JP2010538473A - 電子部品の低温ボンディング法 - Google Patents
電子部品の低温ボンディング法 Download PDFInfo
- Publication number
- JP2010538473A JP2010538473A JP2010523159A JP2010523159A JP2010538473A JP 2010538473 A JP2010538473 A JP 2010538473A JP 2010523159 A JP2010523159 A JP 2010523159A JP 2010523159 A JP2010523159 A JP 2010523159A JP 2010538473 A JP2010538473 A JP 2010538473A
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- Japan
- Prior art keywords
- contact
- multilayer film
- bonding
- reactive multilayer
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Abstract
Description
[関連出願との相互参照]
本出願は、2007年8月31日に出願した米国仮特許出願第60/969,534号に関連し、これに基づく優先権を主張するものである。この仮特許出願をここに参照援用する。
[連邦政府出資の研究に関する陳述]
該当なし。
Claims (28)
- 少なくとも1つの電気的または熱的な伝導性を有するコンタクトを有する電子的パッケージを、ボンディング領域に配置された少なくとも1つの電気的または熱的な伝導性を有する関連するコンタクトを有する支持基板にボンディングする方法であって、
前記コンタクトの各々にボンディング材料のレイヤをコーティングする段階と、
前記電子的パッケージの前記コンタクトと、前記支持基板の前記関連するコンタクトとの間に反応性マルチレイヤ膜を配置する段階と、
ボンディング領域の前記コンタクトに圧力をかける段階と、
前記反応性マルチレイヤ膜で発熱反応を起こさせる段階であって、前記発熱反応の結果、前記電子的パッケージコンタクトと前記関連する基板コンタクトとの間に前記ボンディング材料と前記反応性マルチレイヤ膜の残存物とを含むボンドを形成する段階とを含む、
方法。 - 前記かける圧力は少なくとも1MPaである、請求項1に記載の方法。
- 前記かける圧力は1MPaと9MPaとの間であり、前記電子的パッケージを前記基板に押すようにかける、請求項2に記載の方法。
- 前記かける圧力は10MPaと100MPaとの間であり、前記電子的パッケージの前記伝導性を有するコンタクトを前記支持基板の前記関連するコンタクトに押すようにかける、請求項2に記載の方法。
- 前記ボンディング材料のレイヤはスズ合金である、請求項1に記載の方法。
- 反応性マルチレイヤ膜はスズ、鉛、インジウム、銀、Georo(登録商標)、またはIncusil(登録商標)よりなるグループから選択した金属または合金でコーティングされている、請求項1に記載の方法。
- 前記ボンディング材料の少なくとも1つのレイヤは、金、パラジウム、インジウム、Incusil(登録商標)、または銀よりなるグループから選択した金属または合金である、請求項1に記載の方法。
- 前記コンタクトの各々の間に配置した前記反応性マルチレイヤ膜のレイヤの面積は、関連する基板コンタクトの周りのハンダマスクにより画成される関連する基板コンタクトの面積より小さい、請求項1に記載の方法。
- 少なくとも1つの電子的パッケージコンタクトは、「ガルウィング」、Jリード、フラットリード、「リードレス」、及びボールグリッドアレイよりなるグループから選択した種類のものである、請求項1に記載の方法。
- スプリングまたはエラストマーを含む外部圧力源により前記圧力をかける、請求項1に記載の方法。
- 前記ボンディング材料のレイヤの各々の厚さは4μmと30μmとの間である、請求項1に記載の方法。
- 前記反応性マルチレイヤ膜の厚さは100μmより小さい、請求項1に記載の方法。
- 前記反応性マルチレイヤ膜の厚さは50μmより小さい、請求項12に記載の方法。
- 前記ボンディング材料のレイヤの各々は厚さが1μmと30μmとの間であるスズレイヤである、請求項1に記載の方法。
- 前記ボンディング領域のコンタクトエリアの大きさと、その結果の前記ボンドの望ましい剪断強さとに応じて前記かける圧力を選択する、請求項1に記載の方法。
- ボンディングされた電子的アセンブリであって、
第1のボンディング材料でコーティングされた少なくとも1つの電気的または熱的な伝導性を有するコンタクトリードを有する電子的パッケージと、
第2のボンディング材料でコーティングされた少なくとも1つの電気的または熱的な伝導性を有するコンタクトパッドを有する支持基板と、
前記第1と第2のボンディング材料により前記コンタクトリードと前記コンタクトパッドとの間に形成された少なくとも1つのボンド内に配置された反応性マルチレイヤ膜の残存物とを有する電子的アセンブリ。 - 前記第1と第2のボンディング材料はスズまたはスズ合金である、請求項16に記載のボンディングされた電子的アセンブリ。
- 前記第1と第2のボンディング材料の少なくとも一方は、金、銀、パラジウム、Georo(登録商標)、Incusil(登録商標)、またはインジウム合金から選択する、請求項16に記載のボンディングされた電子的アセンブリ。
- 電子的パッケージは少なくとも1つの発光ダイオードを含む、請求項16に記載のボンディングされた電子的アセンブリ。
- 電子的パッケージは少なくとも1つの光電池デバイスを含む、請求項16に記載のボンディングされた電子的アセンブリ。
- 支持基板は、金属コアプリント回路板、ヒートシンク、ポリマーベースプリント回路板、及びフレックス回路材料よりなるグループから選択される、請求項16に記載のボンディングされた電子的アセンブリ。
- 電子的パッケージの種類は、フリップチップ、チップオンボード、ベア・ダイ、チップスケールパッケージ、パッケージ・オン・パッケージ、ボールグリッドアレイ、ファインピッチ・ノーリード、リードレスチップキャリア、クアドフラットパック、プラスチックリードチップキャリア、フラットリード、スモールアウトラインパッケージ、DPAK、及びD2PAKよりなるグループから選択する、請求項16に記載のボンディングされた電子的アセンブリ。
- 少なくとも1つの電子的パッケージコンタクトは、「ガルウィング」、Jリード、フラットリード、「リードレス」、及びボールグリッドアレイよりなるグループから選択した種類のものである、請求項16に記載のボンディングされた電子的アセンブリ。
- 前記電子的パッケージは1つ以上の温度に敏感なコンポーネントを含む、請求項16に記載のボンディングされた電子的アセンブリ。
- ボンディング領域に配置された支持基板受け側コンタクトに少なくとも1つのコンタクトを有する温度に敏感な電子的パッケージをボンディングする方法であって、
前記電子的パッケージの前記コンタクトと、前記支持基板の前記関連する受け側コンタクトとの間に反応性マルチレイヤ膜を配置する段階と、
前記コンタクトを通して前記反応性マルチレイヤ膜のレイヤに圧力を制御してかける段階と、
前記反応性マルチレイヤ膜で発熱反応を起こさせる段階であって、前記発熱反応の結果、前記電子的パッケージコンタクトと前記関連する受け側基板コンタクトとの間に前記反応性マルチレイヤ膜の残存物を含むボンドを形成する段階とを含む、方法。 - 前記圧力をかける段階は、前記発熱反応とボンド形成の間、前記かけた圧力を維持する、請求項25に記載の方法。
- 前記発熱反応は、前記コンタクトと前記受け側コンタクトとの間に配置された1つ以上のボンディングレイヤの温度を上げて流れさせるのに十分な熱エネルギーを発生し、前記ボンドの形成中に前記1つ以上のボンディングレイヤが固化する、請求項25に記載の方法。
- 温度上昇は前記ボンディング領域に実質的に限定される、請求項27に記載の方法。
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US96953407P | 2007-08-31 | 2007-08-31 | |
PCT/US2008/074809 WO2009029804A2 (en) | 2007-08-31 | 2008-08-29 | Method for low temperature bonding of electronic components |
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US (2) | US8882301B2 (ja) |
JP (1) | JP2010538473A (ja) |
KR (1) | KR20100071968A (ja) |
DE (1) | DE112008002377T5 (ja) |
WO (1) | WO2009029804A2 (ja) |
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JP2003531758A (ja) * | 2000-05-02 | 2003-10-28 | ジョンズ ホプキンス ユニバーシティ | 反応性多層フォイルの製造方法および得られる製品 |
JP2007502214A (ja) * | 2003-05-13 | 2007-02-08 | ジョンズ ホプキンス ユニバーシティ | 反応性多層フォイルを用いて形成されるナノ構造はんだ付け又はろう付け接合部 |
JP2007511369A (ja) * | 2003-11-04 | 2007-05-10 | リアクティブ ナノテクノロジーズ,インク. | 反応性多層接合によるコンプライアント要素によって圧力を制御するための方法と装置、及びこの方法に従って接合された製品 |
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WO2009029804A3 (en) | 2009-04-30 |
US20110089462A1 (en) | 2011-04-21 |
WO2009029804A2 (en) | 2009-03-05 |
DE112008002377T5 (de) | 2010-08-26 |
KR20100071968A (ko) | 2010-06-29 |
US8882301B2 (en) | 2014-11-11 |
US20150060898A1 (en) | 2015-03-05 |
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