリングによって形成することを特徴とする有機EL表示装置の製造方法。 - 走査線が第1の方向に延在して第2の方向に配列し、映像信号線が第2の方向に延在して第2の方向に配列し、前記走査線と前記映像信号線とで囲まれた領域に画素が形成され、前記画素は、スイッチングTFTと、画素電極を有する表示領域と、前記表示領域の周辺に駆動回路が駆動TFTによって形成された液晶表示装置の製造方法であって、
前記駆動TFTと接続するソース電極は、バリヤメタル、Alを含む金属、キャップメタルの3層によって形成し、
前記バリヤメタルは前記駆動TFTと接触する第1の層と、前記Alを含む金属と接触する第2の層によって形成し、
前記バリヤメタルの前記第1の層をスパッタリングによって形成した後、前記基板を熱処理し、
その後、前記第1の層の上に前記バリヤメタルの第2の層、前記Alを含む金属、キャップメタルを連続してスパッタリングによって形成することを特徴とする液晶表示装置の製造方法。
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JP2010032439A JP5662689B2 (ja) | 2010-02-17 | 2010-02-17 | 表示装置およびその製造方法 |
US13/028,339 US8817200B2 (en) | 2010-02-17 | 2011-02-16 | Liquid crystal display device comprising a TFT with a barrier metal formed of a first layer and a second layer wherein the first layer is denser than the second layer |
US14/449,717 US8947610B2 (en) | 2010-02-17 | 2014-08-01 | Display device comprising a TFT with a barrier metal formed of a first layer and a second layer wherein an amount of oxygen in the first layer is larger than in the second layer |
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CN103018990B (zh) * | 2012-12-14 | 2015-12-02 | 京东方科技集团股份有限公司 | 一种阵列基板和其制备方法、及液晶显示装置 |
CN104393023B (zh) | 2014-12-01 | 2018-01-26 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
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JP2008028363A (ja) * | 2006-06-21 | 2008-02-07 | Seiko Epson Corp | 電気光学装置の製造方法 |
JP2009049244A (ja) * | 2007-08-21 | 2009-03-05 | Hitachi Displays Ltd | 液晶表示装置 |
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KR101012491B1 (ko) * | 2003-12-04 | 2011-02-08 | 엘지디스플레이 주식회사 | 액정표시장치용 어레이기판과 제조방법 |
JP2007142059A (ja) | 2005-11-17 | 2007-06-07 | Hitachi Displays Ltd | 表示装置の製造方法 |
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- 2011-02-16 US US13/028,339 patent/US8817200B2/en active Active
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Patent Citations (8)
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JPH1117189A (ja) * | 1997-06-25 | 1999-01-22 | Mitsubishi Electric Corp | 薄膜トランジスタおよびその製造方法ならびにこれを搭載した液晶表示装置 |
JP2001350159A (ja) * | 2000-06-06 | 2001-12-21 | Hitachi Ltd | 液晶表示装置及びその製造方法 |
JP2003317971A (ja) * | 2002-04-26 | 2003-11-07 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2005109347A (ja) * | 2003-10-01 | 2005-04-21 | Seiko Epson Corp | 半導体装置および半導体装置の製造方法 |
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JP2008028363A (ja) * | 2006-06-21 | 2008-02-07 | Seiko Epson Corp | 電気光学装置の製造方法 |
JP2009049244A (ja) * | 2007-08-21 | 2009-03-05 | Hitachi Displays Ltd | 液晶表示装置 |
JP2009211009A (ja) * | 2008-03-06 | 2009-09-17 | Hitachi Displays Ltd | 液晶表示装置 |
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US8947610B2 (en) | 2015-02-03 |
JP5662689B2 (ja) | 2015-02-04 |
US8817200B2 (en) | 2014-08-26 |
US20140340606A1 (en) | 2014-11-20 |
US20110199551A1 (en) | 2011-08-18 |
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