JP2011058093A - プリント配線板の製造方法 - Google Patents

プリント配線板の製造方法 Download PDF

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Publication number
JP2011058093A
JP2011058093A JP2010196716A JP2010196716A JP2011058093A JP 2011058093 A JP2011058093 A JP 2011058093A JP 2010196716 A JP2010196716 A JP 2010196716A JP 2010196716 A JP2010196716 A JP 2010196716A JP 2011058093 A JP2011058093 A JP 2011058093A
Authority
JP
Japan
Prior art keywords
substrate
plating film
opening
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010196716A
Other languages
English (en)
Japanese (ja)
Inventor
Satoru Kawai
悟 川合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of JP2011058093A publication Critical patent/JP2011058093A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
JP2010196716A 2009-09-04 2010-09-02 プリント配線板の製造方法 Pending JP2011058093A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23999509P 2009-09-04 2009-09-04
US12/862,331 US20110056838A1 (en) 2009-09-04 2010-08-24 Method of manufacturing printed wiring board

Publications (1)

Publication Number Publication Date
JP2011058093A true JP2011058093A (ja) 2011-03-24

Family

ID=43646852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010196716A Pending JP2011058093A (ja) 2009-09-04 2010-09-02 プリント配線板の製造方法

Country Status (5)

Country Link
US (1) US20110056838A1 (zh)
JP (1) JP2011058093A (zh)
KR (1) KR20110025612A (zh)
CN (1) CN102014589A (zh)
TW (1) TW201132263A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014513211A (ja) * 2011-04-26 2014-05-29 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 銅の電解析出用水性酸浴
WO2021245766A1 (ja) * 2020-06-02 2021-12-09 奥野製薬工業株式会社 断続的電気めっき方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8686300B2 (en) 2008-12-24 2014-04-01 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
US8188380B2 (en) 2008-12-29 2012-05-29 Ibiden Co., Ltd. Printed wiring board and method for manufacturing printed wiring board
KR20120003458A (ko) * 2009-04-24 2012-01-10 스미토모 덴키 고교 가부시키가이샤 프린트 배선판용 기판, 프린트 배선판, 및 그들의 제조방법
TW201349976A (zh) 2012-05-31 2013-12-01 Zhen Ding Technology Co Ltd 多層線路板之製作方法
CN103517583B (zh) 2012-06-27 2016-09-28 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板
CN108754555B (zh) * 2018-08-29 2020-04-28 广东天承科技有限公司 一种电镀液及其电镀方法
CN110430674A (zh) * 2019-07-10 2019-11-08 广东工业大学 一种电镀沉积电路板的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1059982C (zh) * 1997-08-28 2000-12-27 华通电脑股份有限公司 制造集成电路封装电路板的方法
EP1153430B1 (de) * 1999-01-21 2004-11-10 ATOTECH Deutschland GmbH Verfahren zum galvanischen bilden von leiterstrukturen aus hochreinem kupfer bei der herstellung von integrierten schaltungen
TW511408B (en) * 2000-09-18 2002-11-21 Nippon Denkai Kk Method of producing copper foil for fine wiring
JP3807312B2 (ja) * 2002-01-18 2006-08-09 富士通株式会社 プリント基板とその製造方法
JP2004311919A (ja) * 2003-02-21 2004-11-04 Shinko Electric Ind Co Ltd スルーホールフィル方法
JP3964822B2 (ja) * 2003-05-07 2007-08-22 日東電工株式会社 回路付サスペンション基板の製造方法
CN101027431B (zh) * 2004-09-24 2011-04-13 揖斐电株式会社 电镀方法及电镀装置
US7262444B2 (en) * 2005-08-17 2007-08-28 General Electric Company Power semiconductor packaging method and structure
JP4878866B2 (ja) * 2006-02-22 2012-02-15 イビデン株式会社 めっき装置及びめっき方法
CN101416569B (zh) * 2006-03-30 2011-04-06 埃托特克德国有限公司 用金属填充孔和凹处的电解方法
CN101030033A (zh) * 2007-03-30 2007-09-05 华东师范大学 用叠层光刻胶牺牲层制备mems悬空结构的方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014513211A (ja) * 2011-04-26 2014-05-29 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 銅の電解析出用水性酸浴
WO2021245766A1 (ja) * 2020-06-02 2021-12-09 奥野製薬工業株式会社 断続的電気めっき方法
WO2021246133A1 (ja) * 2020-06-02 2021-12-09 奥野製薬工業株式会社 断続的電気めっき方法
KR20230018406A (ko) 2020-06-02 2023-02-07 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 단속적 전기 도금 방법

Also Published As

Publication number Publication date
US20110056838A1 (en) 2011-03-10
TW201132263A (en) 2011-09-16
CN102014589A (zh) 2011-04-13
KR20110025612A (ko) 2011-03-10

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