JP2010523007A - 電磁放射を放出するオプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造方法 - Google Patents
電磁放射を放出するオプトエレクトロニクス素子およびオプトエレクトロニクス素子の製造方法 Download PDFInfo
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Abstract
Description
Claims (20)
- ケーシングを備えた、有効放射を放出するオプトエレクトロニクス素子であって、
前記ケーシングは、基体材料とケーシング空洞とを有するケーシング基体を備え、かつ、前記有効放射に対して透過性のケーシング材料を有し、
当該オプトエレクトロニクス素子は、前記ケーシング空洞内に配置された発光ダイオードチップを有し、
前記ケーシング材料にも前記基体材料にも、該ケーシング材料および基体材料の反射率を低減するために所期のように、放射吸収性の粒子が混入されていることを特徴とする、オプトエレクトロニクス素子。 - 少なくとも1つの別の発光ダイオードチップが前記ケーシング空洞内に配置されている、請求項1記載のオプトエレクトロニクス素子。
- 前記ケーシング空洞内に、前記有効放射を散乱させるための散乱粒子が配置されている、請求項1または2記載のオプトエレクトロニクス素子。
- 前記有効放射を散乱させるための散乱粒子は、該有効放射に対して透過性の前記ケーシング材料に含まれる、請求項1から3までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記ケーシング材料および/または前記基体材料の前記放射吸収性の粒子は、前記有効放射の波長スペクトル全体および/または該波長スペクトルの少なくとも一部に対して吸収性である、請求項1から4までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記ケーシング材料および/または前記基体材料の前記放射吸収性の粒子は、前記発光ダイオードチップによって動作時に放出される波長スペクトル全体および/または該波長スペクトルの少なくとも一部に対して吸収性である、請求項1から5までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記有効放射に対して透過性の前記ケーシング材料および/または前記基体材料は、注型材料またはプレス材料を含んでいる、請求項1から6までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記有効放射に対して透過性の前記ケーシング材料は、エポキシ樹脂、アクリラート、シリコーンおよび熱可塑性プラスチックから成る群から選択された少なくとも1つの材料を含むか、または、該群から選択された少なくとも1つの材料を含むハイブリッド材料を含んでいる、請求項1から7までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記ケーシング材料および/または前記基体材料の前記放射吸収性の粒子は、カーボンブラックおよびグラファイトから成る群から選択された少なくとも1つの要素を含む、請求項1から8までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記カーボンブラックは、コンパクトな集合体構造を有する工業用カーボンブラック(LSCB,low structure carbon black)である、請求項7記載のオプトエレクトロニクス構成素子。
- 前記ケーシング材料および/または前記基体材料の前記放射吸収性の粒子は、100nm以下の平均粒子径を有している、請求項1から10までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記有効放射のスペクトル全体における前記ケーシング材料および/または前記基体材料の前記放射吸収性の粒子の吸収係数のばらつきは10%未満である、請求項1から11までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記ケーシング空洞には少なくとも部分的に、前記有効放射に対して透過性の前記ケーシング材料が充填されている、請求項1から12までのいずれか1項記載のオプトエレクトロニクス素子。
- 前記発光ダイオードチップの周囲は、前記有効放射に対して透過性のケーシング材料を用いて封止または成形されている、請求項1から13までのいずれか1項記載のオプトエレクトロニクス構成素子。
- 前記有効放射に対して透過性の前記ケーシング材料は、少なくとも部分的に、前記ケーシングボディの外側面に設けられている、請求項1から14までのいずれか1項記載のオプトエレクトロニクス構成素子。
- 有効放射を放射するオプトエレクトロニクス素子の製造方法において、
・ケーシング空洞を有し、所期のように放射吸収性の粒子が混入された基体材料を含むケーシング基体を形成するかまたは準備するステップと、
・少なくとも1つの発光ダイオードチップを準備するステップと、
・前記有効放射に対して透過性である材料であって、所期のように放射吸収性の粒子が混入された材料を準備するステップと、
・前記発光ダイオードチップを前記ケーシング空洞内に取り付けるステップと、
・前記有効放射に対して透過性の前記材料を、前記発光ダイオードチップによって動作時に放出される電磁放射の放射経路に配置するステップ
とを有することを特徴とする、製造方法。 - 前記有効放射に対して透過性の材料の少なくとも一部をケーシング空洞内に配置する、請求項16記載の製造方法。
- 前記発光ダイオードチップの周囲を、前記有効放射に対して透過性の材料によって封止または成形する、請求項17記載の製造方法。
- 前記発光ダイオードチップおよび前記ケーシング基体を含む素子を準備し、
前記有効放射に対して透過性の材料の少なくとも一部を、前記ケーシングの外側面に設ける、請求項16から18までのいずれか1項記載の製造方法。 - 前記有効放射に対して透過性の材料の少なくとも一部を、予め製造された材料層の形態で前記外側面への被着前に準備する、請求項19記載の製造方法。
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DE102007015474.9 | 2007-03-30 | ||
DE102007015474A DE102007015474A1 (de) | 2007-03-30 | 2007-03-30 | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
PCT/DE2008/000507 WO2008119327A1 (de) | 2007-03-30 | 2008-03-26 | Elektromagnetische strahlung emittierendes optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
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- 2008-03-26 WO PCT/DE2008/000507 patent/WO2008119327A1/de active Application Filing
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JP2017045773A (ja) * | 2015-08-24 | 2017-03-02 | スタンレー電気株式会社 | 発光装置 |
CN106486582A (zh) * | 2015-08-24 | 2017-03-08 | 斯坦雷电气株式会社 | 发光装置 |
KR20190042696A (ko) * | 2016-09-01 | 2019-04-24 | 루미레즈 엘엘씨 | 감온성의 낮은 굴절률 입자 층을 갖는 백색 겉보기 반도체 발광 디바이스들 |
KR102179941B1 (ko) * | 2016-09-01 | 2020-11-17 | 루미레즈 엘엘씨 | 감온성의 낮은 굴절률 입자 층을 갖는 백색 겉보기 반도체 발광 디바이스들 |
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KR20200099190A (ko) * | 2017-12-22 | 2020-08-21 | 루미레즈 엘엘씨 | 광 산란을 튜닝하기 위한 다공성 미크론 크기의 입자들 |
KR102440864B1 (ko) | 2017-12-22 | 2022-09-07 | 루미레즈 엘엘씨 | 광 산란을 튜닝하기 위한 다공성 미크론 크기의 입자들 |
JP2019204905A (ja) * | 2018-05-24 | 2019-11-28 | 大日本印刷株式会社 | 自発光型表示体 |
JP7067269B2 (ja) | 2018-05-24 | 2022-05-16 | 大日本印刷株式会社 | 自発光型表示体 |
JP7067269B6 (ja) | 2018-05-24 | 2023-12-20 | 大日本印刷株式会社 | 自発光型表示体 |
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ATE488026T1 (de) | 2010-11-15 |
US20100230694A1 (en) | 2010-09-16 |
JP5355544B2 (ja) | 2013-11-27 |
CN101675535A (zh) | 2010-03-17 |
CN101675535B (zh) | 2011-10-26 |
EP2132789A1 (de) | 2009-12-16 |
TW200845435A (en) | 2008-11-16 |
DE502008001766D1 (de) | 2010-12-23 |
WO2008119327A1 (de) | 2008-10-09 |
DE102007015474A1 (de) | 2008-10-02 |
EP2132789B1 (de) | 2010-11-10 |
TWI387131B (zh) | 2013-02-21 |
KR20090127372A (ko) | 2009-12-10 |
US8378366B2 (en) | 2013-02-19 |
KR101472153B1 (ko) | 2014-12-12 |
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