TWI382504B - 光學裝置、該裝置的製造法和包括該裝置的光電組件 - Google Patents

光學裝置、該裝置的製造法和包括該裝置的光電組件 Download PDF

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Publication number
TWI382504B
TWI382504B TW097132784A TW97132784A TWI382504B TW I382504 B TWI382504 B TW I382504B TW 097132784 A TW097132784 A TW 097132784A TW 97132784 A TW97132784 A TW 97132784A TW I382504 B TWI382504 B TW I382504B
Authority
TW
Taiwan
Prior art keywords
optical device
molding compound
resin molding
surface layer
resin
Prior art date
Application number
TW097132784A
Other languages
English (en)
Chinese (zh)
Other versions
TW200913183A (en
Inventor
卡優特 葛創得
皮耶特桑卡 托爾斯坦
Original Assignee
德國歐司朗光電半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德國歐司朗光電半導體公司 filed Critical 德國歐司朗光電半導體公司
Publication of TW200913183A publication Critical patent/TW200913183A/zh
Application granted granted Critical
Publication of TWI382504B publication Critical patent/TWI382504B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW097132784A 2007-09-04 2008-08-27 光學裝置、該裝置的製造法和包括該裝置的光電組件 TWI382504B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007041889 2007-09-04
DE102007052133A DE102007052133A1 (de) 2007-09-04 2007-10-31 Optisches Bauteil, Verfahren zur Herstellung des Bauteils und optoelektronisches Bauelement mit dem Bauteil

Publications (2)

Publication Number Publication Date
TW200913183A TW200913183A (en) 2009-03-16
TWI382504B true TWI382504B (zh) 2013-01-11

Family

ID=40299222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097132784A TWI382504B (zh) 2007-09-04 2008-08-27 光學裝置、該裝置的製造法和包括該裝置的光電組件

Country Status (8)

Country Link
US (1) US8194326B2 (enExample)
EP (1) EP2185952B1 (enExample)
JP (1) JP2010539521A (enExample)
KR (1) KR20100057042A (enExample)
CN (1) CN101796435B (enExample)
DE (1) DE102007052133A1 (enExample)
TW (1) TWI382504B (enExample)
WO (1) WO2009030193A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014155247A1 (en) * 2013-03-27 2014-10-02 Koninklijke Philips N.V. Retrofit organic light emitting diode (oled) light source
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法
EP3209712A4 (en) * 2014-10-20 2018-03-28 Dow Corning Toray Co., Ltd. Optical member, optical semiconductor device, and illumination apparatus
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
DE102015103335A1 (de) 2015-03-06 2016-09-08 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183872B1 (en) * 1995-08-11 2001-02-06 Daikin Industries, Ltd. Silicon-containing organic fluoropolymers and use of the same
US20050233070A1 (en) * 2004-04-20 2005-10-20 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
US20060220532A1 (en) * 2005-03-31 2006-10-05 Seiko Epson Corporation Electrooptical apparatus and method of manufacturing electrooptical apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125319A (en) * 1976-05-03 1978-11-14 Eastman Kodak Company Active light control device
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
DE69939514D1 (de) * 1998-03-17 2008-10-23 Seiko Epson Corp Verfahren zur herstellung einer strukturierten dünnschichtvorrichtung
EP1245657B1 (en) * 1999-09-08 2006-11-08 Daikin Industries, Ltd. Fluorochemical adhesive material and layered product obtained with the same
EP1487916A4 (en) 2002-03-07 2006-05-24 Petroferm Inc DUST-REPELLING COMPOSITIONS
JP4506070B2 (ja) * 2002-11-01 2010-07-21 コニカミノルタホールディングス株式会社 防眩層の形成方法、防眩フィルムの製造方法及び防眩層形成用のインクジェット装置
DE102004019973B4 (de) * 2004-02-29 2006-07-13 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines kontaminationsgeschützten, optoelektronischen Bauelements und kontaminationsgeschütztes, optoelektronisches Bauelement
JP4496394B2 (ja) * 2004-03-31 2010-07-07 日本ゼオン株式会社 耐候性レンズ又はプリズム
JP2006285104A (ja) * 2005-04-04 2006-10-19 Dainippon Printing Co Ltd カラーフィルタおよびカラーフィルタの製造方法
JP4946163B2 (ja) * 2005-07-21 2012-06-06 ソニー株式会社 金属酸化物ナノ粒子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6183872B1 (en) * 1995-08-11 2001-02-06 Daikin Industries, Ltd. Silicon-containing organic fluoropolymers and use of the same
US20050233070A1 (en) * 2004-04-20 2005-10-20 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
US6991826B2 (en) * 2004-04-20 2006-01-31 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
US20060220532A1 (en) * 2005-03-31 2006-10-05 Seiko Epson Corporation Electrooptical apparatus and method of manufacturing electrooptical apparatus

Also Published As

Publication number Publication date
EP2185952B1 (de) 2018-12-12
CN101796435B (zh) 2015-08-19
CN101796435A (zh) 2010-08-04
EP2185952A1 (de) 2010-05-19
US8194326B2 (en) 2012-06-05
DE102007052133A1 (de) 2009-03-05
US20100220396A1 (en) 2010-09-02
WO2009030193A1 (de) 2009-03-12
JP2010539521A (ja) 2010-12-16
KR20100057042A (ko) 2010-05-28
TW200913183A (en) 2009-03-16

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