JP2011086700A5 - - Google Patents

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Publication number
JP2011086700A5
JP2011086700A5 JP2009236989A JP2009236989A JP2011086700A5 JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5 JP 2009236989 A JP2009236989 A JP 2009236989A JP 2009236989 A JP2009236989 A JP 2009236989A JP 2011086700 A5 JP2011086700 A5 JP 2011086700A5
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JP
Japan
Prior art keywords
radiating plate
heat
heat sink
heat radiating
square
Prior art date
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Application number
JP2009236989A
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English (en)
Japanese (ja)
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JP2011086700A (ja
JP5276565B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2009236989A priority Critical patent/JP5276565B2/ja
Priority claimed from JP2009236989A external-priority patent/JP5276565B2/ja
Priority to US12/856,700 priority patent/US20110083836A1/en
Publication of JP2011086700A publication Critical patent/JP2011086700A/ja
Publication of JP2011086700A5 publication Critical patent/JP2011086700A5/ja
Application granted granted Critical
Publication of JP5276565B2 publication Critical patent/JP5276565B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009236989A 2009-10-14 2009-10-14 放熱用部品 Active JP5276565B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009236989A JP5276565B2 (ja) 2009-10-14 2009-10-14 放熱用部品
US12/856,700 US20110083836A1 (en) 2009-10-14 2010-08-16 Heat radiating component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009236989A JP5276565B2 (ja) 2009-10-14 2009-10-14 放熱用部品

Publications (3)

Publication Number Publication Date
JP2011086700A JP2011086700A (ja) 2011-04-28
JP2011086700A5 true JP2011086700A5 (zh) 2012-08-16
JP5276565B2 JP5276565B2 (ja) 2013-08-28

Family

ID=43853901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009236989A Active JP5276565B2 (ja) 2009-10-14 2009-10-14 放熱用部品

Country Status (2)

Country Link
US (1) US20110083836A1 (zh)
JP (1) JP5276565B2 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111112A1 (ja) * 2010-03-12 2011-09-15 富士通株式会社 放熱構造体およびその製造方法
KR101275792B1 (ko) * 2010-07-28 2013-06-18 삼성디스플레이 주식회사 표시 장치 및 유기 발광 표시 장치
JP5790023B2 (ja) * 2011-02-25 2015-10-07 富士通株式会社 電子部品の製造方法
JP6015009B2 (ja) * 2012-01-25 2016-10-26 富士通株式会社 電子装置及びその製造方法
JP6217084B2 (ja) * 2013-01-17 2017-10-25 富士通株式会社 放熱構造体及びその製造方法
JP6244651B2 (ja) * 2013-05-01 2017-12-13 富士通株式会社 シート状構造体及びその製造方法、並びに電子装置及びその製造方法
US10510707B2 (en) * 2013-11-11 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Thermally conductive molding compound structure for heat dissipation in semiconductor packages
JP6261352B2 (ja) * 2014-01-23 2018-01-17 新光電気工業株式会社 カーボンナノチューブシート及び半導体装置とカーボンナノチューブシートの製造方法及び半導体装置の製造方法
JP2015216199A (ja) * 2014-05-09 2015-12-03 新光電気工業株式会社 半導体装置、熱伝導部材及び半導体装置の製造方法
US9296056B2 (en) * 2014-07-08 2016-03-29 International Business Machines Corporation Device for thermal management of surface mount devices during reflow soldering
EP3231059A4 (en) * 2015-04-27 2018-09-05 Hewlett-Packard Development Company, L.P. Charging devices
JP6927490B2 (ja) * 2017-05-31 2021-09-01 株式会社応用ナノ粒子研究所 放熱構造体
CN107623084B (zh) * 2017-10-13 2020-12-29 京东方科技集团股份有限公司 封装盖板及其制作方法
EP3703115A4 (en) * 2017-10-27 2020-10-28 Nissan Motor Co., Ltd. SEMICONDUCTOR COMPONENT
DE102021107824A1 (de) * 2021-03-29 2022-09-29 Nanowired Gmbh Verbindung zweier Bauteile mit einem Verbindungselement

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2709239C3 (de) * 1977-03-03 1980-07-24 Eltreva Ag, Aesch (Schweiz) Verfahren zur Herstellung eines selektiv Sonnenwärmeenergie absorbierenden Überzugs auf einem Metallsubstrat
US5214563A (en) * 1991-12-31 1993-05-25 Compaq Computer Corporation Thermally reactive lead assembly and method for making same
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
WO2003061001A1 (en) * 2002-01-16 2003-07-24 Fujitsu Limited Heat sink having high efficiency cooling capacity and semiconductor device comprising it
US20040042178A1 (en) * 2002-09-03 2004-03-04 Vadim Gektin Heat spreader with surface cavity
US7273095B2 (en) * 2003-03-11 2007-09-25 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Nanoengineered thermal materials based on carbon nanotube array composites
CN100377340C (zh) * 2004-08-11 2008-03-26 鸿富锦精密工业（深圳）有限公司 散热模组及其制备方法
JP4646642B2 (ja) * 2005-01-27 2011-03-09 京セラ株式会社 半導体素子用パッケージ
CN100337981C (zh) * 2005-03-24 2007-09-19 清华大学 热界面材料及其制造方法
AU2006249601B2 (en) * 2005-05-26 2011-08-11 Nanocomp Technologies, Inc. Systems and methods for thermal management of electronic components
JP2007243106A (ja) * 2006-03-13 2007-09-20 Fujitsu Ltd 半導体パッケージ構造
JP4992461B2 (ja) * 2007-02-21 2012-08-08 富士通株式会社 電子回路装置及び電子回路装置モジュール
JP5018419B2 (ja) * 2007-11-19 2012-09-05 富士通株式会社 モジュール構造体、その製造方法および半導体装置
JP5013116B2 (ja) * 2007-12-11 2012-08-29 富士通株式会社 シート状構造体及びその製造方法並びに電子機器

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