JP2010538481A - 金属堆積ユニットにおいて、特に、光電池セルのための1つ以上の電子回路板を位置決めする位置決め装置 - Google Patents
金属堆積ユニットにおいて、特に、光電池セルのための1つ以上の電子回路板を位置決めする位置決め装置 Download PDFInfo
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- 238000001465 metallisation Methods 0.000 title claims description 9
- 238000004804 winding Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 230000033001 locomotion Effects 0.000 claims description 7
- MGADZUXDNSDTHW-UHFFFAOYSA-N 2H-pyran Chemical compound C1OC=CC=C1 MGADZUXDNSDTHW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 32
- 238000000151 deposition Methods 0.000 description 12
- 230000008021 deposition Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0863—Machines with a plurality of flat screens mounted on a turntable
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
- Control Of Position Or Direction (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
【選択図】 図2
Description
Claims (12)
- 動作装置(11)に対して電子回路板(12a)を位置決めする位置決め装置において、少なくとも第1の動作位置と第2の動作位置との間で選択的に回転することのできる回転部材(16)と、上記回転部材(16)に取り付けられることのできる位置決め部材(17)とを備えた位置決め装置であって、
上記位置決め部材(17)は、少なくとも、上記回転部材(16)に取り外し可能に取り付けられるフレーム(24)と、
上記電子回路板(12a)の各々が載せられるトランスピラン材料で形成されたストリップ(32)と、
を備え、
上記フレーム(24)に枢着された1対の巻取り/巻戻しローラ(30、31)の間にストリップベルト(32)が巻き取られることを特徴とする、位置決め装置。 - 上記取り外し可能なフレーム(24)は、上記取り外し可能なフレーム(24)の上記回転部材(16)へ少なくとも相互的機械及び電気接続ができるように適合された迅速取付け手段(19、20、21)を備える、請求項1に記載の位置決め装置。
- 上記迅速取付け手段は、上記取り外し可能なフレーム(24)の側部に沿って形成され且つ各アセンブリ座(18)の内側に形成された嵌合取付け溝と協働することのできる直線リブ(22)を備える機械的取付け部(19)を備える、請求項2に記載の位置決め装置。
- 上記直線リブ(22)は、上記アセンブリ座(18)に上記取り外し可能なフレーム(24)を一時的にクランプするための相対取付けピン(25)の位置決め座を画成することのできる中断部(23)を少なくとも有する、請求項3に記載の位置決め装置。
- 上記迅速取付け手段は、上記取り外し可能なフレーム(24)の前壁に取り付けられ且つ上記アセンブリ座(18)の内側に設けられた対応する電気導体によって接触させることのできる1つ以上の金属プレート(26)を備える電気的取付け部(20)を備える、請求項2から4のいずれに記載の位置決め装置。
- 上記迅速取付け手段は、上記取り外し可能なフレーム(24)の前壁に形成され且つ上記アセンブリ座(18)の内側に設けられた対応する空気圧接続部と接続することのできる1つ以上のパイプ(27)を備える空気圧的取付け部(21)を備える、請求項2から5のいずれかに記載の位置決め装置。
- 上記トランスピランストリップ(32)を上記1対の巻取り/巻戻しローラ(30、31)の周りに選択的に移動させるために、上記回転部材(16)上の所定の固定位置に取り付けられた移動手段(35)を備える、請求項2から6のいずれかに記載の位置決め装置。
- 上記移動手段(35)は、上記トランスピランストリップ(32)の移動を決定するため、上記2つの巻取り/巻戻しローラ(30、31)のうちの1つと選択的に協働させられることのできる被駆動ローラ(36)を少なくとも備える、請求項7に記載の位置決め装置。
- 上記取り外し可能なフレーム(24)は、背面照明効果を決定するため、上記トランスピランストリップ(32)の下に配置された点灯手段を備える、請求項1から8のいずれかに記載の位置決め装置。
- 上記取り外し可能なフレーム(24)は、上記トランスピランストリップ(32)と協働するように配置され且つある所定の動作位置において上記電子回路板(12a)を保持することができる吸引手段(34)を備える、請求項1から9のいずれかに記載の位置決め装置。
- 上記電子回路板は、シリコンベースのウエハである、請求項1に記載の位置決め装置。
- 金属堆積ユニットにおいて、特に光電池セルのための1つ以上の電子回路板を位置決めする位置決め装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2007A000156 | 2007-09-04 | ||
IT000156A ITUD20070156A1 (it) | 2007-09-04 | 2007-09-04 | Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo |
PCT/EP2007/063336 WO2009030284A1 (en) | 2007-09-04 | 2007-12-05 | Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit |
Publications (2)
Publication Number | Publication Date |
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JP2010538481A true JP2010538481A (ja) | 2010-12-09 |
JP5090533B2 JP5090533B2 (ja) | 2012-12-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2010523285A Expired - Fee Related JP5090533B2 (ja) | 2007-09-04 | 2007-12-05 | 位置決め装置、及び、それを用いるウエハ取り扱いまたは光電池セル製造のための装置 |
Country Status (11)
Country | Link |
---|---|
US (1) | US20100254787A1 (ja) |
EP (1) | EP2208237B2 (ja) |
JP (1) | JP5090533B2 (ja) |
KR (1) | KR20100075879A (ja) |
CN (2) | CN101971362B (ja) |
AT (1) | ATE514196T1 (ja) |
ES (1) | ES2368279T5 (ja) |
IT (1) | ITUD20070156A1 (ja) |
MY (1) | MY146210A (ja) |
TW (3) | TWI473288B (ja) |
WO (1) | WO2009030284A1 (ja) |
Cited By (2)
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JP2011501458A (ja) * | 2007-10-24 | 2011-01-06 | アプライド マテリアルズ イタリア エス. アール. エル. | 電子回路の1つ以上のプレートを金属堆積ユニットに位置決めするための位置決めデバイスおよび関連する方法 |
JP2013203546A (ja) * | 2012-03-29 | 2013-10-07 | Hirata Corp | 搬送ユニット及び搬送装置 |
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ITUD20070156A1 (it) * | 2007-09-04 | 2009-03-05 | Baccini S P A | Disositivo di posizionamento per posizionare uno o piu' wafer a base di silicio, in particolare per celle fotovoltaiche, in un'unita' di deposizione del metallo |
CN101961947B (zh) * | 2010-10-12 | 2012-12-05 | 东莞市科隆威自动化设备有限公司 | 光伏太阳能硅片印刷机 |
JP5553803B2 (ja) * | 2011-08-01 | 2014-07-16 | 株式会社日立製作所 | パネルの印刷装置 |
CN102431281B (zh) * | 2011-09-23 | 2014-01-15 | 湖南红太阳光电科技有限公司 | 一种丝网印刷机定位夹持机构 |
ITUD20120082A1 (it) * | 2012-05-09 | 2013-11-10 | Applied Materials Italia Srl | Metodo per controllare la posizione di stampa su almeno un substrato |
ITUD20120149A1 (it) * | 2012-08-31 | 2014-03-01 | Applied Materials Italia Srl | Metodo ed apparato di stampa di uno schema su un substrato |
DE102017204630A1 (de) | 2017-03-20 | 2018-09-20 | Ekra Automatisierungssysteme Gmbh | Druckvorrichtung |
JP6727568B2 (ja) * | 2018-10-16 | 2020-07-22 | 上野精機株式会社 | 電子部品搬送設備 |
CN110962442B (zh) * | 2019-12-29 | 2024-01-23 | 连城凯克斯科技有限公司 | 卷纸式硅片传输装置、硅片传输方法、转盘及丝网印刷机 |
CN116118336B (zh) * | 2023-04-05 | 2023-07-18 | 江苏龙恒新能源有限公司 | 一种用于太阳能电池硅片的印刷定位设备 |
CN116454173B (zh) * | 2023-06-16 | 2023-09-05 | 临沂鼎鑫新能源有限公司 | 一种光伏电池制备装置及其制备方法 |
CN117080295B (zh) * | 2023-07-17 | 2024-01-16 | 润达光伏盐城有限公司 | 一种光伏组件装配装置及光伏组件装配线 |
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- 2007-12-05 WO PCT/EP2007/063336 patent/WO2009030284A1/en active Application Filing
- 2007-12-05 ES ES07847831.0T patent/ES2368279T5/es active Active
- 2007-12-05 CN CN2007801014048A patent/CN101971362B/zh active Active
- 2007-12-05 EP EP07847831.0A patent/EP2208237B2/en not_active Not-in-force
- 2007-12-05 CN CN201310029513.0A patent/CN103107122B/zh active Active
- 2007-12-05 KR KR1020107007070A patent/KR20100075879A/ko not_active Application Discontinuation
- 2007-12-05 JP JP2010523285A patent/JP5090533B2/ja not_active Expired - Fee Related
- 2007-12-05 AT AT07847831T patent/ATE514196T1/de not_active IP Right Cessation
- 2007-12-05 MY MYPI2010000947A patent/MY146210A/en unknown
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- 2008-09-03 TW TW97133725A patent/TWI473288B/zh not_active IP Right Cessation
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- 2008-09-03 TW TW103144825A patent/TW201513386A/zh unknown
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JP2011501458A (ja) * | 2007-10-24 | 2011-01-06 | アプライド マテリアルズ イタリア エス. アール. エル. | 電子回路の1つ以上のプレートを金属堆積ユニットに位置決めするための位置決めデバイスおよび関連する方法 |
JP2013203546A (ja) * | 2012-03-29 | 2013-10-07 | Hirata Corp | 搬送ユニット及び搬送装置 |
US9422118B2 (en) | 2012-03-29 | 2016-08-23 | Hirata Corporation | Transport unit and transport apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP2208237B2 (en) | 2014-04-16 |
EP2208237B1 (en) | 2011-06-22 |
ATE514196T1 (de) | 2011-07-15 |
KR20100075879A (ko) | 2010-07-05 |
US20100254787A1 (en) | 2010-10-07 |
ITUD20070156A1 (it) | 2009-03-05 |
MY146210A (en) | 2012-07-31 |
ES2368279T3 (es) | 2011-11-16 |
CN101971362B (zh) | 2013-05-15 |
WO2009030284A1 (en) | 2009-03-12 |
ES2368279T5 (es) | 2014-06-04 |
TWI473288B (zh) | 2015-02-11 |
CN103107122B (zh) | 2015-11-25 |
TW201712886A (zh) | 2017-04-01 |
CN101971362A (zh) | 2011-02-09 |
TW200921927A (en) | 2009-05-16 |
JP5090533B2 (ja) | 2012-12-05 |
TWI622185B (zh) | 2018-04-21 |
CN103107122A (zh) | 2013-05-15 |
TW201513386A (zh) | 2015-04-01 |
WO2009030284A8 (en) | 2010-10-07 |
EP2208237A1 (en) | 2010-07-21 |
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