JP2011124293A5 - - Google Patents
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- Publication number
- JP2011124293A5 JP2011124293A5 JP2009279035A JP2009279035A JP2011124293A5 JP 2011124293 A5 JP2011124293 A5 JP 2011124293A5 JP 2009279035 A JP2009279035 A JP 2009279035A JP 2009279035 A JP2009279035 A JP 2009279035A JP 2011124293 A5 JP2011124293 A5 JP 2011124293A5
- Authority
- JP
- Japan
- Prior art keywords
- faraday shield
- plasma processing
- processing apparatus
- slit
- frequency power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 4
- 230000006698 induction Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009279035A JP2011124293A (ja) | 2009-12-09 | 2009-12-09 | プラズマ処理装置 |
| KR1020100013164A KR101142411B1 (ko) | 2009-12-09 | 2010-02-12 | 플라즈마처리장치 |
| US12/712,795 US20110132540A1 (en) | 2009-12-09 | 2010-02-25 | Plasma processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009279035A JP2011124293A (ja) | 2009-12-09 | 2009-12-09 | プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011124293A JP2011124293A (ja) | 2011-06-23 |
| JP2011124293A5 true JP2011124293A5 (enrdf_load_stackoverflow) | 2013-07-25 |
Family
ID=44080850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009279035A Pending JP2011124293A (ja) | 2009-12-09 | 2009-12-09 | プラズマ処理装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20110132540A1 (enrdf_load_stackoverflow) |
| JP (1) | JP2011124293A (enrdf_load_stackoverflow) |
| KR (1) | KR101142411B1 (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5711953B2 (ja) * | 2010-12-13 | 2015-05-07 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP5856791B2 (ja) * | 2011-10-05 | 2016-02-10 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| WO2013099372A1 (ja) * | 2011-12-27 | 2013-07-04 | キヤノンアネルバ株式会社 | 放電容器及びプラズマ処理装置 |
| DE102012103425A1 (de) * | 2012-04-19 | 2013-10-24 | Roth & Rau Ag | Mikrowellenplasmaerzeugungsvorrichtung und Verfahren zu deren Betrieb |
| JP6620078B2 (ja) | 2016-09-05 | 2019-12-11 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP7042142B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| JP7042143B2 (ja) * | 2018-03-30 | 2022-03-25 | 株式会社ダイヘン | プラズマ発生装置 |
| JP7139181B2 (ja) * | 2018-07-26 | 2022-09-20 | ワイエイシイテクノロジーズ株式会社 | プラズマ処理装置 |
| US20200286712A1 (en) * | 2019-03-05 | 2020-09-10 | Advanced Energy Industries, Inc. | Single-turn and laminated-wall inductively coupled plasma sources |
| KR102540773B1 (ko) * | 2021-01-19 | 2023-06-12 | 피에스케이 주식회사 | 패러데이 실드 및 기판 처리 장치 |
| CN114864367A (zh) * | 2022-03-25 | 2022-08-05 | 上海谙邦半导体设备有限公司 | 一种具有屏蔽效果的介质管及等离子体反应腔 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6063233A (en) * | 1991-06-27 | 2000-05-16 | Applied Materials, Inc. | Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna |
| US6024826A (en) * | 1996-05-13 | 2000-02-15 | Applied Materials, Inc. | Plasma reactor with heated source of a polymer-hardening precursor material |
| US5540800A (en) * | 1994-06-23 | 1996-07-30 | Applied Materials, Inc. | Inductively coupled high density plasma reactor for plasma assisted materials processing |
| US5650032A (en) * | 1995-06-06 | 1997-07-22 | International Business Machines Corporation | Apparatus for producing an inductive plasma for plasma processes |
| US6132551A (en) * | 1997-09-20 | 2000-10-17 | Applied Materials, Inc. | Inductive RF plasma reactor with overhead coil and conductive laminated RF window beneath the overhead coil |
| US6149760A (en) * | 1997-10-20 | 2000-11-21 | Tokyo Electron Yamanashi Limited | Plasma processing apparatus |
| US6280563B1 (en) * | 1997-12-31 | 2001-08-28 | Lam Research Corporation | Plasma device including a powered non-magnetic metal member between a plasma AC excitation source and the plasma |
| KR100542459B1 (ko) * | 1999-03-09 | 2006-01-12 | 가부시끼가이샤 히다치 세이사꾸쇼 | 플라즈마처리장치 및 플라즈마처리방법 |
| JP4384301B2 (ja) * | 1999-09-13 | 2009-12-16 | 株式会社日立製作所 | プラズマ処理装置 |
| US6447636B1 (en) * | 2000-02-16 | 2002-09-10 | Applied Materials, Inc. | Plasma reactor with dynamic RF inductive and capacitive coupling control |
| US6685799B2 (en) * | 2001-03-14 | 2004-02-03 | Applied Materials Inc. | Variable efficiency faraday shield |
| KR100452920B1 (ko) | 2002-07-19 | 2004-10-14 | 한국디엔에스 주식회사 | 유도결합형 플라즈마 에칭 장치 |
| CN100353484C (zh) | 2002-07-31 | 2007-12-05 | 兰姆研究有限公司 | 用于调整带电的法拉第屏蔽上的电压的方法 |
| KR20040077019A (ko) * | 2003-02-27 | 2004-09-04 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마처리장치 및 처리방법 |
| US20070170867A1 (en) * | 2006-01-24 | 2007-07-26 | Varian Semiconductor Equipment Associates, Inc. | Plasma Immersion Ion Source With Low Effective Antenna Voltage |
| KR100783071B1 (ko) | 2006-12-22 | 2007-12-07 | 세메스 주식회사 | 패러데이 실드 유닛 및 이를 갖는 기판 처리 장치 |
| JP4659771B2 (ja) * | 2007-02-13 | 2011-03-30 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
-
2009
- 2009-12-09 JP JP2009279035A patent/JP2011124293A/ja active Pending
-
2010
- 2010-02-12 KR KR1020100013164A patent/KR101142411B1/ko not_active Expired - Fee Related
- 2010-02-25 US US12/712,795 patent/US20110132540A1/en not_active Abandoned