KR20100057042A - 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 - Google Patents

광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 Download PDF

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Publication number
KR20100057042A
KR20100057042A KR1020107005554A KR20107005554A KR20100057042A KR 20100057042 A KR20100057042 A KR 20100057042A KR 1020107005554 A KR1020107005554 A KR 1020107005554A KR 20107005554 A KR20107005554 A KR 20107005554A KR 20100057042 A KR20100057042 A KR 20100057042A
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KR
South Korea
Prior art keywords
molding material
resin molding
component
optical component
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107005554A
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English (en)
Korean (ko)
Inventor
거트루드 크라우터
톨스텐 핏존카
Original Assignee
오스람 옵토 세미컨덕터스 게엠베하
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Application filed by 오스람 옵토 세미컨덕터스 게엠베하 filed Critical 오스람 옵토 세미컨덕터스 게엠베하
Publication of KR20100057042A publication Critical patent/KR20100057042A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020107005554A 2007-09-04 2008-08-14 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛 Ceased KR20100057042A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102007041889.4 2007-09-04
DE102007041889 2007-09-04
DE102007052133.4 2007-10-31
DE102007052133A DE102007052133A1 (de) 2007-09-04 2007-10-31 Optisches Bauteil, Verfahren zur Herstellung des Bauteils und optoelektronisches Bauelement mit dem Bauteil

Publications (1)

Publication Number Publication Date
KR20100057042A true KR20100057042A (ko) 2010-05-28

Family

ID=40299222

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107005554A Ceased KR20100057042A (ko) 2007-09-04 2008-08-14 광학 부품，상기 부품의 제조 방법 및 상기 부품을 포함하는 광전 조립체 유닛

Country Status (8)

Country Link
US (1) US8194326B2 (enExample)
EP (1) EP2185952B1 (enExample)
JP (1) JP2010539521A (enExample)
KR (1) KR20100057042A (enExample)
CN (1) CN101796435B (enExample)
DE (1) DE102007052133A1 (enExample)
TW (1) TWI382504B (enExample)
WO (1) WO2009030193A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2015145491A (ru) * 2013-03-27 2017-05-16 ОЛЕДВоркс ГмбХ МОДЕРНИЗИРОВАННЫЙ ИСТОЧНИК СВЕТА НА ОРГАНИЧЕСКИХ СВЕТОИЗЛУЧАЮЩИХ ДИОДАХ (ОСИДах)
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法
JP6656238B2 (ja) * 2014-10-20 2020-03-04 ダウ・東レ株式会社 光学部材、光半導体デバイス、および照明装置
JP6446280B2 (ja) 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
DE102015103335A1 (de) * 2015-03-06 2016-09-08 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125319A (en) * 1976-05-03 1978-11-14 Eastman Kodak Company Active light control device
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
DE69624923T2 (de) * 1995-08-11 2003-08-21 Daikin Industries, Ltd. Silizium enthaltende organische fluorpolymere und ihre verwendung
CN100550472C (zh) * 1998-03-17 2009-10-14 精工爱普生株式会社 薄膜构图的衬底及其表面处理
DE60031797T2 (de) * 1999-09-08 2007-09-06 Daikin Industries, Ltd. Fluorchemisches klebstoffmaterial und daraus erhältliches schichtförmiges produkt
AU2003217989A1 (en) 2002-03-07 2003-09-22 Petroferm Inc. Dust repellant compositions
JP4506070B2 (ja) * 2002-11-01 2010-07-21 コニカミノルタホールディングス株式会社 防眩層の形成方法、防眩フィルムの製造方法及び防眩層形成用のインクジェット装置
DE102004019973B4 (de) * 2004-02-29 2006-07-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines kontaminationsgeschützten, optoelektronischen Bauelements und kontaminationsgeschütztes, optoelektronisches Bauelement
JP4496394B2 (ja) * 2004-03-31 2010-07-07 日本ゼオン株式会社 耐候性レンズ又はプリズム
US6991826B2 (en) * 2004-04-20 2006-01-31 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
JP4539518B2 (ja) 2005-03-31 2010-09-08 セイコーエプソン株式会社 電気光学装置及び電気光学装置の製造方法
JP2006285104A (ja) * 2005-04-04 2006-10-19 Dainippon Printing Co Ltd カラーフィルタおよびカラーフィルタの製造方法
JP4946163B2 (ja) * 2005-07-21 2012-06-06 ソニー株式会社 金属酸化物ナノ粒子の製造方法

Also Published As

Publication number Publication date
WO2009030193A1 (de) 2009-03-12
EP2185952A1 (de) 2010-05-19
DE102007052133A1 (de) 2009-03-05
US20100220396A1 (en) 2010-09-02
JP2010539521A (ja) 2010-12-16
TW200913183A (en) 2009-03-16
EP2185952B1 (de) 2018-12-12
CN101796435A (zh) 2010-08-04
CN101796435B (zh) 2015-08-19
TWI382504B (zh) 2013-01-11
US8194326B2 (en) 2012-06-05

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