MX2012001712A - Aparato y metodo para remocion de oxidos de superficie por la via de la tecnica sin fundente que involucra la union de electron. - Google Patents
Aparato y metodo para remocion de oxidos de superficie por la via de la tecnica sin fundente que involucra la union de electron.Info
- Publication number
- MX2012001712A MX2012001712A MX2012001712A MX2012001712A MX2012001712A MX 2012001712 A MX2012001712 A MX 2012001712A MX 2012001712 A MX2012001712 A MX 2012001712A MX 2012001712 A MX2012001712 A MX 2012001712A MX 2012001712 A MX2012001712 A MX 2012001712A
- Authority
- MX
- Mexico
- Prior art keywords
- cathode
- removal
- electron attachment
- anode
- surface oxides
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/087—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
- B01J19/088—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Plasma Technology (AREA)
- Electron Sources, Ion Sources (AREA)
- Cold Cathode And The Manufacture (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Se describe en la presente un método y aparato para remoción de óxidos de metal sobre una superficie de un componente por la vía de la unión de electrón. En una modalidad, se proporciona un aparato de emisión de campo, en donde los electrones se unen a por lo menos una porción del gas de reducción para formar iones atómicos negativamente cargados que remueven los óxidos de metal, que comprende: un cátodo que comprende una parte eléctricamente conductora y que comprende por lo menos una o más protuberancias que tienen una alta curvatura de superficie, en donde el cátodo es circundado por un material dieléctrico que luego es circundado por un ánodo eléctricamente conductor, en donde el cátodo y el ánodo son cada uno conectados a una fuente de voltaje eléctrico, y el material dieléctrico entre el cátodo y el ánodo se polariza para proporcionar un campo eléctrico en una o más protuberancias y de esta manera electrones desde el cátodo.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161441053P | 2011-02-09 | 2011-02-09 | |
US201161563112P | 2011-11-23 | 2011-11-23 | |
US13/364,925 US9006975B2 (en) | 2011-02-09 | 2012-02-02 | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2012001712A true MX2012001712A (es) | 2012-08-29 |
Family
ID=45654899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2012001712A MX2012001712A (es) | 2011-02-09 | 2012-02-08 | Aparato y metodo para remocion de oxidos de superficie por la via de la tecnica sin fundente que involucra la union de electron. |
Country Status (7)
Country | Link |
---|---|
US (1) | US9006975B2 (es) |
EP (1) | EP2487002A1 (es) |
KR (1) | KR101323951B1 (es) |
CN (1) | CN102672298B (es) |
MX (1) | MX2012001712A (es) |
SG (1) | SG183626A1 (es) |
TW (1) | TWI510677B (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9006975B2 (en) * | 2011-02-09 | 2015-04-14 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
US9053894B2 (en) * | 2011-02-09 | 2015-06-09 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
US10307850B2 (en) * | 2017-08-24 | 2019-06-04 | Micron Technology, Inc. | Solder removal from semiconductor devices |
CN111585437B (zh) * | 2020-05-12 | 2021-09-28 | 联合汽车电子有限公司 | 锡须去除电路、电子终端产品及锡须去除方法 |
CN117460154A (zh) * | 2022-07-18 | 2024-01-26 | 奥特斯科技(重庆)有限公司 | 部件承载件、制造部件承载件的方法和设备 |
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US2909662A (en) | 1955-07-18 | 1959-10-20 | Research Corp | Dielectric field emission methods and apparatus |
CA980880A (en) | 1971-04-13 | 1975-12-30 | Pavel Imris | High frequency generator and method of using radiation of energy from excited and metastable atoms of a plasma |
GB2238651A (en) * | 1989-11-29 | 1991-06-05 | Gen Electric Co Plc | Field emission devices. |
FR2697456B1 (fr) * | 1992-10-30 | 1994-12-23 | Air Liquide | Procédé et dispositif de fluxage par voie sèche. |
US5409543A (en) | 1992-12-22 | 1995-04-25 | Sandia Corporation | Dry soldering with hot filament produced atomic hydrogen |
US6007637A (en) | 1993-06-11 | 1999-12-28 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process and apparatus for the dry treatment of metal surfaces |
US6021940A (en) | 1993-12-15 | 2000-02-08 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method and apparatus for reflow soldering metallic surfaces |
FR2713528B1 (fr) | 1993-12-15 | 1996-01-12 | Air Liquide | Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage. |
FR2735053B1 (fr) | 1995-06-09 | 1997-07-25 | Air Liquide | Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche |
CH692446A5 (de) | 1996-04-15 | 2002-06-28 | Esec Sa | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
US5941448A (en) | 1996-06-07 | 1999-08-24 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor |
FR2750622B1 (fr) | 1996-07-02 | 1998-09-25 | Air Liquide | Procede de traitement de surface par voie seche et dispositif pour la mise en oeuvre d'un tel procede |
FR2750620B1 (fr) | 1996-07-02 | 1998-09-25 | Air Liquide | Dispositif d'excitation de gaz |
DE19815703A1 (de) | 1998-04-08 | 1999-10-14 | Heinrich Hoelter | Vorrichtung zur Erzeugung von Ozon aus sauerstoffhaltigen Gasen |
JP2935263B1 (ja) | 1998-06-10 | 1999-08-16 | 株式会社スキャンテクノロジー | 回転体のコード認識システム及び方法 |
EP1276130A2 (en) | 2001-06-26 | 2003-01-15 | Matsushita Electric Works, Ltd. | Method of and apparatus for manufacturing field emission-type electron source |
US6776330B2 (en) * | 2001-09-10 | 2004-08-17 | Air Products And Chemicals, Inc. | Hydrogen fluxless soldering by electron attachment |
JP3591723B2 (ja) | 2001-09-11 | 2004-11-24 | 九州日立マクセル株式会社 | 放電装置 |
US7079370B2 (en) * | 2003-04-28 | 2006-07-18 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation |
TWI274622B (en) * | 2003-04-28 | 2007-03-01 | Air Prod & Chem | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation |
US8361340B2 (en) | 2003-04-28 | 2013-01-29 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
CA2465195C (en) * | 2003-04-28 | 2012-06-19 | Air Products And Chemicals, Inc. | Electrode assembly for the removal of surface oxides by electron attachment |
US7897029B2 (en) * | 2008-03-04 | 2011-03-01 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
US7387738B2 (en) * | 2003-04-28 | 2008-06-17 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment for wafer bumping applications |
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US7691278B2 (en) | 2005-09-27 | 2010-04-06 | Lam Research Corporation | Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor |
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US20110180149A1 (en) * | 2010-01-28 | 2011-07-28 | Fine Neal E | SINGLE DIELECTRIC BARRIER DISCHARGE PLASMA ACTUATORS WITH IN-PLASMA catalysts AND METHOD OF FABRICATING THE SAME |
US9053894B2 (en) * | 2011-02-09 | 2015-06-09 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
US9006975B2 (en) * | 2011-02-09 | 2015-04-14 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
-
2012
- 2012-02-02 US US13/364,925 patent/US9006975B2/en active Active
- 2012-02-08 MX MX2012001712A patent/MX2012001712A/es active IP Right Grant
- 2012-02-08 TW TW101104117A patent/TWI510677B/zh active
- 2012-02-08 EP EP12000811A patent/EP2487002A1/en not_active Withdrawn
- 2012-02-09 SG SG2012009411A patent/SG183626A1/en unknown
- 2012-02-09 CN CN201210103296.0A patent/CN102672298B/zh active Active
- 2012-02-09 KR KR1020120013489A patent/KR101323951B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN102672298B (zh) | 2016-07-06 |
KR101323951B1 (ko) | 2013-10-31 |
TWI510677B (zh) | 2015-12-01 |
EP2487002A1 (en) | 2012-08-15 |
CN102672298A (zh) | 2012-09-19 |
TW201237217A (en) | 2012-09-16 |
SG183626A1 (en) | 2012-09-27 |
KR20120092073A (ko) | 2012-08-20 |
US9006975B2 (en) | 2015-04-14 |
US20130026921A1 (en) | 2013-01-31 |
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FG | Grant or registration |