JP2010528871A - 半田ボール配列群を取り出して移送するための移送装置 - Google Patents
半田ボール配列群を取り出して移送するための移送装置 Download PDFInfo
- Publication number
- JP2010528871A JP2010528871A JP2010511484A JP2010511484A JP2010528871A JP 2010528871 A JP2010528871 A JP 2010528871A JP 2010511484 A JP2010511484 A JP 2010511484A JP 2010511484 A JP2010511484 A JP 2010511484A JP 2010528871 A JP2010528871 A JP 2010528871A
- Authority
- JP
- Japan
- Prior art keywords
- solder ball
- transfer
- container
- transfer device
- dispersion container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (13)
- 吸引される半田ボールを溜めておくための半田ボール分散容器(11)と、フラットな半田ボール配列群を取り出すために該分散容器と相互に連携する、負圧をかけることが可能な移送用吸引支持板(12)とを備え、前記半田ボール分散容器の底面部(14)は少なくとも1部が多孔状であり、前記移送用吸引支持板には半田ボール配列群を取り出すために所定配列に分布する開口のパターンが設けられた、半田ボール配列群(28)を取り出して移送するための半田ボール移送装置において、
前記半田ボール分散容器に超音波振動を付与させる機体(37)を備えて、該分散容器に超音波振動が付与されるようにしたことを特徴とする移送装置。 - 前記移送用吸引支持板(12)と前記半田ボール分散容器(40)の間にシール部材(42)を設けたことを特徴とする請求項1に記載の移送装置。
- 前記分散容器(40)には前記底面部(14)の下に、イオンガス(50)を供給するための供給器具(49)が割り当てられることを特徴とする請求項1又は2に記載の移送装置。
- 前記分散容器(11、40)は半田ボール繰出部(31)を介して半田ボール貯留部(20、43)に接続されることを特徴とする請求項1乃至3のいずれか1項に記載の移送装置。
- 前記半田ボール繰出部(31)は、超音波振動を付与させる機体(32、46)により超音波振動を与えることが可能な排出ノズル(21)を前記半田ボール貯留部(20、43)の下端面に設けて構成されることを特徴とする請求項4記載の移送装置。
- 前記半田ボール繰出部(31)はフレキシブル供給導管(18)を介して前記半田ボール分散容器(11、40)に接続されることを特徴とする請求湖得4又は5に記載の移送装置。
- 前記半田ボール貯留部(20、43)には前記半田ボール貯留部に負圧をかけるための減圧装置が備えられることを特徴とする請求項1乃至6のいずれか1項に記載の移送装置。
- 前記半田ボール分散容器(11、40)には、前記半田ボール繰出部(31)と相互に連携して充填レベルhを監視するためのセンサ器具が設けられることを特徴とする請求項1乃至7のいずれか1項に記載の移送装置。
- 前記センサ器具は、前記半田ボール分散容器(11、40)の充填レベルhの高さに配置された光電子境界検知器(33)であることを特徴とする請求項8記載の移送装置。
- 前記半田ボール分散容器(11、40)は、多孔状の底面部(14)と環状外周壁(13)とで形成されることを特徴とする請求項1乃至9のいずれか1項に記載の移送装置。
- 前記底面部(14)は金網で形成されることを特徴とする請求項10記載の移送装置。
- 前記シール部材は、前記外周壁(13)と前記移送用吸引支持板(12)の間に介在させたシールリング(42)であることを特徴とする請求項10又は11記載の移送装置。
- 前記シールリング(42)は前記移送用吸引支持板(12)に面する外周壁(13)の端面に配置されることを特徴とする請求項12記載の移送装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007027291A DE102007027291A1 (de) | 2007-06-11 | 2007-06-11 | Transfervorrichtung zur Aufnahme und Übergabe einer Lotkugelanordnung |
DE102007027291.1 | 2007-06-11 | ||
PCT/DE2008/000637 WO2008151588A1 (de) | 2007-06-11 | 2008-04-17 | Transfervorrichtung zur aufnahme und übergabe einer lotkugelanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010528871A true JP2010528871A (ja) | 2010-08-26 |
JP5560493B2 JP5560493B2 (ja) | 2014-07-30 |
Family
ID=39876856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010511484A Active JP5560493B2 (ja) | 2007-06-11 | 2008-04-17 | 半田ボール配列群を取り出して移送するための移送装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8328068B2 (ja) |
EP (1) | EP2155429B1 (ja) |
JP (1) | JP5560493B2 (ja) |
KR (1) | KR101558610B1 (ja) |
DE (1) | DE102007027291A1 (ja) |
WO (1) | WO2008151588A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017520408A (ja) * | 2014-07-15 | 2017-07-27 | パック テック−パッケージング テクノロジーズ ゲーエムベーハー | 超音波システムおよび圧力ラインを有するはんだボール供給装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101153920B1 (ko) | 2011-04-22 | 2012-06-08 | (주) 에스에스피 | 공기유동를 이용한 솔더볼 공급장치 |
KR101508039B1 (ko) * | 2012-05-17 | 2015-04-06 | 삼성전기주식회사 | 솔더볼 공급장치 |
DE102013110402A1 (de) | 2013-09-20 | 2015-03-26 | Smart Pac Gmbh Technology Services | Anordnung und Verfahren zum reproduzierbaren Aufbringen kleiner Flüssigkeitsmengen |
US9786308B1 (en) | 2016-06-07 | 2017-10-10 | Seagate Technology Llc | Interconnect interposer attachable to a trailing edge of a slider |
US11247285B1 (en) * | 2020-04-03 | 2022-02-15 | Seagate Technology Llc | Fluidization of agglomerated solder microspheres |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61200660U (ja) * | 1985-05-31 | 1986-12-16 | ||
JPH05208258A (ja) * | 1992-01-17 | 1993-08-20 | Nippon Steel Corp | 半田付け装置 |
JPH07153765A (ja) * | 1993-10-06 | 1995-06-16 | Nippon Steel Corp | ボール状バンプの接合方法及び接合装置 |
JPH09275109A (ja) * | 1996-04-05 | 1997-10-21 | Nippon Steel Corp | ボール搭載容器及び装置 |
JPH10275974A (ja) * | 1997-03-31 | 1998-10-13 | Ando Electric Co Ltd | 微細ボール搭載装置 |
JPH11284003A (ja) * | 1998-03-31 | 1999-10-15 | Hitachi Ltd | バンプ形成方法 |
JP2000191125A (ja) * | 1998-12-25 | 2000-07-11 | Shibuya Kogyo Co Ltd | 半田ボ―ル等の供給装置 |
JP2002043349A (ja) * | 2000-07-24 | 2002-02-08 | Shibuya Kogyo Co Ltd | ボール供給装置及びボール供給方法 |
JP2003205993A (ja) * | 2002-01-18 | 2003-07-22 | Sonotec Co Ltd | 粉体材料案内部の加振装置及び粉体材料案内部の加振方法 |
WO2006045266A1 (de) * | 2004-10-25 | 2006-05-04 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zum transfer einer lotdepotanordnung |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5680984A (en) | 1994-05-13 | 1997-10-28 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting soldering balls onto surfaces of electronic components |
US5657528A (en) | 1994-08-25 | 1997-08-19 | Matsushita Electric Industrial Co., Ltd. | Method of transferring conductive balls |
JP3164109B2 (ja) * | 1994-10-06 | 2001-05-08 | 松下電器産業株式会社 | 半田ボールの搭載装置および搭載方法 |
DE19544929C2 (de) * | 1995-12-01 | 2001-02-15 | Fraunhofer Ges Forschung | Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip |
JPH10135693A (ja) * | 1996-10-31 | 1998-05-22 | Toshiba Corp | 電子部品の検査装置 |
US6268275B1 (en) * | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
JP3654135B2 (ja) * | 1999-06-14 | 2005-06-02 | セイコーエプソン株式会社 | 導電部材の吸着器、搭載装置、吸着方法及び搭載方法並びに半導体装置の製造方法 |
JP2002025025A (ja) * | 2000-06-23 | 2002-01-25 | Internatl Business Mach Corp <Ibm> | はんだボール接合装置及びはんだボール接合方法 |
KR20060132404A (ko) * | 2005-06-18 | 2006-12-21 | 삼성테크윈 주식회사 | 솔더 볼 검사 방법, 이를 채택한 반도체 부품의 솔더 볼검사 장치, 및 반도체 부품의 솔더 볼 전달 장치 |
-
2007
- 2007-06-11 DE DE102007027291A patent/DE102007027291A1/de not_active Ceased
-
2008
- 2008-04-17 EP EP08757941A patent/EP2155429B1/de active Active
- 2008-04-17 WO PCT/DE2008/000637 patent/WO2008151588A1/de active Application Filing
- 2008-04-17 JP JP2010511484A patent/JP5560493B2/ja active Active
- 2008-04-17 US US12/663,329 patent/US8328068B2/en active Active
- 2008-04-17 KR KR1020097026383A patent/KR101558610B1/ko active IP Right Grant
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61200660U (ja) * | 1985-05-31 | 1986-12-16 | ||
JPH05208258A (ja) * | 1992-01-17 | 1993-08-20 | Nippon Steel Corp | 半田付け装置 |
JPH07153765A (ja) * | 1993-10-06 | 1995-06-16 | Nippon Steel Corp | ボール状バンプの接合方法及び接合装置 |
JPH09275109A (ja) * | 1996-04-05 | 1997-10-21 | Nippon Steel Corp | ボール搭載容器及び装置 |
JPH10275974A (ja) * | 1997-03-31 | 1998-10-13 | Ando Electric Co Ltd | 微細ボール搭載装置 |
JPH11284003A (ja) * | 1998-03-31 | 1999-10-15 | Hitachi Ltd | バンプ形成方法 |
JP2000191125A (ja) * | 1998-12-25 | 2000-07-11 | Shibuya Kogyo Co Ltd | 半田ボ―ル等の供給装置 |
JP2002043349A (ja) * | 2000-07-24 | 2002-02-08 | Shibuya Kogyo Co Ltd | ボール供給装置及びボール供給方法 |
JP2003205993A (ja) * | 2002-01-18 | 2003-07-22 | Sonotec Co Ltd | 粉体材料案内部の加振装置及び粉体材料案内部の加振方法 |
WO2006045266A1 (de) * | 2004-10-25 | 2006-05-04 | Pac Tech - Packaging Technologies Gmbh | Verfahren und vorrichtung zum transfer einer lotdepotanordnung |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017520408A (ja) * | 2014-07-15 | 2017-07-27 | パック テック−パッケージング テクノロジーズ ゲーエムベーハー | 超音波システムおよび圧力ラインを有するはんだボール供給装置 |
Also Published As
Publication number | Publication date |
---|---|
DE102007027291A1 (de) | 2008-12-18 |
EP2155429B1 (de) | 2012-05-23 |
US20100213243A1 (en) | 2010-08-26 |
US8328068B2 (en) | 2012-12-11 |
WO2008151588A1 (de) | 2008-12-18 |
JP5560493B2 (ja) | 2014-07-30 |
KR101558610B1 (ko) | 2015-10-19 |
KR20100029769A (ko) | 2010-03-17 |
EP2155429A1 (de) | 2010-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5560493B2 (ja) | 半田ボール配列群を取り出して移送するための移送装置 | |
US7618573B2 (en) | Resin sealing method for electronic part and mold used for the method | |
JP6333648B2 (ja) | 個片化物品の移送方法、製造方法及び製造装置 | |
JP2002289635A (ja) | ボール転写装置およびボール整列装置 | |
US11618094B2 (en) | Solder ball feeding device | |
JP4374875B2 (ja) | 触媒塗布装置 | |
FR2950556A1 (fr) | Procede de montage et dispositif de bridage d'une piece a travailler sur une table de travail | |
KR20150073334A (ko) | 화학 기계적 연마장치용 캐리어 헤드 및 화학 기계적 연마 장치의 제어 방법 | |
JP2004090137A (ja) | 基板ホルダーおよびそれを備える基板加工装置 | |
JP2001113485A (ja) | ウエットシートの吸着保持機構 | |
KR101550187B1 (ko) | 화학 기계적 연마 장치의 캐리어 헤드 | |
JP6444149B2 (ja) | 液体収納容器 | |
US6255132B1 (en) | Method of lining up micro-balls | |
KR102179640B1 (ko) | 핸들러 장치 | |
JP5368046B2 (ja) | ウェハの金属材料埋込装置 | |
JP2018113353A (ja) | 保持テーブルの検査方法と検査装置 | |
JP2019072776A (ja) | 板状物の保持方法 | |
JP2008062940A (ja) | 粉体の充填方法、及び粉体の充填装置 | |
KR101255743B1 (ko) | 원료 공급 유닛 및 이를 이용한 원료 공급 방법 | |
TW202115813A (zh) | 半導體材料切割裝置 | |
JP2005199682A (ja) | 液体注入装置および注入方法、カートリッジおよび液滴吐出装置 | |
WO2018150669A1 (ja) | 衝撃力測定装置、基板処理装置、衝撃力測定方法、および基板処理方法 | |
WO2000018670A1 (fr) | Dispositif et procede permettant de decharger un materiau pulverulent | |
JP2005086123A (ja) | 基板処理装置 | |
JP2019096662A (ja) | 液体供給ユニット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110408 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121012 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121023 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130117 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130124 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130215 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130222 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130319 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130328 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130419 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130508 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20131112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140312 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20140313 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140407 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140507 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140522 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5560493 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |