JP2011103358A5 - - Google Patents
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- Publication number
- JP2011103358A5 JP2011103358A5 JP2009257469A JP2009257469A JP2011103358A5 JP 2011103358 A5 JP2011103358 A5 JP 2011103358A5 JP 2009257469 A JP2009257469 A JP 2009257469A JP 2009257469 A JP2009257469 A JP 2009257469A JP 2011103358 A5 JP2011103358 A5 JP 2011103358A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- mounting structure
- structure according
- semiconductor mounting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 7
- 229910052710 silicon Inorganic materials 0.000 claims 7
- 239000010703 silicon Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009257469A JP5357706B2 (ja) | 2009-11-10 | 2009-11-10 | 半導体実装構造体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009257469A JP5357706B2 (ja) | 2009-11-10 | 2009-11-10 | 半導体実装構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011103358A JP2011103358A (ja) | 2011-05-26 |
| JP2011103358A5 true JP2011103358A5 (enrdf_load_stackoverflow) | 2012-10-25 |
| JP5357706B2 JP5357706B2 (ja) | 2013-12-04 |
Family
ID=44193584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009257469A Expired - Fee Related JP5357706B2 (ja) | 2009-11-10 | 2009-11-10 | 半導体実装構造体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5357706B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5709719B2 (ja) * | 2011-01-18 | 2015-04-30 | 有限会社 ナプラ | 電子部品支持装置及び電子デバイス |
| JP2013003714A (ja) * | 2011-06-14 | 2013-01-07 | Denso Corp | 電源装置および車両用電子制御装置 |
| JP6279921B2 (ja) * | 2014-02-12 | 2018-02-14 | 新光電気工業株式会社 | 配線基板及び半導体パッケージ |
| CN109075133B (zh) * | 2016-04-25 | 2022-08-09 | 京瓷株式会社 | 电子部件搭载用基板、电子装置以及电子模块 |
| WO2018142499A1 (ja) * | 2017-02-01 | 2018-08-09 | 三菱電機株式会社 | 波長可変光源 |
| EP3806330A4 (en) * | 2018-05-24 | 2021-06-30 | Toppan Printing Co., Ltd. | PRINTED CIRCUIT CARD |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06169029A (ja) * | 1992-05-11 | 1994-06-14 | Nec Corp | Ｐｗｂの放熱パッド |
| JP2004221248A (ja) * | 2003-01-14 | 2004-08-05 | Citizen Electronics Co Ltd | 半導体装置 |
| JP4179186B2 (ja) * | 2004-02-25 | 2008-11-12 | ソニー株式会社 | 配線基板およびその製造方法および半導体装置 |
| KR100703090B1 (ko) * | 2005-08-30 | 2007-04-06 | 삼성전기주식회사 | 후면 접지형 플립칩 반도체 패키지 |
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2009
- 2009-11-10 JP JP2009257469A patent/JP5357706B2/ja not_active Expired - Fee Related