JP2010520646A5 - - Google Patents

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Publication number
JP2010520646A5
JP2010520646A5 JP2009552790A JP2009552790A JP2010520646A5 JP 2010520646 A5 JP2010520646 A5 JP 2010520646A5 JP 2009552790 A JP2009552790 A JP 2009552790A JP 2009552790 A JP2009552790 A JP 2009552790A JP 2010520646 A5 JP2010520646 A5 JP 2010520646A5
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JP
Japan
Prior art keywords
edge electrode
processing chamber
substrate
plasma processing
top edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2009552790A
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English (en)
Japanese (ja)
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JP2010520646A (ja
JP4975113B2 (ja
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Publication date
Priority claimed from US11/758,584 external-priority patent/US9184043B2/en
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Publication of JP2010520646A publication Critical patent/JP2010520646A/ja
Publication of JP2010520646A5 publication Critical patent/JP2010520646A5/ja
Application granted granted Critical
Publication of JP4975113B2 publication Critical patent/JP4975113B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009552790A 2007-03-05 2008-02-14 誘電体カバーを伴うエッジ電極 Active JP4975113B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US89306907P 2007-03-05 2007-03-05
US89307407P 2007-03-05 2007-03-05
US60/893,074 2007-03-05
US60/893,069 2007-03-05
US11/758,584 US9184043B2 (en) 2006-05-24 2007-06-05 Edge electrodes with dielectric covers
US11/758,584 2007-06-05
PCT/US2008/054027 WO2008109240A1 (en) 2007-03-05 2008-02-14 Edge electrodes with dielectric covers

Publications (3)

Publication Number Publication Date
JP2010520646A JP2010520646A (ja) 2010-06-10
JP2010520646A5 true JP2010520646A5 (enExample) 2011-04-14
JP4975113B2 JP4975113B2 (ja) 2012-07-11

Family

ID=39738668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009552790A Active JP4975113B2 (ja) 2007-03-05 2008-02-14 誘電体カバーを伴うエッジ電極

Country Status (6)

Country Link
US (2) US9184043B2 (enExample)
JP (1) JP4975113B2 (enExample)
KR (1) KR101441720B1 (enExample)
SG (1) SG179482A1 (enExample)
TW (1) TWI443737B (enExample)
WO (1) WO2008109240A1 (enExample)

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JP2021197524A (ja) 2020-06-18 2021-12-27 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
TWI888680B (zh) * 2020-12-18 2025-07-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
KR102767880B1 (ko) 2021-11-02 2025-02-17 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
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JP2025068434A (ja) * 2023-10-16 2025-04-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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