CN101796435B - 光学元件、用于制造该元件的方法以及具有该元件的光电部件 - Google Patents

光学元件、用于制造该元件的方法以及具有该元件的光电部件 Download PDF

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Publication number
CN101796435B
CN101796435B CN200880105671.7A CN200880105671A CN101796435B CN 101796435 B CN101796435 B CN 101796435B CN 200880105671 A CN200880105671 A CN 200880105671A CN 101796435 B CN101796435 B CN 101796435B
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CN
China
Prior art keywords
cured resin
optical element
shaped
optoelectronic components
lens
Prior art date
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CN200880105671.7A
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English (en)
Chinese (zh)
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CN101796435A (zh
Inventor
G·克劳特
T·皮聪卡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication date
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Publication of CN101796435A publication Critical patent/CN101796435A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN200880105671.7A 2007-09-04 2008-08-14 光学元件、用于制造该元件的方法以及具有该元件的光电部件 Active CN101796435B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102007041889 2007-09-04
DE102007041889.4 2007-09-04
DE102007052133.4 2007-10-31
DE102007052133A DE102007052133A1 (de) 2007-09-04 2007-10-31 Optisches Bauteil, Verfahren zur Herstellung des Bauteils und optoelektronisches Bauelement mit dem Bauteil
PCT/DE2008/001353 WO2009030193A1 (de) 2007-09-04 2008-08-14 Optisches bauteil, verfahren zur herstellung des bauteils und optoelektronisches bauelement mit dem bauteil

Publications (2)

Publication Number Publication Date
CN101796435A CN101796435A (zh) 2010-08-04
CN101796435B true CN101796435B (zh) 2015-08-19

Family

ID=40299222

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880105671.7A Active CN101796435B (zh) 2007-09-04 2008-08-14 光学元件、用于制造该元件的方法以及具有该元件的光电部件

Country Status (8)

Country Link
US (1) US8194326B2 (enExample)
EP (1) EP2185952B1 (enExample)
JP (1) JP2010539521A (enExample)
KR (1) KR20100057042A (enExample)
CN (1) CN101796435B (enExample)
DE (1) DE102007052133A1 (enExample)
TW (1) TWI382504B (enExample)
WO (1) WO2009030193A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014155247A1 (en) * 2013-03-27 2014-10-02 Koninklijke Philips N.V. Retrofit organic light emitting diode (oled) light source
JP2015079926A (ja) * 2013-09-10 2015-04-23 旭化成ケミカルズ株式会社 光デバイス、およびその製造方法
EP3209712A4 (en) * 2014-10-20 2018-03-28 Dow Corning Toray Co., Ltd. Optical member, optical semiconductor device, and illumination apparatus
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
DE102015103335A1 (de) 2015-03-06 2016-09-08 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649955A (zh) * 2002-03-07 2005-08-03 彼德罗弗姆公司 防尘合成物
DE102004019973A1 (de) * 2004-02-29 2005-09-15 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
CN101005125A (zh) * 1998-03-17 2007-07-25 精工爱普生株式会社 薄膜构图的衬底及其表面处理

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4125319A (en) * 1976-05-03 1978-11-14 Eastman Kodak Company Active light control device
JPS5599932A (en) * 1979-01-24 1980-07-30 Hitachi Ltd Surface treatment of organic high polymer
US6183872B1 (en) * 1995-08-11 2001-02-06 Daikin Industries, Ltd. Silicon-containing organic fluoropolymers and use of the same
EP1245657B1 (en) * 1999-09-08 2006-11-08 Daikin Industries, Ltd. Fluorochemical adhesive material and layered product obtained with the same
JP4506070B2 (ja) * 2002-11-01 2010-07-21 コニカミノルタホールディングス株式会社 防眩層の形成方法、防眩フィルムの製造方法及び防眩層形成用のインクジェット装置
JP4496394B2 (ja) * 2004-03-31 2010-07-07 日本ゼオン株式会社 耐候性レンズ又はプリズム
US6991826B2 (en) * 2004-04-20 2006-01-31 3M Innovative Properties Company Antisoiling coatings for antireflective substrates
JP4539518B2 (ja) 2005-03-31 2010-09-08 セイコーエプソン株式会社 電気光学装置及び電気光学装置の製造方法
JP2006285104A (ja) * 2005-04-04 2006-10-19 Dainippon Printing Co Ltd カラーフィルタおよびカラーフィルタの製造方法
JP4946163B2 (ja) * 2005-07-21 2012-06-06 ソニー株式会社 金属酸化物ナノ粒子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101005125A (zh) * 1998-03-17 2007-07-25 精工爱普生株式会社 薄膜构图的衬底及其表面处理
CN1649955A (zh) * 2002-03-07 2005-08-03 彼德罗弗姆公司 防尘合成物
DE102004019973A1 (de) * 2004-02-29 2005-09-15 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement

Also Published As

Publication number Publication date
EP2185952B1 (de) 2018-12-12
CN101796435A (zh) 2010-08-04
EP2185952A1 (de) 2010-05-19
US8194326B2 (en) 2012-06-05
TWI382504B (zh) 2013-01-11
DE102007052133A1 (de) 2009-03-05
US20100220396A1 (en) 2010-09-02
WO2009030193A1 (de) 2009-03-12
JP2010539521A (ja) 2010-12-16
KR20100057042A (ko) 2010-05-28
TW200913183A (en) 2009-03-16

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