JP2010539521A - 光学コンポーネント、該コンポーネント製造方法および該コンポーネントが設けられた光電子素子 - Google Patents

光学コンポーネント、該コンポーネント製造方法および該コンポーネントが設けられた光電子素子 Download PDF

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Publication number
JP2010539521A
JP2010539521A JP2010523267A JP2010523267A JP2010539521A JP 2010539521 A JP2010539521 A JP 2010539521A JP 2010523267 A JP2010523267 A JP 2010523267A JP 2010523267 A JP2010523267 A JP 2010523267A JP 2010539521 A JP2010539521 A JP 2010539521A
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Japan
Prior art keywords
optical component
molding material
resin molding
surface layer
component
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Pending
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JP2010523267A
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English (en)
Japanese (ja)
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JP2010539521A5 (enExample
Inventor
クロイター ゲルトルート
ピーツォンカ トルステン
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2010539521A publication Critical patent/JP2010539521A/ja
Publication of JP2010539521A5 publication Critical patent/JP2010539521A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2010523267A 2007-09-04 2008-08-14 光学コンポーネント、該コンポーネント製造方法および該コンポーネントが設けられた光電子素子 Pending JP2010539521A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007041889 2007-09-04
DE102007052133A DE102007052133A1 (de) 2007-09-04 2007-10-31 Optisches Bauteil, Verfahren zur Herstellung des Bauteils und optoelektronisches Bauelement mit dem Bauteil
PCT/DE2008/001353 WO2009030193A1 (de) 2007-09-04 2008-08-14 Optisches bauteil, verfahren zur herstellung des bauteils und optoelektronisches bauelement mit dem bauteil

Publications (2)

Publication Number Publication Date
JP2010539521A true JP2010539521A (ja) 2010-12-16
JP2010539521A5 JP2010539521A5 (enExample) 2012-02-16

Family

ID=40299222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010523267A Pending JP2010539521A (ja) 2007-09-04 2008-08-14 光学コンポーネント、該コンポーネント製造方法および該コンポーネントが設けられた光電子素子

Country Status (8)

Country Link
US (1) US8194326B2 (enExample)
EP (1) EP2185952B1 (enExample)
JP (1) JP2010539521A (enExample)
KR (1) KR20100057042A (enExample)
CN (1) CN101796435B (enExample)
DE (1) DE102007052133A1 (enExample)
TW (1) TWI382504B (enExample)
WO (1) WO2009030193A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014155247A1 (en) * 2013-03-27 2014-10-02 Koninklijke Philips N.V. Retrofit organic light emitting diode (oled) light source
EP3209712A4 (en) * 2014-10-20 2018-03-28 Dow Corning Toray Co., Ltd. Optical member, optical semiconductor device, and illumination apparatus
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
DE102015103335A1 (de) 2015-03-06 2016-09-08 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
JP2007051053A (ja) * 2005-07-21 2007-03-01 Sony Corp 金属酸化物ナノ粒子及びその製造方法、並びに、発光素子組立体及び光学材料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125319A (en) * 1976-05-03 1978-11-14 Eastman Kodak Company Active light control device
US6183872B1 (en) * 1995-08-11 2001-02-06 Daikin Industries, Ltd. Silicon-containing organic fluoropolymers and use of the same
DE69939514D1 (de) * 1998-03-17 2008-10-23 Seiko Epson Corp Verfahren zur herstellung einer strukturierten dünnschichtvorrichtung
EP1245657B1 (en) * 1999-09-08 2006-11-08 Daikin Industries, Ltd. Fluorochemical adhesive material and layered product obtained with the same
EP1487916A4 (en) 2002-03-07 2006-05-24 Petroferm Inc DUST-REPELLING COMPOSITIONS
JP4506070B2 (ja) * 2002-11-01 2010-07-21 コニカミノルタホールディングス株式会社 防眩層の形成方法、防眩フィルムの製造方法及び防眩層形成用のインクジェット装置
DE102004019973B4 (de) * 2004-02-29 2006-07-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines kontaminationsgeschützten, optoelektronischen Bauelements und kontaminationsgeschütztes, optoelektronisches Bauelement
JP4496394B2 (ja) * 2004-03-31 2010-07-07 日本ゼオン株式会社 耐候性レンズ又はプリズム
US6991826B2 (en) * 2004-04-20 2006-01-31 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
JP4539518B2 (ja) 2005-03-31 2010-09-08 セイコーエプソン株式会社 電気光学装置及び電気光学装置の製造方法
JP2006285104A (ja) * 2005-04-04 2006-10-19 Dainippon Printing Co Ltd カラーフィルタおよびカラーフィルタの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
JP2007051053A (ja) * 2005-07-21 2007-03-01 Sony Corp 金属酸化物ナノ粒子及びその製造方法、並びに、発光素子組立体及び光学材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法

Also Published As

Publication number Publication date
EP2185952B1 (de) 2018-12-12
CN101796435B (zh) 2015-08-19
CN101796435A (zh) 2010-08-04
EP2185952A1 (de) 2010-05-19
US8194326B2 (en) 2012-06-05
TWI382504B (zh) 2013-01-11
DE102007052133A1 (de) 2009-03-05
US20100220396A1 (en) 2010-09-02
WO2009030193A1 (de) 2009-03-12
KR20100057042A (ko) 2010-05-28
TW200913183A (en) 2009-03-16

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